JPS62172101U - - Google Patents
Info
- Publication number
- JPS62172101U JPS62172101U JP4493086U JP4493086U JPS62172101U JP S62172101 U JPS62172101 U JP S62172101U JP 4493086 U JP4493086 U JP 4493086U JP 4493086 U JP4493086 U JP 4493086U JP S62172101 U JPS62172101 U JP S62172101U
- Authority
- JP
- Japan
- Prior art keywords
- chip component
- counter electrode
- electrode
- board
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
- Coils Or Transformers For Communication (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案のチツプ部品の斜視図、第２図
は本考案のチツプ部品の基板への実装平面図、第
３図は本考案のチツプ部品の基板への実装断面図
、第４図は従来のチツプ部品の斜視図、第５図は
従来のチツプ部品の基板への実装平面図、第６図
は第５図におけるＦ１又はＦ２方向からのフロー
ソルダによるチツプ部品の基板への実装断面図、
第７図は第５図におけるＦ３方向からのフローソ
ルダによるチツプ部品の基板への実装断面図、第
８図は本考案の他の実施例を示すチツプ部品の基
板への実装断面図である。
１１……基板、１２……チツプ部品の本体、１
２ａ，１２ｂ……電極、１３……溝、１３ａ，１
３ｂ……電極に形成される溝、１３ｃ……チツプ
部品の本体に形成される溝、１４ａ，１４ｂ……
導体層、１５……接着剤、１６ａ，１６ｂ，２２
……半田、２１……リード線、Ｆ１，Ｆ２，Ｆ３
，Ｆ４……フローソルダの方向。
Figure 1 is a perspective view of the chip component of the present invention, Figure 2 is a plan view of the chip component of the present invention mounted on a board, Figure 3 is a sectional view of the chip component of the present invention mounted on a board, and Figure 4. is a perspective view of a conventional chip component, FIG. 5 is a plan view of a conventional chip component mounted on a board, and FIG. 6 is a diagram of mounting a chip component on a board using flow solder from the F1 or F2 direction in FIG. cross section,
FIG. 7 is a cross-sectional view of mounting a chip component on a board using flow soldering from the F3 direction in FIG. 5, and FIG. 8 is a cross-sectional view of mounting a chip component on a board showing another embodiment of the present invention. 11... Board, 12... Main body of chip parts, 1
2a, 12b... Electrode, 13... Groove, 13a, 1
3b...Groove formed in the electrode, 13c...Groove formed in the main body of the chip component, 14a, 14b...
Conductor layer, 15...Adhesive, 16a, 16b, 22
... Solder, 21 ... Lead wire, F 1 , F 2 , F 3
, F 4 ... Direction of flow solder.
Claims (1)
ソルダによつて半田付けされるフラツトな対向電
極を有するチツプ部品において、前記対向電極及
び本体の上面の前記電極の対向方向に連続する溝
を形成するようにしたことを特徴とするチツプ部
品。 In a chip component having a flat counter electrode that is placed on a conductor layer formed on a substrate and soldered by flow soldering, a groove is formed that continues in the direction opposite to the counter electrode and the electrode on the upper surface of the main body. A chip part characterized by being made to do.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4493086U JPS62172101U (en) | 1986-03-28 | 1986-03-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4493086U JPS62172101U (en) | 1986-03-28 | 1986-03-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62172101U true JPS62172101U (en) | 1987-10-31 |
Family
ID=30863204
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4493086U Pending JPS62172101U (en) | 1986-03-28 | 1986-03-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62172101U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011155240A1 (en) * | 2010-06-09 | 2011-12-15 | 株式会社村田製作所 | Electronic component and method of manufacturing thereof |
-
1986
- 1986-03-28 JP JP4493086U patent/JPS62172101U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011155240A1 (en) * | 2010-06-09 | 2011-12-15 | 株式会社村田製作所 | Electronic component and method of manufacturing thereof |
| JP5454684B2 (en) * | 2010-06-09 | 2014-03-26 | 株式会社村田製作所 | Electronic component and manufacturing method thereof |
| US8760256B2 (en) | 2010-06-09 | 2014-06-24 | Murata Manufacturing Co., Ltd. | Electronic component and manufacturing method thereof |