JPS5820560U - printed wiring board - Google Patents
printed wiring boardInfo
- Publication number
- JPS5820560U JPS5820560U JP11545981U JP11545981U JPS5820560U JP S5820560 U JPS5820560 U JP S5820560U JP 11545981 U JP11545981 U JP 11545981U JP 11545981 U JP11545981 U JP 11545981U JP S5820560 U JPS5820560 U JP S5820560U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- electronic component
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図はこの考案の一実施例の断面図、第２図は実装状
態の断面図、第３図はプリント配線板の斜視図、第４図
および第５図は変形例の斜視図、第６図は開示技術の従
来例の斜視図、第７図はその要部断面図、第８図および
第９図は開示技術の断面図、第１０図はその部分斜視図
である。
１・・・プリント基板、２・・・モールド層、３−・・
導体、４・・・凹部、５・・・はんだペースト、６・・
・電子部品。Fig. 1 is a sectional view of an embodiment of this invention, Fig. 2 is a sectional view of the mounted state, Fig. 3 is a perspective view of a printed wiring board, Figs. 4 and 5 are perspective views of a modified example, 6 is a perspective view of a conventional example of the disclosed technique, FIG. 7 is a sectional view of a main part thereof, FIGS. 8 and 9 are sectional views of the disclosed technique, and FIG. 10 is a partial perspective view thereof. 1... Printed circuit board, 2... Mold layer, 3-...
Conductor, 4... recess, 5... solder paste, 6...
・Electronic parts.
Claims (2)
装部に凹設されて電子部品を位置決めするとともにはん
だペーストが塗り込められる凹部と、この凹部の底面に
形成されて電子部品を接続する導体とを備えたプリント
配線板。(1) A printed circuit board, a recess formed in the electronic component mounting area of the printed circuit board to position the electronic component and into which solder paste is applied, and a conductor formed on the bottom of the recess to connect the electronic component. Printed wiring board with.
記凹部は各面ごとに溶融温度の異なるはんだペーストが
塗り込められる実用新案登録請求の範囲第は）項記載の
プリント配線板。(2) The printed wiring board according to claim 1, wherein the printed circuit board has a horizontal portion and a vertical portion, and each surface of the recessed portion is filled with a solder paste having a different melting temperature.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11545981U JPS5820560U (en) | 1981-07-31 | 1981-07-31 | printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11545981U JPS5820560U (en) | 1981-07-31 | 1981-07-31 | printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5820560U true JPS5820560U (en) | 1983-02-08 |
Family
ID=29909718
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11545981U Pending JPS5820560U (en) | 1981-07-31 | 1981-07-31 | printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5820560U (en) |
-
1981
- 1981-07-31 JP JP11545981U patent/JPS5820560U/en active Pending
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