JPH0625983Y2 - LSI package mounting structure - Google Patents
LSI package mounting structureInfo
- Publication number
- JPH0625983Y2 JPH0625983Y2 JP9078288U JP9078288U JPH0625983Y2 JP H0625983 Y2 JPH0625983 Y2 JP H0625983Y2 JP 9078288 U JP9078288 U JP 9078288U JP 9078288 U JP9078288 U JP 9078288U JP H0625983 Y2 JPH0625983 Y2 JP H0625983Y2
- Authority
- JP
- Japan
- Prior art keywords
- lsi package
- circuit board
- printed circuit
- mounting structure
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Description
【考案の詳細な説明】 〔産業上の利用分野〕 本考案は、通信機、電子計算機等に使用されるＬＳＩパ
ッケージの実装構造に関し、特にＬＳＩパッケージのリ
ード構造とＬＳＩパッケージが搭載されるプリント基板
のパッド構造に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial application] The present invention relates to a mounting structure of an LSI package used in a communication device, a computer, etc., and particularly to a lead structure of the LSI package and a printed circuit board on which the LSI package is mounted. Regarding the pad structure of.
従来、装置の小型化に伴う電子部品の軽薄短小化と高密
度実装への対応として、第４図に示すように電子回路等
を構成するプリント基板１の表面へＬＳＩパッケージ３
をを直接接続する実装構造（以下、表面実装と称す）が
採用され、第５図に示すようにＬＳＩパッケージ３の基
板４から突出したリード５をプリント基板１のパード２
の表面に突き当て、ハンダ６にて接続し、ＬＳＩパッケ
ージ３をプリント基板１に実装している。Conventionally, in order to cope with the miniaturization of electronic devices and the miniaturization of electronic parts and high-density mounting, as shown in FIG. 4, the LSI package 3 is provided on the surface of a printed circuit board 1 which constitutes an electronic circuit or the like.
A mounting structure (hereinafter, referred to as surface mounting) for directly connecting the two is adopted, and the leads 5 protruding from the substrate 4 of the LSI package 3 are connected to the pad 2 of the printed circuit board 1 as shown in FIG.
It is struck against the surface of, and connected by solder 6, and the LSI package 3 is mounted on the printed board 1.
しかしながら、上述した従来の実装構造では、プリント
基板が製造上のバラツキ及びハンダ付け時の熱ストレス
等により太鼓状に反ることがあり、特にＬＳＩパッケー
ジが多極で大型になった場合、プリント基板の反りが重
要な問題となり、第５図に示す様にプリント基板１に反
りａが発生した場合、ＬＳＩパッケージ３の端付近に位
置するリード５には、リード５とパット２の間に反りａ
の分だけ浮きが生じ、本来、ハンダ６がリード５に対し
てフィレットを形成する様にハンダ付けされるべきであ
るが、フィレットを形成するに至らずハンダ付け不良が
発生し、信頼性を損なうという欠点がある。However, in the above-described conventional mounting structure, the printed circuit board may warp like a drum due to variations in manufacturing and thermal stress at the time of soldering. Warpage becomes an important problem, and when warpage a occurs in the printed board 1 as shown in FIG. 5, the warpage a between the lead 5 and the pad 2 is caused in the lead 5 located near the end of the LSI package 3.
Therefore, the solder 6 should originally be soldered so as to form the fillet with respect to the lead 5, but the soldering failure occurs before the fillet is formed and the reliability is deteriorated. There is a drawback that.
本考案は、ＬＳＩパッケージのパッケージ基板から突出
したリードを、プリント基板上に配置されたパッドに突
き当てて、ハンダ付け接続するＬＳＩパッケージの実装
構造において、前記リードの先端を針状に鋭角に形成
し、前記パッドを厚く形成したことを特徴とする。According to the present invention, in a mounting structure of an LSI package in which a lead protruding from a package substrate of an LSI package is abutted against a pad arranged on a printed circuit board and soldered and connected, the tip of the lead is formed in a needle shape at an acute angle. However, the pad is formed thick.
次に、本考案について図面を参照して説明する。 Next, the present invention will be described with reference to the drawings.
第２図は、本考案の一実施例に用いるＬＳＩパッケージ
３のリード５′の構造を示す側面図である。ＬＳＩパッ
ケージ３のパッケージ基板４からリード５′が突出し、
リード５′の先端は鋭角に尖っている。第３図は本実施
例に用いるプリント基板の断面図である。プリント基板
１上のパッド２′は、通常、第１次電気銅メッキ２−１
にて形成されるが、本実施例では第１次メッキ２−１の
上に重ねて第２次電気銅メッキ２−２を施し、パッド
２′の厚みを通常よりも大きくするものである。尚、第
１次メッキのみでパッド厚みを通常より大きくする手法
でもよい。この様に構成されたＬＳＩパッケージ３とプ
リント基板１を組合せることにより本実施例は構成され
る。FIG. 2 is a side view showing the structure of the lead 5'of the LSI package 3 used in one embodiment of the present invention. The leads 5'project from the package substrate 4 of the LSI package 3,
The tip of the lead 5'is sharply pointed. FIG. 3 is a sectional view of a printed circuit board used in this embodiment. The pad 2'on the printed circuit board 1 is usually the primary electrolytic copper plating 2-1.
However, in this embodiment, the secondary electrolytic copper plating 2-2 is applied on the primary plating 2-1 to make the thickness of the pad 2'larger than usual. It should be noted that a method of making the pad thickness larger than usual by only the primary plating may be used. This embodiment is constructed by combining the LSI package 3 and the printed circuit board 1 configured as described above.
第１図に本実施例の実装状態を示す。プリント基板１上
のパッド２′にＬＳＩパッケージ３のリード５′が突き
当てられ、リード５の先端がパッド２′に食い込む様に
位置し、リード５′の先端の側面とパッド２′の表面に
ハンダ６がフィレット状に接続され、プリント基板１に
反りａが発生しても、パッド２′の厚み分リード５′の
先端とパッド２′が交差している為、この分プリント基
板１の反りａを吸収し良好なハンダ６のフィレットを形
成する。FIG. 1 shows a mounting state of this embodiment. The lead 5'of the LSI package 3 is abutted against the pad 2'on the printed circuit board 1, the tip of the lead 5 is positioned so as to bite into the pad 2 ', and the side surface of the tip of the lead 5'and the surface of the pad 2'are located. Even if the solder 6 is connected in a fillet shape and the warp a occurs on the printed circuit board 1, since the tip of the lead 5'and the pad 2'are crossed by the thickness of the pad 2 ', the warpage of the printed circuit board 1 is caused by this amount. A is absorbed to form a good fillet of the solder 6.
以上説明したように本考案は、ＬＳＩパッケージのリー
ド先端を針状に鋭角な形状とし、プリント基板上のパッ
ドの厚みを通常のメッキ厚より厚く構成しておき、前記
リード先端をパッドに突き刺す様に突き当てて配置する
ことにより、プリント基板に多少の反りが発生した場合
でも、良好なハンダ付け接続が可能となり、ハンダ接合
部の長期的信頼性を向上させる効果がある。As described above, according to the present invention, the tip of the lead of the LSI package is formed into a needle-like acute shape, and the thickness of the pad on the printed circuit board is made thicker than the usual plating thickness. When the printed circuit board is warped to some extent, good soldering connection can be made possible by arranging it so that the printed circuit board is warped to some extent, and it is effective in improving the long-term reliability of the solder joint.
第１図は本考案の一実施例の側面図、第２図は第１図に
示すＬＳＩパッケージ３の側面図、第３図は第１図に示
すプリント基板１の断面図、第４図はＬＳＩパッケージ
とプリント基板の全体構造を示す斜視図、第５図は従来
のＬＳＩパッケージの実装構造の側面図である。 １……プリント基板、２，２′……パッド、２−１……
第１次電気銅メッキ、２−２……第２次電気銅メッキ、
３……ＬＳＩパッケージ、４……パッケージ基板、５，
５′……リード、６……ハンダ、ａ……プリント基板の
反り。1 is a side view of an embodiment of the present invention, FIG. 2 is a side view of the LSI package 3 shown in FIG. 1, FIG. 3 is a sectional view of the printed circuit board 1 shown in FIG. 1, and FIG. FIG. 5 is a perspective view showing an entire structure of an LSI package and a printed circuit board, and FIG. 5 is a side view of a conventional mounting structure of an LSI package. 1 ... Printed circuit board, 2, 2 '... Pad, 2-1 ...
Primary electrolytic copper plating, 2-2 ... Secondary electrolytic copper plating,
3 ... LSI package, 4 ... Package substrate, 5,
5 '... Lead, 6 ... Solder, a ... Printed circuit board warp.
Claims (1)
出したリードを、プリント基板上に配置されたパッドに
突き当てて、ハンダ付け接続するＬＳＩパッケージの実
装構造において、前記リードの先端を針状に鋭角に形成
し、前記パッドを厚く形成したことを特徴とするＬＳＩ
パッケージの実装構造。1. In a mounting structure of an LSI package in which leads protruding from a package substrate of an LSI package are abutted against pads arranged on a printed circuit board and soldered and connected, the tips of the leads are formed into needle-shaped acute angles. LSI formed by forming the pad thickly
Package mounting structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9078288U JPH0625983Y2 (en) | 1988-07-07 | 1988-07-07 | LSI package mounting structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9078288U JPH0625983Y2 (en) | 1988-07-07 | 1988-07-07 | LSI package mounting structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0211375U JPH0211375U (en) | 1990-01-24 |
| JPH0625983Y2 true JPH0625983Y2 (en) | 1994-07-06 |
Family
ID=31315294
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9078288U Expired - Lifetime JPH0625983Y2 (en) | 1988-07-07 | 1988-07-07 | LSI package mounting structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0625983Y2 (en) |
-
1988
- 1988-07-07 JP JP9078288U patent/JPH0625983Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0211375U (en) | 1990-01-24 |
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