JPS646089U - - Google Patents
Info
- Publication number
- JPS646089U JPS646089U JP1987101519U JP10151987U JPS646089U JP S646089 U JPS646089 U JP S646089U JP 1987101519 U JP1987101519 U JP 1987101519U JP 10151987 U JP10151987 U JP 10151987U JP S646089 U JPS646089 U JP S646089U
- Authority
- JP
- Japan
- Prior art keywords
- view
- printed wiring
- wiring body
- shield structure
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 238000007747 plating Methods 0.000 claims description 3
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Structure Of Receivers (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Channel Selection Circuits, Automatic Tuning Circuits (AREA)
Description
第1図乃至第8図は、本考案に係るシールド構
体の一実施例を示すもので、第1図は上記シール
ド機体の正面からの外観斜視部、第2図は第1図
の縦断側面図、第3図は第2図の要部の縦断正面
図、第4図は、上記シールド構体におけるプリン
ト配線体の外観斜視図、第5図乃至第7図は上記
プリント配線体に樹脂層を形成する際の各状態で
の外観斜視図、第8図はメツキ層を施した状態を
示す外観斜視図である。第9図乃至第11図は、
上記シールド構体に空間結合を形成した場合につ
いての上記空間結合部の要部の平面図、正面図、
縦断正面図である。第12図並びに第13図は、
夫々、メツキ層とプリント配線体のアースライン
との導通方法の他の例を示す縦断側面図である。
第14図乃至第16図は、リードの導出方向の異
なるシールド構体の一例を示す図面で、第14図
は上記シールド構体におけるプリント配線体の外
観斜視図、第15図は上記シールド構体の外観斜
視図、第16図は上記シールド構体の裏面側から
の外観斜視図である。第17図は従来のシールド
構体の一例を示す一部を省略した斜視図である。
10……プリント配線体、11……電子部品、
13,14……接地パターン電極、20……樹脂
層、21……スリツト、30……樹脂層、40…
…メツキ層。
1 to 8 show an embodiment of the shield structure according to the present invention, FIG. 1 is a perspective view of the shield body as seen from the front, and FIG. 2 is a vertical side view of FIG. 1. , FIG. 3 is a longitudinal sectional front view of the main part of FIG. 2, FIG. 4 is an external perspective view of the printed wiring body in the shield structure, and FIGS. 5 to 7 show the formation of a resin layer on the printed wiring body. Fig. 8 is a perspective view of the appearance in each state when a plating layer is applied. Figures 9 to 11 are
A plan view and a front view of the main parts of the spatial coupling part in the case where a spatial coupling is formed in the shield structure,
FIG. Figures 12 and 13 are
FIG. 6 is a longitudinal side view showing another example of a method of conducting electrical connection between the plating layer and the ground line of the printed wiring body.
14 to 16 are drawings showing examples of shield structures in which leads are led out in different directions. FIG. 14 is an external perspective view of a printed wiring body in the above shield structure, and FIG. 15 is an external perspective view of the above shield structure. FIG. 16 is an external perspective view of the shield structure from the back side. FIG. 17 is a partially omitted perspective view showing an example of a conventional shield structure. 10...Printed wiring body, 11...Electronic component,
13, 14...Ground pattern electrode, 20...Resin layer, 21...Slit, 30...Resin layer, 40...
...Metsuki layer.
Claims (1)
て高周波電子回路を構成したプリント配線体を、
回路ブロツク間にスリツトを形成して樹脂被覆し
、上記スリツト溝を含む樹脂層の表面をプリント
配線体の接地パターン電極と導通したメツキ層に
て被覆したことを特徴とするシールド構体。 A printed wiring body in which a large number of electronic components are assembled into each circuit block to form a high-frequency electronic circuit.
A shield structure characterized in that slits are formed between circuit blocks and the circuit blocks are coated with a resin, and the surface of the resin layer including the slit grooves is covered with a plating layer that is electrically connected to a ground pattern electrode of a printed wiring body.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987101519U JPS646089U (en) | 1987-06-30 | 1987-06-30 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987101519U JPS646089U (en) | 1987-06-30 | 1987-06-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS646089U true JPS646089U (en) | 1989-01-13 |
Family
ID=31330591
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987101519U Pending JPS646089U (en) | 1987-06-30 | 1987-06-30 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS646089U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2003044891A1 (en) * | 2001-11-20 | 2003-05-30 | Ube Industries, Ltd. | Dielectric antenna module |
-
1987
- 1987-06-30 JP JP1987101519U patent/JPS646089U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2003044891A1 (en) * | 2001-11-20 | 2003-05-30 | Ube Industries, Ltd. | Dielectric antenna module |