JP2016086066A - Electronic component, circuit module and circuit board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component which can be prevented from being mounted in a tilted state while suppressing reduction of a bonding strength of the electronic component and a circuit board, the circuit board and a circuit module.SOLUTION: The electronic component comprises: a component body including a mounting surface in a rectangular shape; at least one or more external electrodes which are provided on the mounting surface; and a first member and a second member which are provided on the external electrodes. Wetness of the first member and the second member with respect to a solder is lower than wetness of the external electrodes with respect to the solder. A straight line that passes an intersection of diagonals of the mounting surfaces and being in parallel with a long side of the mounting surface is a first straight line. A straight line passing the intersection of the diagonals of the mounting surface and being in parallel with a short side of the mounting surface is a second straight line. The first straight line or the second straight line passes between the first member and the second member.SELECTED DRAWING: Figure 4

Description

  The present invention relates to an electronic component, a circuit module in which the electronic component is mounted on a circuit board, and a circuit board.

  As an invention related to a conventional electronic component, for example, a land pattern for surface mounting of a bottom electrode chip component described in Patent Document 1 is known. FIG. 26 is a perspective view showing the chip component 510 and the buffer substrate 530 described in Patent Document 1. As shown in FIG.

  The chip component 510 includes two bottom electrodes 511a and 511b. The buffer substrate 530 includes two land patterns 540a and 540b. The land pattern 540a includes lands 541a and 541b. The land pattern 540b includes lands 541c and 541d. The bottom electrode 511a is connected to the lands 541a and 541b by solder, and the bottom electrode 511b is connected to the lands 541c and 541d by solder. Thereby, the chip component 510 is mounted on the buffer substrate 530. According to the surface mounting land pattern of the bottom electrode chip component described in Patent Document 1 configured as described above, the chip component 510 is suppressed from being mounted on the buffer substrate 530 in an inclined state.

  By the way, in the surface mounting land pattern of the bottom electrode chip component described in Patent Document 1, the bonding strength between the chip component 510 and the buffer substrate 530 is lowered. More specifically, the land pattern 540a is divided into lands 541a and 541b and the land pattern 540b is divided into lands 541c and 541d in order to suppress the tilting of the chip component 510. In this case, gaps are generated between the lands 541a and 541b and between the lands 541c and 541d. Accordingly, the bonding area between the bottom electrode 511a and the lands 541a and 541b is reduced, and the bonding strength thereof is reduced. Similarly, the bonding area between the bottom electrode 511b and the lands 541c and 541d becomes small, and the bonding strength between them decreases.

JP 2004-335657 A

  An object of the present invention is to provide an electronic component, a circuit board, and a circuit module that can suppress the electronic component and the circuit board from being mounted on the circuit board in a tilted state while suppressing a decrease in bonding strength between the electronic component and the circuit board. That is.

  An electronic component according to a first aspect of the present invention includes a component main body having a rectangular mounting surface, at least one or more external electrodes provided on the mounting surface, and a first provided on the external electrode. 1 and a second member, and the wettability of the first member and the second member to the solder is lower than the wettability of the external electrode to the solder, and the diagonal of the mounting surface A straight line passing through the intersection of the mounting surface and parallel to the long side of the mounting surface is the first straight line, passing through the intersection of the diagonal lines of the mounting surface and parallel to the short side of the mounting surface. It is a second straight line, and the first straight line or the second straight line passes between the first member and the second member.

  A circuit module according to a second aspect of the present invention includes the electronic component and a circuit board, and the circuit board includes a board body having a first main surface, and the first main surface. A third external electrode and a fourth external electrode, wherein the first external electrode and the third external electrode are connected by solder, and the second external electrode and the The fourth external electrode is connected with solder.

  A circuit board according to a third aspect of the present invention includes a substrate body having a main surface including a rectangular mounting area on which electronic components are mounted, at least one or more external electrodes provided in the mounting area, A fifth member and a sixth member provided on the external electrode, and the wettability of the fifth member and the sixth member with respect to the solder is wet with respect to the solder of the external electrode. A straight line parallel to the long side of the mounting area is a third straight line, passes through the diagonal intersection of the mounting area, and The straight line parallel to the short side of the mounting area is the fourth straight line, and the third straight line or the fourth straight line passes between the fifth member and the sixth member. It is characterized by.

  A circuit board according to a fourth embodiment of the present invention is provided on a substrate body having a rectangular main surface, at least one or more external electrodes provided on the main surface, and the external electrodes. A seventh member and an eighth member, and the wettability of the seventh member and the eighth member with respect to the solder is lower than the wettability of the external electrode with respect to the solder, A straight line passing through the intersection of diagonal lines and parallel to the long side of the main surface is the fifth straight line, passing through the intersection of diagonal lines of the main surface and parallel to the short side of the main surface Is a sixth straight line, and the fifth straight line or the sixth straight line passes between the seventh member and the eighth member.

  ADVANTAGE OF THE INVENTION According to this invention, it can suppress that an electronic component is mounted in a circuit board in the inclined state, suppressing the fall of the joint strength of an electronic component and a circuit board.

1 is an external perspective view of a vibrating device 10. FIG. 3 is an exploded perspective view of the vibration device 10. FIG. FIG. 2 is a cross-sectional structural view taken along the line AA of FIG. 3 is a plan view of a chip component 18. FIG. FIG. 5 is a perspective view of the chip components 18 and 19 and the temperature sensitive component 20 when mounted. FIG. 5 is a perspective view of the chip components 18 and 19 and the temperature sensitive component 20 when mounted. FIG. 10 is a cross-sectional structure diagram when a chip component 118 according to a comparative example is inclined in a reflow process. FIG. 6 is a cross-sectional structure diagram when a chip component 18 is tilted in a reflow process. It is the figure which planarly viewed the chip component 18 from the upper side. It is the figure which planarly viewed the chip component 18 from the front side. It is the figure which planarly viewed the ceramic substrate 12 from the lower side. It is the graph which showed the experimental result. It is the graph which showed the experimental result. It is the figure which planarly viewed the chip component 18a from the upper side. It is the figure which planarly viewed chip component 18b from the upper side. It is the figure which planarly viewed the chip component 18c from the upper side. It is the figure which planarly viewed chip component 18d from the upper side. It is the figure which planarly viewed the chip component 18e from the upper side. It is the figure which planarly viewed chip component 18f from the upper side. It is the figure which planarly viewed chip component 18g from the upper side. It is an external appearance perspective view of the chip component 18h. It is the figure which planarly viewed chip component 18h from the upper side. It is the figure which planarly viewed chip component 18i from the upper side. It is an external appearance perspective view of the ceramic substrate 12a. It is an external appearance perspective view of the ceramic substrate 12b which concerns on other embodiment. 10 is a perspective view showing a chip component 510 and a buffer substrate 530 described in Patent Document 1. FIG.

(Structure of vibration device)
Hereinafter, a vibration device including a chip component according to an embodiment of an electronic component of the present invention will be described with reference to the drawings. FIG. 1 is an external perspective view of the vibration device 10. FIG. 2 is an exploded perspective view of the vibration device 10. FIG. 3 is a sectional structural view taken along line AA of FIG. FIG. 4 is a plan view of the chip component 18. In the following, the normal direction to the main surface of the vibration device 10 is defined as the vertical direction, and when viewed from above, the direction in which the long side of the vibration device 10 extends is defined as the left-right direction. The direction in which the short side extends is defined as the front-rear direction.

  As shown in FIGS. 1 to 3, the vibration device 10 is a circuit module including a ceramic substrate 12, a metal cap 14, a crystal piece 16, chip components 18 and 19, and a temperature-sensitive component 20. This is a compensated crystal oscillator.

  The ceramic substrate 12 (an example of a circuit board) includes a substrate body 21, external electrodes 22, 26, 30, 34, 36, 40, 42, 44, wirings 24, 28, 32, 38, and via-hole conductors v1, v2. Yes. The substrate body 21 is a flat plate having a rectangular shape when viewed from above. The substrate body 21 includes, for example, an aluminum oxide sintered body, a mullite sintered body, an aluminum nitride sintered body, a silicon carbide sintered body, a ceramic insulating material such as a glass ceramic sintered body, crystal, glass It is made of silicon or the like. The upper main surface of the substrate body 21 is referred to as a front surface, and the lower main surface of the substrate body 21 is referred to as a back surface.

  The external electrode 22 is a square conductor layer provided near the left rear corner of the surface of the substrate body 21. The external electrode 26 is a square conductor layer provided near the front left corner of the surface of the substrate body 21. The external electrode 22 and the external electrode 26 are arranged in the front-rear direction.

  The external electrode 30 is a rectangular conductor layer provided on the rear side with respect to the center of the back surface of the substrate body 21 (intersection of diagonal lines). The external electrode 36 is a rectangular conductor layer provided on the front side with respect to the center of the back surface of the substrate body 21 (intersection of diagonal lines). The external electrode 30 and the external electrode 36 are arranged in the front-rear direction.

  The external electrode 34 is a square conductor layer provided near the right rear corner of the back surface of the substrate body 21. The external electrode 40 is a square conductor layer provided near the left front corner of the back surface of the substrate body 21. The external electrode 42 is a square conductor layer provided near the left rear corner of the back surface of the substrate body 21. The external electrode 44 is a square conductor layer provided near the right front corner of the back surface of the substrate body 21.

  The wiring 24 is a linear conductor layer provided on the surface of the substrate body 21 and extending from the external electrode 22 toward the left side. The left end of the wiring 24 overlaps the external electrode 42 when viewed from above. The wiring 28 is a linear conductor layer that extends from the external electrode 26 to the front side and then extends to the right side. The right end of the wiring 28 overlaps the external electrode 44 when viewed from above.

  The wiring 38 is a linear conductor layer that is provided on the back surface of the substrate body 21 and connects the external electrode 36 and the external electrode 40. The wiring 32 is a linear conductor layer that is provided on the back surface of the substrate body 21 and connects the external electrode 30 and the external electrode 34.

  The external electrodes 22, 26, 30, 34, 36, 40, 42, 44 and the wirings 24, 28, 32, 38 are plated with a metallized layer such as tungsten or molybdenum with a film such as nickel or gold It is produced by doing.

  The via-hole conductor v <b> 1 passes through the substrate body 21 in the vertical direction, and connects the left end of the wiring 24 and the external electrode 42. Thereby, the external electrode 22 and the external electrode 42 are electrically connected.

  The via-hole conductor v <b> 2 passes through the substrate body 21 in the vertical direction, and connects the right end of the wiring 28 and the external electrode 44. Thereby, the external electrode 26 and the external electrode 44 are electrically connected.

  The via hole conductors v <b> 1 and v <b> 2 are produced by burying a conductor such as tungsten or nickel in a via hole formed in the substrate body 21.

  The crystal piece 16 includes a crystal body 17 and external electrodes 97 and 98. The crystal body 17 is a flat plate having a rectangular shape when viewed from above. The crystal body 17 is, for example, an AT cut type cut out from a rough crystal or the like at a predetermined angle. The upper main surface of the crystal body 17 is referred to as the front surface, and the lower main surface of the crystal body 17 is referred to as the back surface.

  The external electrode 97 is a square conductor layer provided near the left rear corner of the back surface of the crystal body 17. The external electrode 98 is a square conductor layer provided near the left front corner of the back surface of the crystal body 17. The external electrodes 97 and 98 are produced, for example, by laminating gold on a chromium underlayer.

  The crystal piece 16 includes configurations other than the crystal body 17 and the external electrodes 97 and 98. However, since the crystal piece 16 has the same structure as a general crystal piece, detailed description thereof is omitted.

  The crystal piece 16 is mounted on the surface of the ceramic substrate 12. Specifically, the external electrode 22 and the external electrode 97 are connected by the conductive adhesive 210, and the external electrode 26 and the external electrode 98 are connected by the conductive adhesive 212.

  The metal cap 14 is a rectangular parallelepiped box whose lower side is opened, and is made of, for example, iron-nickel alloy, specifically 42Ni. The metal cap 14 is attached on the surface of the substrate body 21 and covers and hides the entire surface of the substrate body 21. Thereby, the crystal piece 16 is accommodated in a space surrounded by the metal cap 14 and the surface of the substrate body 21. The space is kept in a vacuum state by the metal cap 14 being in close contact with the substrate body 21.

  The temperature-sensitive component 20 is a thermistor that functions as a temperature sensor. In this embodiment, the temperature-sensitive component 20 is an NTC (Negative Temperature Coefficient) thermistor. The temperature sensitive component 20 includes a chip body 70 and external electrodes 72 and 74.

  The chip body 70 has a rectangular parallelepiped shape. The external electrode 72 covers the rear surface of the chip body 70 and is folded back to the upper surface, the lower surface, the right surface, and the left surface adjacent to the rear surface. The external electrode 74 covers the front surface of the chip body 70 and is folded back to the upper surface, the lower surface, the right surface, and the left surface adjacent to the front surface.

  The temperature sensitive component 20 is mounted on the back surface of the ceramic substrate 12. Specifically, the external electrode 72 and the external electrode 30 are connected by solder, and the external electrode 74 and the external electrode 36 are connected by solder. The temperature sensitive component 20 as described above detects the temperature in the vicinity of the crystal piece 16 and outputs it to a temperature compensation circuit (not shown). Thereby, the correction of the frequency fluctuation accompanying the temperature change of the crystal piece 16 is performed.

  The chip component 18 includes a component main body 50, external electrodes 52, 54, 56, and 58, solder resists 60, 62, 64, and 66, and via-hole conductors v3 and v4.

  The component main body 50 has a rectangular parallelepiped shape and is made of an insulating material. In the present embodiment, the component main body 50 is a glass epoxy board. Further, the vertical height of the component body 50 is higher than the vertical height of the temperature-sensitive component 20. Hereinafter, the upper main surface of the component main body 50 is referred to as a front surface, and the lower main surface of the component main body 50 is referred to as a back surface. The surface of the component body 50 is a mounting surface S that faces the ceramic substrate 12 when the chip component 18 is mounted on the ceramic substrate 12. The mounting surface S has a rectangular shape.

  Here, as shown in FIG. 4, an intersection of diagonal lines of the mounting surface S is defined as an intersection P. A straight line passing through the intersection P and parallel to the long side of the mounting surface S is defined as a straight line L1. A straight line passing through the intersection P and parallel to the short side of the mounting surface S is defined as a straight line L2.

  The external electrode 52 (an example of the first external electrode) is a square conductor layer provided on the back half of the surface of the component body 50. The external electrode 54 (an example of a second external electrode) is a square conductor layer provided on the front half of the surface of the component main body 50. Accordingly, the straight line L2 passes between the external electrode 52 and the external electrode 54. Further, the external electrode 52 and the external electrode 54 are in a line symmetric relationship with respect to the straight line L2.

  The solder resist 60 (an example of the first member) and the solder resist 62 (an example of the second member) are insulating films provided on the external electrode 52 and the mounting surface S. The wettability of the solder resists 60 and 62 with respect to the solder is lower than the wettability of the external electrode 52 with respect to the solder. In the present embodiment, the solder resists 60 and 62 are made of a material that repels solder. In the present embodiment, the solder resists 60 and 62 are made of an epoxy resin. The solder resist 60 has a rectangular shape, and extends in the left-right direction so as to intersect the side at the midpoint of the left side of the external electrode 52. The solder resist 62 has a rectangular shape, and extends in the left-right direction so as to intersect the side at the midpoint of the right side of the external electrode 52. As a result, the straight line L <b> 1 passes between the solder resist 60 and the solder resist 62. Further, the solder resist 60 and the solder resist 62 are in a line symmetric relationship with respect to the straight line L1.

  The solder resist 64 (an example of the third member) and the solder resist 66 (an example of the fourth member) are insulating films provided on the external electrode 54 and the mounting surface S. The wettability of the solder resists 64 and 66 with respect to the solder is lower than the wettability of the external electrode 54 with respect to the solder. In the present embodiment, the solder resists 64 and 66 are made of an epoxy resin. The solder resist 64 has a rectangular shape, and extends in the left-right direction so as to intersect the side at the midpoint of the left side of the external electrode 54. The solder resist 66 has a rectangular shape, and extends in the left-right direction so as to intersect the side at the midpoint of the right side of the external electrode 54. Thereby, the straight line L <b> 1 passes between the solder resist 64 and the solder resist 66. Further, the solder resist 64 and the solder resist 66 are in a line symmetric relationship with respect to the straight line L1.

  Further, the straight line L2 passes between the solder resists 60 and 62 and the solder resists 64 and 66. Furthermore, the solder resist 60 and the solder resist 64 are in a line symmetric relationship with respect to the straight line L2. The solder resist 62 and the solder resist 66 are in a line symmetric relationship with respect to the straight line L2.

  The external electrode 56 is a square conductor layer provided on the back half of the back surface of the component body 50. The external electrode 58 is a square conductor layer provided in the front half of the back surface of the component body 50. The external electrodes 52, 54, 56, and 58 are produced by, for example, performing Ni plating and Au plating on a base electrode made of Cu.

  The via-hole conductor v <b> 3 penetrates the component main body 50 in the vertical direction, and connects the external electrode 52 and the external electrode 56. Thereby, the external electrode 52 and the external electrode 56 are electrically connected.

  The via-hole conductor v4 passes through the component main body 50 in the vertical direction, and connects the external electrode 54 and the external electrode 58. Thereby, the external electrode 54 and the external electrode 58 are electrically connected. The via hole conductors v3 and v4 are produced, for example, by filling a via hole provided in the component main body 50 with a conductive material such as Cu.

  The chip component 18 is mounted on the back surface of the ceramic substrate 12. Specifically, the external electrode 34 and the external electrode 52 are connected by solder, and the external electrode 44 and the external electrode 54 are connected by solder.

  Since the chip component 19 has the same structure as the chip component 18, the description thereof is omitted. The chip component 19 is mounted on the back surface of the ceramic substrate 12. Specifically, the external electrode 42 and the external electrode 82 are connected by solder, and the external electrode 40 and the external electrode 84 are connected by solder.

  In the vibration device 10, the temperature sensitive component 20 is mounted on the back surface of the ceramic substrate 12. Therefore, when the vibration device 10 is mounted on the mother board, the temperature sensitive component 20 becomes an obstacle, and the external electrodes 34, 40, 42, and 44 of the ceramic board 12 and the external electrodes of the mother board are directly connected. Can not do it. Therefore, chip parts 18 and 19 are mounted on the back surface of the ceramic substrate 12. Thereby, the external electrodes 34, 40, 42, 44 and the external electrodes of the mother board are electrically connected via the chip components 18, 19.

  In the vibrating device 10 configured as described above, a transmission signal is output from the external electrodes 58 and 86. A ground potential is connected to the external electrode 56. A detection signal of the temperature sensitive component 20 is output from the external electrode 88.

(Mounting of chip parts and temperature sensitive parts)
Next, mounting of the chip components 18 and 19 and the temperature sensitive component 20 will be described with reference to the drawings. 5 and 6 are perspective views when the chip components 18 and 19 and the temperature sensitive component 20 are mounted.

  First, as shown in FIG. 5, solder is printed on the external electrodes 30, 34, 36, 40, 42 and 44. Next, as shown in FIG. 6, the chip components 18 and 19 and the temperature sensitive component 20 are mounted on the external electrodes 30, 34, 36, 40, 42 and 44 on which the solder is printed. Thereafter, the chip components 18 and 19 and the temperature sensitive component 20 are fixed on the back surface of the ceramic substrate 12 by a reflow process. Specifically, the solder is melted by heating the solder to a temperature equal to or higher than the melting point. Thereafter, the solder is solidified by cooling the solder. Thereby, the external electrode 34 and the external electrode 52 are connected by solder, and the external electrode 44 and the external electrode 54 are connected by solder. Furthermore, the external electrode 42 and the external electrode 82 are connected by solder, and the external electrode 40 and the external electrode 84 are connected by solder. Further, the external electrode 30 and the external electrode 72 are connected by solder, and the external electrode 36 and the external electrode 74 are connected by solder.

(effect)
According to the chip component 18 and the vibration device 10 configured as described above, the chip component 18 is suppressed from being mounted on the ceramic substrate 12 in an inclined state. FIG. 7 is a cross-sectional structure diagram when the chip component 118 according to the comparative example is inclined in the reflow process. The chip component 118 according to the comparative example is different from the chip component 18 only in that the solder resists 60, 62, 64, 66 are not provided. FIG. 8 is a cross-sectional structure diagram when the chip component 18 is tilted in the reflow process. 7 and 8, the vibrating device 10 is shown upside down.

  When the chip component 118 is mounted on the ceramic substrate 12, a reflow process is performed. In the reflow process, the solder is heated and melted. At this time, the chip component 118 is floated on the liquid solder. For this reason, a slight impact is applied to the chip component 118 and the ceramic substrate 12, or the chip component 118 is rotated about the axis Ax1 as shown in FIG. The axis Ax1 is a straight line that passes through the center of gravity of the chip component 118 and is parallel to the straight line L1.

  However, as shown in FIG. 7, when the chip component 118 is rotated counterclockwise around the axis Ax1 when viewed from the front side, the shape of the solder surface is different on the left and right. Therefore, a difference is generated between the magnitude of the surface tension generated on the left surface A12 of the solder and the magnitude of the surface tension generated on the right surface A11 of the solder. Due to this difference in surface tension, the tilt of the chip component 118 is corrected.

  However, in FIG. 7, the inclination of the chip component 118 may not be corrected. More specifically, in the chip component 118, the solder spreads over the entire lower surface of the external electrode 54. As described above, a portion where the solder spreads on the external electrode 54 cannot transmit a large force to the external electrode 54. Therefore, when the solder is cooled and solidified without correcting the tilt of the chip component 118, the chip component 118 is mounted on the ceramic substrate 12 in a state of being rotated about the axis Ax1 (that is, tilted).

  Therefore, the solder resists 64 and 66 are provided in the chip component 18 as shown in FIG. The straight line L1 passes between the solder resists 64 and 66. For this reason, the axis Ax1 passes between the solder resists 64 and 66 when viewed from below. The wettability of the solder resists 64 and 66 is lower than the wettability of the external electrode 54. For this reason, the solder contacts the external electrode 54 but does not contact the solder resists 64 and 66. That is, the solder forms a surface under the solder resists 64 and 66. Therefore, the solder resist 66 is pushed up by the left surface A2 of the solder. Since surface tension acts on the surface of the solder, the surface of the solder is less likely to be deformed than inside the solder. Therefore, the force transmitted to the solder resist 66 by the solder surface A2 is larger than the force transmitted to the external electrode 54 by the portion where the solder in FIG. That is, the force by which the solder surface A2 pushes up the solder resist 66 is greater than the force by which the portion of the solder in FIG. Thus, the force for rotating the chip component 18 clockwise about the axis Ax1 in FIG. 8 is larger than the force for rotating the chip component 118 clockwise about the axis Ax1 in FIG. As a result, the tilt of the chip component 18 is corrected more than the tilt of the chip component 118. As described above, the chip component 18 is suppressed from being mounted on the ceramic substrate 12 in a state where the chip component 18 is rotated about the axis Ax1 (that is, in a tilted state). Further, the same phenomenon as that of the external electrodes 44 and 54 and the solder resists 64 and 66 occurs in the external electrodes 34 and 52 and the solder resists 60 and 62. Further, the same can be said for the chip component 19 as with the chip component 18.

  Further, in the chip component 18, the solder resist 60 and the solder resist 62 are in a line-symmetric relationship with respect to the straight line L1, and the solder resist 64 and the solder resist 66 are in a line-symmetric relationship with respect to the straight line L1. Therefore, when the chip component 18 rotates clockwise about the axis Ax1, the magnitude of the force by which the solder rotates the chip component 18 counterclockwise, and the chip component 18 rotates counterclockwise about the axis Ax1. In this case, the magnitude of the force that causes the solder to rotate the chip component 18 clockwise can be made closer. Therefore, it is more effectively suppressed that the chip component 18 is mounted on the ceramic substrate 12 in a state where the chip component 18 is rotated about the axis Ax1 (that is, in an inclined state).

  Further, according to the chip component 18, it is not necessary to divide the external electrodes 34 and 44 by providing the solder resists 60, 62, 64 and 66. Therefore, it is possible to suppress the opposing area between the external electrode 34 and the external electrode 52 and the opposing area between the external electrode 44 and the external electrode 54 from being reduced, and to suppress a reduction in the bonding strength thereof. As a result, a decrease in the bonding strength between the chip component 18 and the ceramic substrate 12 is suppressed. The same applies to the chip component 19 as the chip component 18.

  Here, in order to clarify the effect which the chip components 18 and 19 and the vibration device 10 show | play, this inventor performed the experiment demonstrated below. Specifically, 60 chip components 118 according to the comparative example (hereinafter referred to as the first sample) and 60 chip components 18 according to the examples (hereinafter referred to as the second sample) are produced and mounted on the ceramic substrate 12. did. Then, as shown in FIGS. 7 and 8, the amount of inclination D when viewed in plan from the front side was measured with a measuring microscope (STM-6 manufactured by Olympus). The experimental conditions are shown below. FIG. 9 is a plan view of the chip component 18 from above. FIG. 10 is a plan view of the chip component 18 from the front side. FIG. 11 is a plan view of the ceramic substrate 12 as viewed from below.

a1: 1600 μm
a2: 700 μm
a3: 450 μm
a4: 450 μm
a5: 500 μm
a6: 75 μm
a7: 200 μm
a8: 30 μm
a9: 20 μm
a10: 200 μm
b1: 1600 μm
b2: 2000 μm
b3: 450 μm
b4: 450 μm
b5: 500 μm

  The external electrodes 52 and 54 were formed by forming a nickel film having a thickness of 5 μm, a palladium film having a thickness of 0.1 μm, and a gold film having a thickness of 0.1 μm on a copper base electrode. The external electrodes 34 and 44 were formed by forming a nickel film having a thickness of 5 μm and a gold film having a thickness of 0.5 μm on a molybdenum base electrode.

  FIG. 12 is a graph showing experimental results. According to FIG. 12, in the first sample, the amount of inclination was distributed in the range of 0 μm to 70 μm, and the average value of the amount of inclination was about 35 μm. On the other hand, in the second sample, the amount of inclination was distributed between 0 μm and 20 μm, and the average value of the amount of inclination was about 6 μm. Therefore, according to this experiment, it can be seen that mounting the chip component 18 in an inclined state is suppressed.

  Next, the inventor of the present application produced ten chip components each having a slit extending in the front-rear direction at the center in the left-right direction of the external electrodes 52, 54 of the chip component 118, and used as a third sample. The width of the slit is 200 μm. Further, a3 and a4 of the external electrodes 52 and 54 of the third sample are 500 μm and 600 μm, respectively. There is no change in the size of each part of the second sample. The second sample and the third sample were mounted on the ceramic substrate 12, and the second sample and the third sample were pushed from the long side. Then, the magnitude of the force when the second sample is detached from the ceramic substrate 12 (shear fracture strength) and the magnitude of the force when the third sample is detached from the ceramic substrate 12 (shear fracture strength) are respectively The bonding strength between the sample and the ceramic substrate 12 and the bonding strength between the third sample and the ceramic substrate 12 were used. A bond tester (Series 4000 manufactured by Dage) was used for measuring the bonding strength. The test speed was 500 μm / s.

  FIG. 13 is a graph showing experimental results. In the second sample, the shear fracture strength was distributed between 40N and 55N, and the average value of the shear fracture strength was about 50N. On the other hand, in the third sample, the shear fracture strength was distributed between 70 N and 100 N, and the average value of the shear fracture strength was about 80 N. Therefore, according to this experiment, it can be seen that the bonding strength between the chip component 18 and the ceramic substrate 12 is improved.

(First modification)
Hereinafter, a chip component 18a according to a first modification will be described with reference to the drawings. FIG. 14 is a plan view of the chip component 18a from above.

  The chip component 18a differs from the chip component 18 in the presence or absence of the solder resists 64 and 66 and the positions of the solder resists 60 and 62. Specifically, the chip component 18 a does not include the solder resists 64 and 66. The solder resist 60 is provided at the left rear corner of the external electrode 52, and the solder resist 62 is provided at the right rear corner of the external electrode 52.

  According to the chip component 18a configured as described above, the chip component 18a is suppressed from being mounted on the ceramic substrate 12 in a state where the chip component 18a is rotated about the axis Ax1 (that is, in an inclined state).

(Second modification)
Hereinafter, a chip component 18b according to a second modification will be described with reference to the drawings. FIG. 15 is a plan view of the chip component 18b from above.

  The chip component 18 b is different from the chip component 18 in the shapes of the solder resists 60, 62, 64 and 66. Specifically, the solder resists 60, 62, 64, 66 have a square shape when viewed from above. Further, the solder resists 60 and 62 do not protrude from the external electrode 52, and the solder resists 64 and 66 do not protrude from the external electrode 54.

  According to the chip component 18b configured as described above, the chip component 18b is suppressed from being mounted on the ceramic substrate 12 in a state of being rotated about the axis Ax1 (that is, in an inclined state).

  The solder resists 60, 62, 64, 66 may be circular or elliptical.

(Third Modification)
Hereinafter, a chip component 18c according to a third modification will be described with reference to the drawings. FIG. 16 is a plan view of the chip part 18c from above.

  The chip part 18 c is different from the chip part 18 in the positions of the solder resists 60, 62, 64, 66. The solder resist 60 is provided at the left rear corner of the external electrode 52, and the solder resist 62 is provided at the right rear corner of the external electrode 52. The solder resist 64 is provided at the left front corner of the external electrode 54, and the solder resist 66 is provided at the right front corner of the external electrode 54.

  According to the chip component 18c configured as described above, the chip component 18c is suppressed from being mounted on the ceramic substrate 12 in a state of being rotated about the axis Ax1 (that is, in an inclined state).

(Fourth modification)
Hereinafter, a chip component 18d according to a fourth modification will be described with reference to the drawings. FIG. 17 is a plan view of the chip component 18d from above.

  The chip component 18d is different from the chip component 18c in that it further includes solder resists 160, 162, 164, and 166. The solder resist 160 is provided at the left front corner of the external electrode 52, and the solder resist 162 is provided at the right front corner of the external electrode 52. The solder resist 164 is provided at the left rear corner of the external electrode 54, and the solder resist 166 is provided at the right rear corner of the external electrode 54.

  According to the chip component 18d configured as described above, the chip component 18d is suppressed from being mounted on the ceramic substrate 12 in a state of being rotated about the axis Ax1 (that is, in an inclined state).

(Fifth modification)
Hereinafter, a chip component 18e according to a fifth modification will be described with reference to the drawings. FIG. 18 is a plan view of the chip part 18e from above.

  The chip part 18 e is different from the chip part 18 in the shapes of the solder resists 60, 62, 64, 66. The solder resist 60 extends along the left side of the external electrode 52, and the solder resist 62 extends along the right side of the external electrode 52. The solder resist 64 extends along the left side of the external electrode 54, and the solder resist 66 extends along the right side of the external electrode 54.

  According to the chip component 18e configured as described above, the chip component 18e is suppressed from being mounted on the ceramic substrate 12 in a state of being rotated about the axis Ax1 (that is, in an inclined state).

(Sixth Modification)
Hereinafter, a chip component 18f according to a sixth modification will be described with reference to the drawings. FIG. 19 is a plan view of the chip component 18f from above.

  The chip part 18 f is different from the chip part 18 in the positions of the solder resists 60, 62, 64, 66. The solder resist 60 is provided at the left front corner of the external electrode 52, and the solder resist 62 is provided at the right rear corner of the external electrode 52. The solder resist 64 is provided at the left front corner of the external electrode 54, and the solder resist 66 is provided at the right rear corner of the external electrode 54.

  According to the chip component 18f configured as described above, the chip component 18f is suppressed from being mounted on the ceramic substrate 12 in a state of being rotated about the axis Ax1 (that is, in an inclined state).

(Seventh Modification)
Hereinafter, a chip component 18g according to a seventh modification will be described with reference to the drawings. FIG. 20 is a plan view of the chip component 18g from above.

  The chip component 18g is different from the chip component 18f in the presence or absence of the solder resists 60 and 66. The chip component 18g does not include the solder resists 60 and 66.

  In the chip part 18g configured as described above, both the straight lines L1 and L2 pass between the solder resist 62 and the solder resist 64. Therefore, according to the chip component 18g, the chip component 18g is suppressed from being mounted on the ceramic substrate 12 in a state where the chip component 18g is rotated about the axis Ax1 (that is, in an inclined state).

(Eighth modification)
Hereinafter, a chip component 18h according to an eighth modification will be described with reference to the drawings. FIG. 21 is an external perspective view of the chip part 18h. FIG. 22 is a plan view of the chip component 18h from above.

  The chip parts 18, 18 a to 18 g were provided with four external electrodes 52, 54, 56, 58. On the other hand, the chip component 18 h includes two external electrodes 52 and 56. That is, only one external electrode 52 is provided on the mounting surface S of the chip component 18h. Further, the chip part 18 h includes solder resists 60, 62, 260 and 262.

  The solder resist 60 has a rectangular shape, and extends in the left-right direction so as to intersect the side at the midpoint of the left side of the external electrode 52. The solder resist 62 has a rectangular shape, and extends in the left-right direction so as to intersect the side at the midpoint of the right side of the external electrode 52.

  The solder resist 260 has a rectangular shape, and extends in the front-rear direction so as to intersect the side at the midpoint of the back side of the external electrode 52. The solder resist 262 has a rectangular shape, and extends in the front-rear direction so as to intersect the side at the midpoint of the front side of the external electrode 52.

  In the chip component 18 h configured as described above, the straight line L <b> 1 passes between the solder resist 60 and the solder resist 62. A straight line L <b> 2 passes between the solder resist 260 and the solder resist 262. Therefore, according to the chip component 18h, it is suppressed that the chip component 18h is mounted on the ceramic substrate 12 in a state where the chip component 18h is rotated about the axis Ax1 (that is, in an inclined state).

(Ninth Modification)
Hereinafter, a chip component 18i according to a ninth modification will be described with reference to the drawings. FIG. 23 is a plan view of the chip component 18i from above.

  The chip component 18i is different from the chip component 18h in the presence or absence of the solder resists 260 and 262. The chip component 18 h does not include the solder resists 260 and 262.

  In the chip component 18 i configured as described above, the straight line L <b> 1 passes between the solder resist 60 and the solder resist 62. On the other hand, the straight line L <b> 2 does not pass between the solder resist 60 and the solder resist 62. Therefore, according to the chip component 18i, the chip component 18i is suppressed from being mounted on the ceramic substrate 12 in a state where the chip component 18i is rotated about the axis Ax1 (that is, in an inclined state).

(10th modification)
The ceramic substrate 12a according to the tenth modification will be described below with reference to the drawings. FIG. 24 is a plan view of the ceramic substrate 12a from above.

  The ceramic substrate 12a is different from the ceramic substrate 12 in that it includes solder resists 60, 62, 64, and 66. The chip component 18 mounted on the ceramic substrate 12a does not include the solder resists 60, 62, 64, 66.

  The substrate body 12 of the ceramic substrate 12a has an upper surface including rectangular mounting areas E1 and E2 on which the chip components 18 and 19 are mounted. The shapes of the mounting areas E1 and E2 are the same as the shapes of the mounting surfaces S of the chip components 18 and 19, respectively. In the present embodiment, the longitudinal direction of the mounting areas E1, E2 extends in the front-rear direction.

  Here, as shown in FIG. 24, an intersection of diagonal lines of the mounting area E1 is defined as an intersection P1. A straight line passing through the intersection P1 and parallel to the long side of the mounting area E1 is defined as a straight line L3. A straight line passing through the intersection P1 and parallel to the short side of the mounting area E1 is defined as a straight line L4.

  The external electrode 34 is a square conductor layer provided in the rear half of the mounting area E1. The external electrode 44 is a square conductor layer provided in the front half of the surface of the mounting area E2. Accordingly, the straight line L4 passes between the external electrode 34 and the external electrode 44. Further, the external electrode 34 and the external electrode 44 are in a line symmetric relationship with respect to the straight line L4.

  The solder resist 60 (an example of a fifth member) and the solder resist 62 (an example of a sixth member) are insulating films provided on the external electrode 34 and the mounting area E1. The wettability of the solder resists 60 and 62 with respect to the solder is lower than the wettability of the external electrode 34 with respect to the solder. The solder resist 60 has a rectangular shape, and extends in the left-right direction so as to intersect the side at the midpoint of the left side of the external electrode 34. The solder resist 62 has a rectangular shape, and extends in the left-right direction so as to intersect the side at the midpoint of the right side of the external electrode 44. Thereby, the straight line L3 passes between the solder resist 60 and the solder resist 62. Further, the solder resist 60 and the solder resist 62 are in a line symmetric relationship with respect to the straight line L3.

  The solder resist 64 and the solder resist 66 are insulating films provided on the external electrode 44 and the mounting area E1. The wettability of the solder resists 64 and 66 to the solder is lower than the wettability of the external electrode 44 to the solder. The solder resist 64 has a rectangular shape, and extends in the left-right direction so as to intersect the side at the midpoint of the left side of the external electrode 44. The solder resist 66 has a rectangular shape, and extends in the left-right direction so as to intersect the side at the midpoint of the right side of the external electrode 44. Thereby, the straight line L3 passes between the solder resist 64 and the solder resist 66. Further, the solder resist 64 and the solder resist 66 are in a line symmetric relationship with respect to the straight line L3.

  Further, the straight line L4 passes between the solder resists 60, 62 and the solder resists 64, 66. Furthermore, the solder resist 60 and the solder resist 64 are in a line symmetric relationship with respect to the straight line L4. The solder resist 62 and the solder resist 66 are in a line symmetric relationship with respect to the straight line L4.

  Since the mounting area E2 is the same as the mounting area E1, description thereof is omitted.

  As described above, the solder resists 60, 62, 64 and 66 may be provided on the ceramic substrate 12 a instead of being provided on the chip component 18. Even in such a ceramic substrate 12a, the chip component 18 is prevented from being mounted on the ceramic substrate 12a in a tilted state.

(Other embodiments)
The chip component and the circuit module according to the present invention are not limited to the chip components 18, 18a to 18i, 19 and the vibration device 10, and can be changed within the scope of the gist thereof.

  In addition, you may combine the structure of the chip components 18, 18a-18i, and 19 arbitrarily.

  In the chip components 18 and 18a to 18i, the component main body 50 may be provided with circuit elements such as an inductor and a capacitor. Furthermore, the chip components 18, 18a to 18i may be chip-type electronic components that incorporate an inductor, a capacitor, or the like.

  Further, the ceramic substrate 12b may have the same structure as the chip components 18, 18a to 18i. FIG. 25 is an external perspective view of a ceramic substrate 12b according to another embodiment. Specifically, the ceramic substrate 12b is mounted on a mother substrate, and includes a substrate body 21, external electrodes 100 and 102, and solder resists 260, 262, 264, and 266.

  The substrate body 12 has a mounting surface S1 that faces the mother substrate. The longitudinal direction of the mounting surface S1 extends in the left-right direction.

  Here, as shown in FIG. 25, an intersection of diagonal lines of the mounting surface S1 is defined as an intersection P2. A straight line passing through the intersection P2 and parallel to the long side of the mounting surface S1 is defined as a straight line L5. A straight line passing through the intersection P2 and parallel to the short side of the mounting surface S1 is defined as a straight line L6.

  The external electrode 100 is a rectangular conductor layer provided on the right half of the mounting surface S1. The external electrode 102 is a rectangular conductor layer provided on the left half of the mounting surface S1. Accordingly, the straight line L6 passes between the external electrode 100 and the external electrode 102. Further, the external electrode 100 and the external electrode 102 are in a line symmetric relationship with respect to the straight line L6.

  The solder resist 260 (an example of a seventh member) and the solder resist 262 (an example of an eighth member) are insulating films provided on the external electrode 100 and the mounting surface S1. The wettability of the solder resists 260 and 262 to the solder is lower than the wettability of the external electrode 100 to the solder. The solder resist 260 has a rectangular shape, and extends in the front-rear direction so as to intersect the side at the midpoint of the back side of the external electrode 100. The solder resist 262 has a rectangular shape, and extends in the front-rear direction so as to intersect the side at the midpoint of the front side of the external electrode 100. Accordingly, the straight line L5 passes between the solder resist 260 and the solder resist 262. Further, the solder resist 260 and the solder resist 262 are in a line symmetric relationship with respect to the straight line L5.

  The solder resist 264 and the solder resist 266 are insulating films provided on the external electrode 102 and the mounting surface S1. The wettability of the solder resists 264 and 266 to the solder is lower than the wettability of the external electrode 102 to the solder. The solder resist 264 has a rectangular shape, and extends in the front-rear direction so as to intersect the side at the midpoint of the back side of the external electrode 102. The solder resist 266 has a rectangular shape, and extends in the front-rear direction so as to intersect the side at the midpoint of the front side of the external electrode 102. Accordingly, the straight line L5 passes between the solder resist 264 and the solder resist 266. Further, the solder resist 264 and the solder resist 266 are in a line symmetric relationship with respect to the straight line L5.

  Further, the straight line L6 passes between the solder resists 260 and 262 and the solder resists 264 and 266. Further, the solder resist 260 and the solder resist 264 are in a line symmetric relationship with respect to the straight line L6. The solder resist 262 and the solder resist 266 are in a line symmetric relationship with respect to the straight line L6.

  According to such a ceramic substrate 12b, the ceramic substrate 12b is prevented from being mounted on the mother substrate in a tilted state.

  The component body 50 is not limited to a rectangular parallelepiped shape. The component body 50 only needs to have a rectangular mounting surface S.

  The number of external electrodes provided on the mounting surface S of the chip components 18, 18 a to 18 i, 19 is not limited to one or two.

  The temperature sensitive component 20 may be an IC instead of a thermistor.

  As described above, the present invention is useful for electronic components, circuit boards, and circuit modules. In particular, the present invention provides a circuit board with the electronic components tilted while suppressing a decrease in bonding strength between the electronic components and the circuit board. It is excellent in that it can be suppressed from being mounted.

10: Vibrating device 12: Ceramic substrate 14: Metal cap 16: Crystal piece 17: Crystal main body 18, 18a to 18i, 19: Chip component 20: Temperature sensitive component 21: Substrate main body 22, 26, 30, 34, 36, 40 , 42, 44, 52, 54, 56, 58: External electrode 50: Parts main body 60, 62, 64, 66, 160, 162, 164, 166, 260, 262: Solder resist P: Intersection point S: Mounting surface L1 L6: Straight line

Claims (9)

A component body having a rectangular mounting surface;
At least one or more external electrodes provided on the mounting surface;
A first member and a second member provided on the external electrode;
With
The wettability of the first member and the second member to the solder is lower than the wettability of the external electrode to the solder,
A straight line passing through the intersection of diagonal lines of the mounting surface and parallel to the long side of the mounting surface is the first straight line,
A straight line passing through the intersection of diagonal lines of the mounting surface and parallel to the short side of the mounting surface is the second straight line,
The first straight line or the second straight line passes between the first member and the second member;
Electronic parts characterized by The external electrode includes a first external electrode and a second external electrode,
The second straight line passes between the first external electrode and the second external electrode;
The electronic component according to claim 1. The first member and the second member are provided on the first external electrode,
The first straight line passes between the first member and the second member;
The electronic component according to claim 2. The first member and the second member are in a line-symmetric relationship with respect to the first straight line;
The electronic component according to claim 3. A third member and a fourth member provided on the second external electrode;
In addition,
The first straight line passes between the third member and the fourth member;
The electronic component according to claim 3, wherein: The first member, the second member, the third member, and the fourth member are in a line-symmetric relationship with respect to the second straight line;
The electronic component according to claim 5. An electronic component according to any one of claims 2 to 6,
A circuit board;
With
The circuit board is
A substrate body having a first main surface;
A third external electrode and a fourth external electrode provided on the first main surface;
With
The first external electrode and the third external electrode are connected by solder,
The second external electrode and the fourth external electrode are connected by solder;
A circuit module characterized by A board body having a main surface including a rectangular mounting area on which electronic components are mounted;
At least one or more external electrodes provided in the mounting area;
A fifth member and a sixth member provided on the external electrode;
With
The wettability of the fifth member and the sixth member to the solder is lower than the wettability of the external electrode to the solder,
A straight line passing through the intersection of the diagonal lines of the mounting area and parallel to the long side of the mounting area is the third straight line,
A straight line passing through the intersection of diagonal lines of the mounting area and parallel to the short side of the mounting area is the fourth straight line,
The third straight line or the fourth straight line passes between the fifth member and the sixth member;
A circuit board characterized by. A substrate body having a rectangular main surface;
At least one external electrode provided on the main surface;
A seventh member and an eighth member provided on the external electrode;
With
The wettability of the seventh member and the eighth member with respect to the solder is lower than the wettability of the external electrode with respect to the solder,
A straight line passing through the intersection of diagonal lines of the main surface and parallel to the long side of the main surface is the fifth straight line,
A straight line passing through the intersection of diagonal lines of the main surface and parallel to the short side of the main surface is the sixth straight line,
The fifth straight line or the sixth straight line passes between the seventh member and the eighth member;
A circuit board characterized by.

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