JPH0213776U - - Google Patents
Info
- Publication number
- JPH0213776U JPH0213776U JP9140488U JP9140488U JPH0213776U JP H0213776 U JPH0213776 U JP H0213776U JP 9140488 U JP9140488 U JP 9140488U JP 9140488 U JP9140488 U JP 9140488U JP H0213776 U JPH0213776 U JP H0213776U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- conductor
- substrates
- insulating
- tube
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
Description
第１図および第２図は夫々異なる本考案の実施
例を示す断面図である。
１……基板積層体、２……基板、３……配線、
４……貫通孔、５……絶縁筒、７……導電線。
FIGS. 1 and 2 are cross-sectional views showing different embodiments of the present invention. 1... Board laminate, 2... Board, 3... Wiring,
4... Through hole, 5... Insulating tube, 7... Conductive wire.
Claims (1)
層し、この基板積層体に積層方向に貫通する貫通
孔を形成して、この貫通孔に絶縁筒を嵌合し、且
つこの絶縁筒に導電体を設けて、この導電体で前
記基板積層体の両方の外面に形成した配線を相互
に導通することを特徴とする多層配線基板。 A plurality of insulating substrates with wiring formed on their surfaces are laminated, a through hole is formed in the laminated body of the substrates, and an insulating tube is fitted into the through hole, and a conductive tube is inserted into the insulating tube. 1. A multilayer wiring board, characterized in that a conductor is provided and the wirings formed on both outer surfaces of the board stack are electrically connected to each other by the conductor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9140488U JPH0213776U (en) | 1988-07-12 | 1988-07-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9140488U JPH0213776U (en) | 1988-07-12 | 1988-07-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0213776U true JPH0213776U (en) | 1990-01-29 |
Family
ID=31315886
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9140488U Pending JPH0213776U (en) | 1988-07-12 | 1988-07-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0213776U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0542769U (en) * | 1991-11-01 | 1993-06-11 | 三菱自動車工業株式会社 | Synchro mesh device |
-
1988
- 1988-07-12 JP JP9140488U patent/JPH0213776U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0542769U (en) * | 1991-11-01 | 1993-06-11 | 三菱自動車工業株式会社 | Synchro mesh device |