JPH01129874U - - Google Patents
Info
- Publication number
- JPH01129874U JPH01129874U JP2451888U JP2451888U JPH01129874U JP H01129874 U JPH01129874 U JP H01129874U JP 2451888 U JP2451888 U JP 2451888U JP 2451888 U JP2451888 U JP 2451888U JP H01129874 U JPH01129874 U JP H01129874U
- Authority
- JP
- Japan
- Prior art keywords
- conductor pattern
- mounting
- chip component
- pair
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
Description
第１図および第２図はそれぞれ本考案の一実施
例を示す印刷配線板の平面図およびその実装断面
図、第３図は本考案の他の実施例を示す印刷配線
板の平面図、第４図および第５図はそれぞれチツ
プ部品を表面実装する従来印刷配線板の平面図お
よびその実装断面図である。
１……スルーホール、２……導体パターン、３
，４……通り抜けパターンをもつ対パツド、５，
６……通り抜けパターンをもたない対パツド、７
……基材、８……ソルダー・レジスト、９……チ
ツプ部品、１０……接着材、１１……電極、１２
……半田、１３……ダミー導体パターン。
1 and 2 are a plan view and a cross-sectional view of a printed wiring board showing one embodiment of the present invention, respectively, and FIG. 3 is a plan view of a printed wiring board showing another embodiment of the present invention, and FIG. 4 and 5 are a plan view and a sectional view of a conventional printed wiring board on which chip components are mounted on the surface, respectively. 1...Through hole, 2...Conductor pattern, 3
, 4... vs. pad with a through pattern, 5,
6... vs. paddo without a passing pattern, 7
... Base material, 8 ... Solder resist, 9 ... Chip parts, 10 ... Adhesive material, 11 ... Electrode, 12
...Solder, 13...Dummy conductor pattern.
Claims (1)
部品実装用対パツドと通り抜け導体パターンを有
しないチツプ部品実装用対パツドを混在形成する
印刷配線板において、前記通り抜け導体パターン
を有しないチツプ部品実装用対パツドの２つのパ
ツド間に前記通り抜け導体パターンと同一配線基
準から成るダミー導体パターンが前記通り抜け導
体パターンを有する対パツド間の配線パターンと
等しくなるように配設されることを特徴とする印
刷配線板。 In a printed wiring board in which a pair pad for mounting a chip component having a through conductor pattern and a pair pad for mounting a chip component not having a through conductor pattern are mixedly formed on a base material, a pair pad for mounting a chip component not having the through conductor pattern. A printed wiring board characterized in that a dummy conductor pattern having the same wiring standard as the through-through conductor pattern is arranged between the two pads so as to be equal to the wiring pattern between the pair of pads having the through-through conductor pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2451888U JPH01129874U (en) | 1988-02-25 | 1988-02-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2451888U JPH01129874U (en) | 1988-02-25 | 1988-02-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01129874U true JPH01129874U (en) | 1989-09-04 |
Family
ID=31244432
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2451888U Pending JPH01129874U (en) | 1988-02-25 | 1988-02-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01129874U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5834763B2 (en) * | 1978-04-14 | 1983-07-28 | 横河電機株式会社 | Liquid release measurement method |
-
1988
- 1988-02-25 JP JP2451888U patent/JPH01129874U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5834763B2 (en) * | 1978-04-14 | 1983-07-28 | 横河電機株式会社 | Liquid release measurement method |