JPH0189782U - - Google Patents

Info

Publication number
JPH0189782U
JPH0189782U JP18511087U JP18511087U JPH0189782U JP H0189782 U JPH0189782 U JP H0189782U JP 18511087 U JP18511087 U JP 18511087U JP 18511087 U JP18511087 U JP 18511087U JP H0189782 U JPH0189782 U JP H0189782U
Authority
JP
Japan
Prior art keywords
dividing line
base material
dividing
wiring board
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18511087U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP18511087U priority Critical patent/JPH0189782U/ja
Publication of JPH0189782U publication Critical patent/JPH0189782U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の第1の実施例の内層面の平面
図、第2図は第1の実施例の分割後の斜視図、第
3図は本考案の第2の実施例の分割後の斜視図、
第4図及び第5図は従来の多層印刷配線板の平面
図及び分割後の斜視図である。 1……ミシン目状の孔、2,2A,2B……導
体パターン、3……中心点、4,4A〜4C……
基材、5……破断面、A……分割線。
Figure 1 is a plan view of the inner surface of the first embodiment of the present invention, Figure 2 is a perspective view of the first embodiment after division, and Figure 3 is a diagram of the second embodiment of the invention after division. A perspective view of
FIGS. 4 and 5 are a plan view and a perspective view after division of a conventional multilayer printed wiring board. 1... Perforated hole, 2, 2A, 2B... Conductor pattern, 3... Center point, 4, 4A to 4C...
Base material, 5... Fractured surface, A... Parting line.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 分割線にそつて分割される基材と、該基材の一
方の内層部に該分割線にそつて設けられた導体パ
ターンと、前記分割線上に設けられた分割用のミ
シン目状の孔とを有することを特徴とする多層印
刷配線板。
A base material to be divided along the dividing line, a conductor pattern provided along the dividing line on one inner layer of the base material, and a perforated hole for dividing provided on the dividing line. A multilayer printed wiring board characterized by having.
JP18511087U 1987-12-03 1987-12-03 Pending JPH0189782U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18511087U JPH0189782U (en) 1987-12-03 1987-12-03

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18511087U JPH0189782U (en) 1987-12-03 1987-12-03

Publications (1)

Publication Number Publication Date
JPH0189782U true JPH0189782U (en) 1989-06-13

Family

ID=31476438

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18511087U Pending JPH0189782U (en) 1987-12-03 1987-12-03

Country Status (1)

Country Link
JP (1) JPH0189782U (en)

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