JPH0332461U - - Google Patents
Info
- Publication number
- JPH0332461U JPH0332461U JP9319489U JP9319489U JPH0332461U JP H0332461 U JPH0332461 U JP H0332461U JP 9319489 U JP9319489 U JP 9319489U JP 9319489 U JP9319489 U JP 9319489U JP H0332461 U JPH0332461 U JP H0332461U
- Authority
- JP
- Japan
- Prior art keywords
- item
- heat pipe
- electronic parts
- mounting board
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000005855 radiation Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の実装基板の一実施例を示す平
面図、第２図は本考案の実装基板の他の実施例を
示す断面図、第３図は本考案の実装基板を多段化
した構成を示す図、第４図は従来の実装基板を示
す図である。
１……実装基板、２……絶縁基板、３，４……
スルーホール、５……ヒートパイプ、ａ，ｂ……
電子部品。
Fig. 1 is a plan view showing one embodiment of the mounting board of the present invention, Fig. 2 is a sectional view showing another embodiment of the mounting board of the present invention, and Fig. 3 is a multi-stage mounting board of the invention. FIG. 4, a diagram showing the configuration, is a diagram showing a conventional mounting board. 1... Mounting board, 2... Insulating board, 3, 4...
Through hole, 5... Heat pipe, a, b...
electronic components.
Claims (1)
縁基板のスルーホール中に電子部品を実装後、半
田付けしたことを特徴とする実装基板。 ２ 前記絶縁基板は放熱用のヒートパイプを備え
たことを特徴とする第１項記載の実装基板。 ３ 前記ヒートパイプは外部接続用リード端子を
兼ねていることを特徴とする第２項記載の実装基
板。[Claims for Utility Model Registration] 1. A mounted board characterized in that electronic parts are mounted in through holes of an insulating board with electronic parts mounted on at least one side and then soldered. 2. The mounting board according to item 1, wherein the insulating board includes a heat pipe for heat radiation. 3. The mounting board according to item 2, wherein the heat pipe also serves as a lead terminal for external connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9319489U JPH0332461U (en) | 1989-08-08 | 1989-08-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9319489U JPH0332461U (en) | 1989-08-08 | 1989-08-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0332461U true JPH0332461U (en) | 1991-03-29 |
Family
ID=31642589
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9319489U Pending JPH0332461U (en) | 1989-08-08 | 1989-08-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0332461U (en) |
-
1989
- 1989-08-08 JP JP9319489U patent/JPH0332461U/ja active Pending