JPS62135443U - - Google Patents
Info
- Publication number
- JPS62135443U JPS62135443U JP2324586U JP2324586U JPS62135443U JP S62135443 U JPS62135443 U JP S62135443U JP 2324586 U JP2324586 U JP 2324586U JP 2324586 U JP2324586 U JP 2324586U JP S62135443 U JPS62135443 U JP S62135443U
- Authority
- JP
- Japan
- Prior art keywords
- conductor pad
- conductor
- board
- mounting
- shape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 12
- 229910000679 solder Inorganic materials 0.000 claims description 7
- 239000006071 cream Substances 0.000 claims description 5
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 3
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図乃至第４図は本考案の一実施例を示し、
第１図は導体パツドと部品の関係を示す平面図、
第２図は導体パツド上にソルダクリーム層を形成
した状態の平面図、第３図は導体パツドの詳細を
示す平面説明図、第４図は半田印刷マスクの貫通
穴を示す平面図、第５図は従来例を示し、同図ａ
はミニモールド部品の搭載状態を示す側面図、同
図ｂは平面図、第６図は従来の半田溶融後の状態
を示す側面図である。
１０はミニモールド部品、１２は少数リード部
側の導体パツド、１１は多数リード部側の導体パ
ツド、１３はリード線、１５，１６は半田印刷マ
スクの貫通穴、１７はソルダクリーム層である。
1 to 4 show an embodiment of the present invention,
Figure 1 is a plan view showing the relationship between conductor pads and parts;
Fig. 2 is a plan view of the solder cream layer formed on the conductor pad, Fig. 3 is a plan explanatory view showing details of the conductor pad, Fig. 4 is a plan view showing the through holes of the solder printing mask, and Fig. 5 is a plan view showing the solder cream layer formed on the conductor pad. The figure shows a conventional example.
FIG. 6 is a side view showing the state in which the mini-mold parts are mounted, FIG. 6B is a plan view, and FIG. Reference numeral 10 designates a mini-mold component, 12 a conductor pad on the side of the few leads, 11 a conductor pad on the side of the many leads, 13 a lead wire, 15 and 16 through holes of a solder printing mask, and 17 a solder cream layer.
Claims (1)
体パツドが形成され、この導体パツド上にソルダ
クリーム層が形成されよチツプ部品実装用基板に
おいて、少数リード部側の導体パツドは、多数リ
ード部側の導体パツドより広い面積を有すると共
に、両導体パツドの形状は、リード線側で半円形
状を成し、かつ、上記ソルダクリーム層の形状は
、リード線側で上記両導体パツドの半円に外接す
る方形を成すことを特徴とするチツプ部品実装用
基板。 A conductor pad for mounting the mini-mold component on the board is formed, and a solder cream layer is formed on this conductor pad.In the board for mounting chip components, the conductor pad on the side of the few leads is the same as the one on the side of the many leads. It has a larger area than the conductor pad, and the shape of both conductor pads is semicircular on the lead wire side, and the shape of the solder cream layer is circumscribed by the semicircle of both conductor pads on the lead wire side. A chip component mounting board characterized by forming a rectangular shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2324586U JPS62135443U (en) | 1986-02-20 | 1986-02-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2324586U JPS62135443U (en) | 1986-02-20 | 1986-02-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62135443U true JPS62135443U (en) | 1987-08-26 |
Family
ID=30821371
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2324586U Pending JPS62135443U (en) | 1986-02-20 | 1986-02-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62135443U (en) |
-
1986
- 1986-02-20 JP JP2324586U patent/JPS62135443U/ja active Pending