JPS6433769U - - Google Patents
Info
- Publication number
- JPS6433769U JPS6433769U JP12722687U JP12722687U JPS6433769U JP S6433769 U JPS6433769 U JP S6433769U JP 12722687 U JP12722687 U JP 12722687U JP 12722687 U JP12722687 U JP 12722687U JP S6433769 U JPS6433769 U JP S6433769U
- Authority
- JP
- Japan
- Prior art keywords
- high current
- board
- conductor
- sectional
- cross
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 11
- 238000010030 laminating Methods 0.000 claims 1
- 239000004593 Epoxy Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Description
第１図は本考案の導体接着式高電流基板、第２
図は本考案の導体植え込み式高電流基板、第３図
は本考案の導体カシメ式高電流基板である。
１：ガラスエポキシ１．６mm厚片面基板、２：
片面基板の導体部の断面図、３：高電流用導体線
を接着した状態の断面図、４：ガラスエポキシ基
板と高電流用導体線が合流したＡ―Ａ′線の断面
図で電力機器とのターミナル部分、５：ガラスエ
ポキシ１．６mm厚片面基板、６：片面基板の導体
部の断面図、７：高電流用の導体線を植え込んだ
状態図、８：電力機器とのターミナル部、８′：
Ｌ字状のターミナル部、９：スルーホール基板、
１０：高電流用の導体線をカシメて取り付けた状
態図、１１：レジスト、１２：Ａ―Ａ′線の断面
図でスルーホール基板と導体線を接合した状態を
示し電力機器とのターミナル部、１３：Ｂ―Ｂ′
線の断面図で導体線が基板にカシメられて固定さ
れた状態図である。
Figure 1 shows the conductor adhesive type high current board of the present invention, the second
The figure shows a conductor-embedded high current board of the present invention, and FIG. 3 shows a conductor caulking type high current board of the present invention. 1: Glass epoxy 1.6mm thick single-sided board, 2:
3: Cross-sectional view of the conductor part of the single-sided board, 3: Cross-sectional view of the high-current conductor wire bonded, 4: Cross-sectional view of the A-A' line where the glass epoxy board and the high-current conductor wire meet, showing power equipment and Terminal part, 5: Glass epoxy 1.6 mm thick single-sided board, 6: Cross-sectional view of the conductor part of the single-sided board, 7: State diagram with high current conductor wire implanted, 8: Terminal part with power equipment, 8 ′:
L-shaped terminal part, 9: Through-hole board,
10: State diagram of high current conductor wire crimped and attached, 11: Resist, 12: Cross-sectional view along line A-A' showing the state where the through-hole board and conductor wire are joined, terminal part with power equipment, 13:B-B'
FIG. 3 is a cross-sectional view of the wire, showing a state in which the conductor wire is caulked and fixed to the substrate.
Claims (1)
積層したことを特徴とする高電流対応形プリント
配線板。 A high current compatible printed wiring board characterized by laminating high current conductor wires on a weak current printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12722687U JPS6433769U (en) | 1987-08-21 | 1987-08-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12722687U JPS6433769U (en) | 1987-08-21 | 1987-08-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6433769U true JPS6433769U (en) | 1989-03-02 |
Family
ID=31379466
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12722687U Pending JPS6433769U (en) | 1987-08-21 | 1987-08-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6433769U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02266595A (en) * | 1989-04-07 | 1990-10-31 | Yazaki Corp | High-density wiring board |
| JPH0487389A (en) * | 1990-07-31 | 1992-03-19 | Okuma Mach Works Ltd | Printed board for power circuit wiring |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5989485A (en) * | 1982-11-15 | 1984-05-23 | 株式会社リコー | Power source bar bendng device for pcb |
-
1987
- 1987-08-21 JP JP12722687U patent/JPS6433769U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5989485A (en) * | 1982-11-15 | 1984-05-23 | 株式会社リコー | Power source bar bendng device for pcb |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02266595A (en) * | 1989-04-07 | 1990-10-31 | Yazaki Corp | High-density wiring board |
| JPH0487389A (en) * | 1990-07-31 | 1992-03-19 | Okuma Mach Works Ltd | Printed board for power circuit wiring |
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