JPH0179868U - - Google Patents
Info
- Publication number
- JPH0179868U JPH0179868U JP1987176220U JP17622087U JPH0179868U JP H0179868 U JPH0179868 U JP H0179868U JP 1987176220 U JP1987176220 U JP 1987176220U JP 17622087 U JP17622087 U JP 17622087U JP H0179868 U JPH0179868 U JP H0179868U
- Authority
- JP
- Japan
- Prior art keywords
- pads
- row
- wiring board
- printed wiring
- resin pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
第1図は本考案の第一の実施例による印刷配線
板の平面図および断面図、第2図は本考案の第一
の実施例によるプリント配線板の詳細平面図、第
3図は本考案の第二の実施例によるプリント配線
板の平面図、第4図は従来例を示すプリント配線
板の平面図である。
1……表面実装型IC、2……部品リード、3
……パツド、4……ソルダレジスト、5……焦げ
、6……白色樹脂パターン。
1 is a plan view and a sectional view of a printed wiring board according to a first embodiment of the present invention, FIG. 2 is a detailed plan view of a printed wiring board according to a first embodiment of the present invention, and FIG. 3 is a detailed plan view of a printed wiring board according to a first embodiment of the present invention. FIG. 4 is a plan view of a printed wiring board showing a conventional example. 1...Surface mount IC, 2...Component lead, 3
...Padded, 4...Solder resist, 5...Burned, 6...White resin pattern.
Claims (1)
ツドの列の最も外側のパツドに近接して白色の樹
脂パターンを設けたことを特徴とするプリント配
線板。 A printed wiring board comprising a row of pads for mounting a surface-mounted IC, and a white resin pattern provided adjacent to the outermost pad of the row of pads.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987176220U JPH0179868U (en) | 1987-11-17 | 1987-11-17 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987176220U JPH0179868U (en) | 1987-11-17 | 1987-11-17 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0179868U true JPH0179868U (en) | 1989-05-29 |
Family
ID=31467965
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987176220U Pending JPH0179868U (en) | 1987-11-17 | 1987-11-17 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0179868U (en) |
-
1987
- 1987-11-17 JP JP1987176220U patent/JPH0179868U/ja active Pending