JPS62107480U - - Google Patents
Info
- Publication number
- JPS62107480U JPS62107480U JP19746185U JP19746185U JPS62107480U JP S62107480 U JPS62107480 U JP S62107480U JP 19746185 U JP19746185 U JP 19746185U JP 19746185 U JP19746185 U JP 19746185U JP S62107480 U JPS62107480 U JP S62107480U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- ceramic
- hole
- main surface
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 5
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 230000003014 reinforcing effect Effects 0.000 claims 1
- 238000005524 ceramic coating Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は部品のリード線を電極ランドに半田付
けした状態を示す本考案の１実施例の要部の断面
図、第２図はその要部の平面図、第３図は従来の
セラミツク配線基板の要部の断面図である。
１……スルーホール、２……セラミツク配線基
板、３，３′……電極ランド、４……主面、５…
…セラミツク被膜、６……外周縁部、７……リー
ド線、８……半田。
Fig. 1 is a sectional view of the main part of one embodiment of the present invention showing the state in which the lead wire of the component is soldered to the electrode land, Fig. 2 is a plan view of the main part, and Fig. 3 is the conventional ceramic wiring. FIG. 3 is a cross-sectional view of the main parts of the substrate. 1...Through hole, 2...Ceramic wiring board, 3, 3'...Electrode land, 4...Main surface, 5...
... Ceramic coating, 6 ... Outer periphery, 7 ... Lead wire, 8 ... Solder.
Claims (1)
を挿入するスルーホールと、該スルーホールを取
り囲む電極ランドを主面上に有するセラミツク配
線基板において、該両電極ランドの外周縁部を覆
うようにセラミツク配線基板の主面に基板強化用
材料で被膜を形成したことを特徴とするセラミツ
ク配線基板。 In a ceramic wiring board having an electrode land for connecting components, a through hole for inserting a lead wire of the component, and an electrode land surrounding the through hole on the main surface, the ceramic is formed so as to cover the outer periphery of both electrode lands. A ceramic wiring board characterized in that a coating is formed on the main surface of the wiring board with a material for reinforcing the board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19746185U JPS62107480U (en) | 1985-12-24 | 1985-12-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19746185U JPS62107480U (en) | 1985-12-24 | 1985-12-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62107480U true JPS62107480U (en) | 1987-07-09 |
Family
ID=31157220
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19746185U Pending JPS62107480U (en) | 1985-12-24 | 1985-12-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62107480U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59232485A (en) * | 1983-06-15 | 1984-12-27 | 株式会社日立製作所 | Thick film circuit board |
-
1985
- 1985-12-24 JP JP19746185U patent/JPS62107480U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59232485A (en) * | 1983-06-15 | 1984-12-27 | 株式会社日立製作所 | Thick film circuit board |