JPH01174960U - - Google Patents

Info

Publication number
JPH01174960U
JPH01174960U JP7120488U JP7120488U JPH01174960U JP H01174960 U JPH01174960 U JP H01174960U JP 7120488 U JP7120488 U JP 7120488U JP 7120488 U JP7120488 U JP 7120488U JP H01174960 U JPH01174960 U JP H01174960U
Authority
JP
Japan
Prior art keywords
pad
lead attachment
insulating substrate
wiring pattern
attachment pads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7120488U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7120488U priority Critical patent/JPH01174960U/ja
Publication of JPH01174960U publication Critical patent/JPH01174960U/ja
Pending legal-status Critical Current

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  • Structure Of Printed Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案に係る印刷配線板の構造例を示
す平面図、第2図は従来の印刷配線板の構造例を
示す平面図である。 1……絶縁性基板、2,2′……パツド列、2
a,2b……リード取付けパツド、3a,3b,
3c……配線パターン。
FIG. 1 is a plan view showing an example of the structure of a printed wiring board according to the present invention, and FIG. 2 is a plan view showing an example of the structure of a conventional printed wiring board. 1... Insulating substrate, 2, 2'... Pad row, 2
a, 2b...Lead attachment pad, 3a, 3b,
3c...Wiring pattern.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 絶縁性基板と、この絶縁性基板の所定面に対向
して配設されたリード取付けパツド群からなるパ
ツド列と、このパツド列中のリード取付けパツド
に一端が電気的に接続して前記絶縁性基板面上に
形成された配線パターンとを備え、前記配線パタ
ーンは所定の方向に延長され且つ延長方向に近接
するパツド列のリード取付けパツド間を通るよう
に配設形成されていることを特徴とする印刷配線
板。
An insulating substrate, a pad row consisting of a group of lead attachment pads arranged opposite to a predetermined surface of the insulating substrate, and one end of which is electrically connected to the lead attachment pad in this pad row to a wiring pattern formed on a substrate surface, the wiring pattern being arranged and formed to extend in a predetermined direction and pass between lead attachment pads of pad rows adjacent in the extension direction. Printed wiring board.
JP7120488U 1988-05-30 1988-05-30 Pending JPH01174960U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7120488U JPH01174960U (en) 1988-05-30 1988-05-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7120488U JPH01174960U (en) 1988-05-30 1988-05-30

Publications (1)

Publication Number Publication Date
JPH01174960U true JPH01174960U (en) 1989-12-13

Family

ID=31296414

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7120488U Pending JPH01174960U (en) 1988-05-30 1988-05-30

Country Status (1)

Country Link
JP (1) JPH01174960U (en)

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