JPH0379452U - - Google Patents
Info
- Publication number
- JPH0379452U JPH0379452U JP14100189U JP14100189U JPH0379452U JP H0379452 U JPH0379452 U JP H0379452U JP 14100189 U JP14100189 U JP 14100189U JP 14100189 U JP14100189 U JP 14100189U JP H0379452 U JPH0379452 U JP H0379452U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- package
- depressions
- groove
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案実施例形状の要部破断斜視図、
第２図は同実施例電子部品の要部断面図、第３図
は従来の電子部品形状の要部破断斜視図である。
１……パツケージの樹脂封止部、２……外部リ
ード、３……はんだ、５……実装基板、６……く
ぼみ。
FIG. 1 is a cutaway perspective view of the main parts of the embodiment of the present invention;
FIG. 2 is a sectional view of the main part of the electronic component of the same embodiment, and FIG. 3 is a cutaway perspective view of the main part of the conventional electronic component shape. 1... Resin sealing part of the package, 2... External lead, 3... Solder, 5... Mounting board, 6... Recess.
Claims (1)
時にハンダ付けされる部分の表面に溝状のくぼみ
を設けた電子部品。 An electronic component that has groove-like depressions on the surface of the part where external leads led out from the package are soldered during mounting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14100189U JPH0379452U (en) | 1989-12-05 | 1989-12-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14100189U JPH0379452U (en) | 1989-12-05 | 1989-12-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0379452U true JPH0379452U (en) | 1991-08-13 |
Family
ID=31687935
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14100189U Pending JPH0379452U (en) | 1989-12-05 | 1989-12-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0379452U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5947747A (en) * | 1982-09-10 | 1984-03-17 | Hitachi Ltd | Semiconductor device |
-
1989
- 1989-12-05 JP JP14100189U patent/JPH0379452U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5947747A (en) * | 1982-09-10 | 1984-03-17 | Hitachi Ltd | Semiconductor device |
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