JPH07147481A - Method of mounting electronic part - Google Patents
Method of mounting electronic partInfo
- Publication number
- JPH07147481A JPH07147481A JP5294878A JP29487893A JPH07147481A JP H07147481 A JPH07147481 A JP H07147481A JP 5294878 A JP5294878 A JP 5294878A JP 29487893 A JP29487893 A JP 29487893A JP H07147481 A JPH07147481 A JP H07147481A
- Authority
- JP
- Japan
- Prior art keywords
- bga
- mounting
- wiring board
- printed wiring
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、プリント配線板の表面
に実装する電子部品の実装方法に関し、特にハンダ付け
状態が外観によって確認できないＢＧＡ（Ｂall Ｇrid
Ａrray、ボール・グリッド・アレイ）タイプの電子部品
の実装方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for mounting electronic parts to be mounted on the surface of a printed wiring board, and in particular, BGA (Ball Grid) whose soldering state cannot be confirmed by appearance.
Array, ball grid array) type electronic component mounting method.
【０００２】[0002]
【従来の技術】ＬＳＩパッケージなどの電子部品の実装
形態としては、表面実装型と挿入実装型があるが、現
在、前者のタイプが主流となっている。この表面実装型
ＰＧＡ（pin grid array、）の実装方法としては、従来
から位置ずれを防止する方法が種々提案されている。2. Description of the Related Art As mounting forms of electronic parts such as LSI packages, there are a surface mounting type and an insertion mounting type. At present, the former type is predominant. As a mounting method of this surface mounting type PGA (pin grid array), various methods for preventing positional displacement have been conventionally proposed.
【０００３】例えば、プリント配線板とＰＧＡにそれぞ
れ凹凸部を設けることによって位置合わせを行い、プリ
ント配線板とＰＧＡとの位置ずれを防止するようにした
方法（特開平３−２７０２９９号公報を参照）、実装用
のガイドプレートを用い、ガイドプレートに設けられた
突起部と、プリント板に設けられた位置決めバンプとを
互いに噛み合わせることによって、電子部品のリードピ
ンをパッドに位置決めする方法（特開平３−２４１８９
９号公報を参照）などがある。For example, a method in which the printed wiring board and the PGA are each provided with an uneven portion for alignment to prevent the positional displacement between the printed wiring board and the PGA (see Japanese Patent Laid-Open No. 3-270299). , A method of positioning a lead pin of an electronic component on a pad by engaging a protrusion provided on the guide plate and a positioning bump provided on a printed board with each other by using a mounting guide plate (JP-A-3- 24189
No. 9 publication) and the like.
【０００４】しかし、従来の電子部品の実装方法は、電
子部品とプリント板との位置ずれを防止するための位置
決めのみを考慮したもので、ＰＧＡ実装後の機械的スト
レス／熱ストレスによる接続信頼性について考慮してい
ない。However, the conventional method for mounting electronic components considers only the positioning for preventing the positional displacement between the electronic components and the printed board, and the connection reliability due to mechanical stress / thermal stress after PGA mounting. Do not consider.
【０００５】[0005]
【発明が解決しようとする課題】ところで、部品の小型
化、多ピン化によりプリント配線板への実装部品として
ＢＧＡ型の電子部品（ＬＳＩパッケージなど）が用いら
れている。このＢＧＡは、その裏面にボール状のはんだ
をアレイ状に並べたものであるが、その接続部がＢＧＡ
の真下にあるため、ＢＧＡとプリント配線板との位置合
わせが困難であり、実装後の接続状態の確認が容易にで
きない。By the way, BGA type electronic parts (such as LSI packages) are used as parts to be mounted on a printed wiring board due to miniaturization and increase in the number of pins. This BGA has ball-shaped solder arranged in an array on its back surface.
Since it is right under the position, it is difficult to align the BGA and the printed wiring board, and it is not possible to easily confirm the connection state after mounting.
【０００６】図４は、従来のＢＧＡの実装図である。図
において、１’はＢＧＡ型の電子部品（以下、ＢＧ
Ａ）、５’はプリント配線板、４は、ハンダボール、６
は樹脂、８は接続パッドである。従来のＢＧＡでは、Ｂ
ＧＡ１’とプリント配線板５’との位置合わせができな
いため、接続パッド８とハンダボール４の位置ずれが発
生する（図の場合、ＢＧＡ１’が右にずれている）。ま
た、リードタイプの表面実装部品に比べてＢＧＡはリー
ドレスであるため、接続パッドに機械的ストレス／熱ス
トレスが加わるため接続信頼性に問題があった。FIG. 4 is a mounting diagram of a conventional BGA. In the figure, 1'denotes a BGA type electronic component (hereinafter, BG
A) 5'is a printed wiring board, 4 is a solder ball, 6
Is a resin, and 8 is a connection pad. In the conventional BGA, B
Since the GA 1 ′ and the printed wiring board 5 ′ cannot be aligned with each other, the connection pad 8 and the solder ball 4 are displaced from each other (in the figure, BGA 1 ′ is displaced to the right). Further, since the BGA is leadless as compared with the lead type surface mount component, mechanical stress / thermal stress is applied to the connection pad, which causes a problem in connection reliability.
【０００７】このため、樹脂６でＢＧＡ１’を覆うこと
により、機械的ストレス／熱ストレスを緩和させるよう
にしている。しかし、樹脂６を除去することができない
ため、ＢＧＡ１’の取外しができないという問題があっ
た。Therefore, by covering the BGA 1'with the resin 6, the mechanical stress / heat stress is relieved. However, since the resin 6 cannot be removed, the BGA 1'cannot be removed.
【０００８】本発明の目的は、ＢＧＡ型電子部品の実装
時の位置ずれを防止し、実装後の位置ずれの確認を容易
にするとともに、機械的ストレス／熱ストレスを緩和さ
せ、接続パッドの信頼性を向上させた電子部品の実装方
法を提供することにある。An object of the present invention is to prevent displacement of a BGA type electronic component during mounting, facilitate confirmation of displacement after mounting, reduce mechanical stress / thermal stress, and improve reliability of connection pads. An object of the present invention is to provide a method of mounting electronic components with improved performance.
【０００９】[0009]
【課題を解決するための手段】前記目的を達成するため
に、本発明では、ＢＧＡ型の電子部品をプリント配線板
に実装する電子部品の実装方法において、ＢＧＡ型の電
子部品に第１の位置決め手段を設け、該ＢＧＡ型の電子
部品を搭載するプリント配線板に第２の位置決め手段を
設け、実装時に該第１、第２の位置決め手段を用いて、
前記ＢＧＡ型の電子部品と前記プリント配線板の位置決
めを行い、前記第１の位置決め手段と第２の位置決め手
段とをハンダで固定することを特徴としている。To achieve the above object, in the present invention, in a method of mounting an electronic component of BGA type on a printed wiring board, a first positioning is performed on the electronic component of BGA type. Means is provided, and a second positioning means is provided on the printed wiring board on which the BGA type electronic component is mounted, and the first and second positioning means are used at the time of mounting.
The BGA type electronic component and the printed wiring board are positioned, and the first positioning means and the second positioning means are fixed with solder.
【００１０】[0010]
【作用】ＢＧＡ型電子部品にスルーホールを設け、プリ
ント配線板にパッドを設けて、両者の位置合わせを行っ
ているので、ＢＧＡ搭載時の位置ずれが防止されるとと
もに位置ずれの確認が容易にできる。また、スルーホー
ルとパッドをハンダで固定することにより、機械的スト
レス／熱ストレスが緩和され、接続パッドの信頼性を向
上させることができ、また容易にＢＧＡの交換ができ
る。[Function] Since the BGA type electronic component is provided with the through hole and the printed wiring board is provided with the pad so as to align the both, the positional displacement at the time of mounting the BGA is prevented and the positional displacement can be easily confirmed. it can. Further, by fixing the through hole and the pad with solder, mechanical stress / heat stress is relieved, the reliability of the connection pad can be improved, and the BGA can be easily replaced.
【００１１】[0011]
【実施例】以下、本発明の一実施例を図面を用いて具体
的に説明する。図１は、本発明の位置合わせを説明する
図であり、図２は、本発明のＢＧＡをプリント配線板に
実装した図であり、図３は、図２のＡ−Ａ’断面図であ
る。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be specifically described below with reference to the drawings. FIG. 1 is a diagram for explaining the alignment of the present invention, FIG. 2 is a diagram in which the BGA of the present invention is mounted on a printed wiring board, and FIG. 3 is a sectional view taken along the line AA ′ of FIG. .
【００１２】図１において、１は、本発明のＢＧＡ型の
電子部品（以下、ＢＧＡ）であり、ＢＧＡ１の隅には扇
状のスルーホール２が設けられている。また、プリント
配線板５には、ＢＧＡ１のスルーホール２に対応した位
置に、パッド３が設けられている。そして、スルーホー
ル２とパッド３を位置決めして、ＢＧＡ１をプリント配
線板５に実装することにより、プリント配線板５の接続
パッド８とＢＧＡ１のハンダボール４との位置ずれを防
止することができる。In FIG. 1, reference numeral 1 is a BGA type electronic component (hereinafter referred to as BGA) of the present invention, and a fan-shaped through hole 2 is provided at a corner of the BGA 1. Further, the printed wiring board 5 is provided with pads 3 at positions corresponding to the through holes 2 of the BGA 1. Then, by positioning the through hole 2 and the pad 3 and mounting the BGA 1 on the printed wiring board 5, it is possible to prevent misalignment between the connection pad 8 of the printed wiring board 5 and the solder ball 4 of the BGA 1.
【００１３】そして、図２に示すように、ＢＧＡ１のス
ルーホール２とプリント配線板５のパッド３をハンダ７
で固定する。図３は、ハンダで固定されたときのＡ−
Ａ’断面図である。このように、本実施例ではハンダで
固定しているので、接続パッド８とハンダボール４との
機械的ストレス／熱ストレスによる接続信頼性を向上さ
せることができる。さらに、本発明ではＢＧＡ１とプリ
ント配線板５の固定方法としてハンダ７を用いているの
で、容易に取外しが可能となる。Then, as shown in FIG. 2, the through holes 2 of the BGA 1 and the pads 3 of the printed wiring board 5 are connected to the solder 7
Fix with. Fig. 3 shows A- when fixed with solder.
It is an A'sectional view. As described above, in this embodiment, since the fixing is performed with solder, the connection reliability between the connection pad 8 and the solder ball 4 due to mechanical stress / heat stress can be improved. Further, in the present invention, since the solder 7 is used as the method for fixing the BGA 1 and the printed wiring board 5, it is possible to easily remove the solder.
【００１４】なお、図では、ＢＧＡ１の４隅にスルーホ
ール２が設けられているが、これは一例であって、ＢＧ
Ａ１の対角上の２隅に設けるなどその数を変更すること
ができる。また、スルーホールの形状も扇状に限定され
ず、半円形など他の形状でもよい。さらに、位置決め方
法として、本発明は上記したスルーホール（ＢＧＡ）と
パッド（プリント配線板）の組み合わせに限定されず、
基本的には位置決めできるとともに、ハンダ付けが可能
であればよいので、ＢＧＡ、プリント配線板の両方にス
ルーホールを設けたり、あるいはＢＧＡのスルーホール
をハンダ付けが可能な金属部に変更したり、種々の組み
合わせ変更が可能である。Although the through holes 2 are provided at the four corners of the BGA 1 in the figure, this is an example, and the BG
The number can be changed, for example, it can be provided at two corners on the diagonal of A1. Further, the shape of the through hole is not limited to the fan shape, but may be another shape such as a semicircle. Further, as a positioning method, the present invention is not limited to the combination of the above-mentioned through hole (BGA) and pad (printed wiring board),
Basically, it is sufficient if it can be positioned and soldered, so it is possible to provide through holes on both the BGA and the printed wiring board, or to change the BGA through holes to solderable metal parts. Various combinations can be changed.
【００１５】[0015]
【発明の効果】以上、説明したように、本発明によれ
ば、ＢＧＡとプリント配線板に位置決め手段を設けてい
るので、実装時の位置ずれが防止され、また実装後の位
置ずれの確認が容易にできる。さらに、ＢＧＡとプリン
ト配線板の位置決め手段をハンダで固定しているので、
機械的ストレス／熱ストレスが緩和され、接続パッドの
信頼性を向上させることができ、しかも容易にＢＧＡの
取外しが可能となる。As described above, according to the present invention, since the BGA and the printed wiring board are provided with the positioning means, the positional deviation during mounting can be prevented and the positional deviation after mounting can be confirmed. You can easily. Furthermore, since the positioning means for the BGA and the printed wiring board are fixed with solder,
Mechanical stress / heat stress is relieved, the reliability of the connection pad can be improved, and the BGA can be easily removed.
【図１】本発明の位置合わせを説明する図である。FIG. 1 is a diagram illustrating alignment according to the present invention.
【図２】本発明のＢＧＡをプリント配線板に実装した図
である。FIG. 2 is a diagram in which the BGA of the present invention is mounted on a printed wiring board.
【図３】図２のＡ−Ａ’断面図である。3 is a cross-sectional view taken along the line A-A ′ of FIG.
【図４】従来のＢＧＡの実装図である。FIG. 4 is a mounting diagram of a conventional BGA.
１ ＢＧＡ型の電子部品 ２ スルーホール ３ パッド ４ ハンダボール ５ プリント配線板 ６ 樹脂 ７ ハンダ ８ 接続パッド 1 BGA type electronic component 2 Through hole 3 Pad 4 Solder ball 5 Printed wiring board 6 Resin 7 Solder 8 Connection pad
Claims (1)
実装する電子部品の実装方法において、ＢＧＡ型の電子
部品に第１の位置決め手段を設け、該ＢＧＡ型の電子部
品を搭載するプリント配線板に第２の位置決め手段を設
け、実装時に該第１、第２の位置決め手段を用いて、前
記ＢＧＡ型の電子部品と前記プリント配線板の位置決め
を行い、前記第１の位置決め手段と第２の位置決め手段
とをハンダで固定することを特徴とする電子部品の実装
方法。1. A method for mounting an electronic component of a BGA type on a printed wiring board, wherein a first positioning means is provided on the BGA type electronic component, and the printed circuit board is mounted with the BGA type electronic component. Second positioning means is provided in the first positioning means and the second positioning means are used to position the BGA type electronic component and the printed wiring board at the time of mounting. A mounting method for an electronic component, characterized in that the positioning means is fixed by soldering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5294878A JPH07147481A (en) | 1993-11-25 | 1993-11-25 | Method of mounting electronic part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5294878A JPH07147481A (en) | 1993-11-25 | 1993-11-25 | Method of mounting electronic part |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07147481A true JPH07147481A (en) | 1995-06-06 |
Family
ID=17813425
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5294878A Pending JPH07147481A (en) | 1993-11-25 | 1993-11-25 | Method of mounting electronic part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07147481A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2364435A (en) * | 1999-12-24 | 2002-01-23 | Nec Corp | Surface-mount package |
| US6346679B1 (en) | 1999-08-27 | 2002-02-12 | Nec Corporation | Substrate on which ball grid array type electrical part is mounted and method for mounting ball grid array type electrical part on substrate |
-
1993
- 1993-11-25 JP JP5294878A patent/JPH07147481A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6346679B1 (en) | 1999-08-27 | 2002-02-12 | Nec Corporation | Substrate on which ball grid array type electrical part is mounted and method for mounting ball grid array type electrical part on substrate |
| GB2364435A (en) * | 1999-12-24 | 2002-01-23 | Nec Corp | Surface-mount package |
| GB2364435B (en) * | 1999-12-24 | 2002-11-20 | Nec Corp | Surface-mount package with side terminal |
| US6756666B2 (en) | 1999-12-24 | 2004-06-29 | Nec Corporation | Surface mount package including terminal on its side |
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