JPH07321439A - Component mounting board for memory device - Google Patents
Component mounting board for memory deviceInfo
- Publication number
- JPH07321439A JPH07321439A JP11481494A JP11481494A JPH07321439A JP H07321439 A JPH07321439 A JP H07321439A JP 11481494 A JP11481494 A JP 11481494A JP 11481494 A JP11481494 A JP 11481494A JP H07321439 A JPH07321439 A JP H07321439A
- Authority
- JP
- Japan
- Prior art keywords
- memory
- memory device
- component mounting
- electronic component
- base plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明はメモリ電子部品が取り
付けられるメモリ装置用部品取付板に関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a memory device component mounting plate to which memory electronic components are mounted.
【０００２】[0002]
【従来の技術】従来のメモリ装置用部品取付板において
は、基体板にスルホールを設け、電子部品のリード線を
スルホールに挿入して、リード線とスルホールとをハン
ダ付けしており、また基体板に接続用端子を設け、電子
部品のリード線と接続用端子とをハンダ付けしている。2. Description of the Related Art In a conventional component mounting plate for a memory device, a through hole is provided in a base plate, a lead wire of an electronic component is inserted into the through hole, and the lead wire and the through hole are soldered together. A connection terminal is provided on the and the lead wire of the electronic component and the connection terminal are soldered.
【０００３】[0003]
【発明が解決しようとする課題】しかし、このようなメ
モリ装置用部品取付板においては、電子部品を取り付け
た状態での厚さが大きくなり、また取り付けられるべき
電子部品の数が限定されるから、メモリ容量を容易に変
更することはできない。However, in such a component mounting plate for a memory device, the thickness of the electronic component mounted becomes large, and the number of electronic components to be mounted is limited. , The memory capacity cannot be changed easily.
【０００４】この発明は上述の課題を解決するためにな
されたもので、電子部品を取り付けた状態での厚さが小
さいメモリ装置用部品取付板、メモリ容量を容易に変更
することができるメモリ装置用部品取付板を提供するこ
とを目的とする。The present invention has been made to solve the above-mentioned problems, and a component mounting plate for a memory device having a small thickness with electronic components mounted, and a memory device capable of easily changing the memory capacity. An object is to provide a component mounting plate.
【０００５】[0005]
【課題を解決するための手段】この目的を達成するた
め、第１発明においては、基体板にメモリ電子部品が取
り付けられるメモリ装置用部品取付板において、上記基
体板に複数のメモリ電子部品収納穴を設ける。To achieve this object, in the first aspect of the present invention, in a component mounting plate for a memory device in which memory electronic components are mounted on a base plate, a plurality of memory electronic component storage holes are formed in the base plate. To provide.
【０００６】また、第２発明においては、基体板にメモ
リ電子部品が取り付けられるメモリ装置用部品取付板に
おいて、上記基体板に複数のメモリ電子部品収納穴を設
け、上記基体板の第１の表面に第１の接続用端子を設
け、上記基体板の第２の表面の上記第１の接続用端子に
対応する位置に第２の接続用端子を設ける。According to the second aspect of the present invention, in the component mounting plate for a memory device in which the memory electronic component is mounted on the base plate, the base plate is provided with a plurality of memory electronic component storage holes, and the first surface of the base plate is provided. Is provided with a first connecting terminal, and the second connecting terminal is provided at a position corresponding to the first connecting terminal on the second surface of the base plate.
【０００７】[0007]
【作用】第１発明においては、メモリ電子部品収納穴内
にメモリ電子部品を収納すれば、電子部品を取り付けた
状態での厚さが小さい。In the first aspect of the present invention, if the memory electronic component is stored in the memory electronic component storing hole, the thickness of the electronic component mounted is small.
【０００８】また、第２発明においては、メモリ電子部
品収納穴内にメモリ電子部品を収納した複数枚のメモリ
装置用部品取付板を重ね、隣接するメモリ装置用部品取
付板の第１の接続用端子と第２の接続用端子とを接続す
る。In the second aspect of the invention, a plurality of memory device component mounting plates accommodating memory electronic components are stacked in the memory electronic component accommodating holes, and the first connecting terminals of the adjacent memory device component mounting plates are stacked. Is connected to the second connection terminal.
【０００９】[0009]
【実施例】図１はこの発明に係るメモリ装置用部品取付
板を示す概略図、図２は図１のＡ−Ａ拡大断面図であ
る。図に示すように、樹脂からなる基板１と基板２とが
接着され、基体板１３を構成している。基体板１３にメ
モリ電子部品収納穴３が設けられ、基体板１３に入出力
端子４が形成され、基体板１３に駆動電子部品用端子５
が形成され、基体板１３のメモリ電子部品収納穴３部に
メモリ電子部品用端子６が形成され、基体板１３に配線
７が形成され、基体板１３にスルホール８が設けられ、
入出力端子４、駆動電子部品用端子５、メモリ電子部品
用端子６は配線７、スルホール８によって接続されてい
る。1 is a schematic diagram showing a component mounting plate for a memory device according to the present invention, and FIG. 2 is an enlarged sectional view taken along line AA of FIG. As shown in the figure, a substrate 1 and a substrate 2 made of resin are bonded to each other to form a base plate 13. The base plate 13 is provided with the memory electronic component housing hole 3, the base plate 13 is formed with input / output terminals 4, and the base plate 13 is provided with drive electronic component terminals 5.
Is formed, the memory electronic component terminal 6 is formed in the memory electronic component housing hole 3 of the base plate 13, the wiring 7 is formed in the base plate 13, and the through hole 8 is provided in the base plate 13.
The input / output terminal 4, the driving electronic component terminal 5, and the memory electronic component terminal 6 are connected by a wiring 7 and a through hole 8.
【００１０】このメモリ装置用部品取付板においては、
図３に示すように、メモリ電子部品収納穴３内にＴＡＢ
型のメモリ電子部品９を収納し、メモリ電子部品９のベ
ースフィルム１０に形成された接続端子１１とメモリ電
子部品用端子６とをハンダ１２を介して接続すれば、メ
モリ電子部品９を取り付けた状態での厚さが小さいか
ら、メモリ装置をコンパクトにすることができる。In this memory device component mounting plate,
As shown in FIG. 3, the TAB is placed in the memory electronic component storage hole 3.
If the memory electronic component 9 of the mold is housed and the connection terminal 11 formed on the base film 10 of the memory electronic component 9 and the terminal 6 for the memory electronic component are connected via the solder 12, the memory electronic component 9 is attached. Since the thickness in the state is small, the memory device can be made compact.
【００１１】図４はこの発明に係る他のメモリ装置用部
品取付板を示す概略図、図５は図４のＢ−Ｂ拡大断面図
である。図に示すように、樹脂からなる基板２１と基板
２２とが接着され、基体板３５を構成している。基体板
３５にメモリ電子部品収納穴２３が設けられ、基体板３
５のメモリ電子部品収納穴２３部にメモリ電子部品用端
子（図示せず）が形成され、基体板３５の第１の表面に
接続用穴２５が設けられ、接続用穴２５部に第１の接続
用端子２４が設けられ、基体板３５の第２の表面の接続
用端子２４に対応する位置に第２の接続用端子２８が設
けられ、基体板３５に配線２６が形成され、基体板３５
にスルホール２７が設けられ、メモリ電子部品用端子、
接続用端子２４、２８は配線２６、スルホール２７によ
って接続されている。FIG. 4 is a schematic view showing another component mounting plate for a memory device according to the present invention, and FIG. 5 is an enlarged sectional view taken along line BB of FIG. As shown in the figure, a substrate 21 and a substrate 22 made of resin are bonded together to form a base plate 35. The base plate 35 is provided with the memory electronic component storage holes 23, and the base plate 3
5, a memory electronic component terminal (not shown) is formed in the memory electronic component storage hole 23, the connection hole 25 is provided on the first surface of the base plate 35, and the first connection hole 25 is formed in the connection hole 25. The connection terminal 24 is provided, the second connection terminal 28 is provided at a position corresponding to the connection terminal 24 on the second surface of the base plate 35, the wiring 26 is formed on the base plate 35, and the base plate 35 is provided.
A through hole 27 is provided in the
The connecting terminals 24 and 28 are connected by a wiring 26 and a through hole 27.
【００１２】図６は図４、図５に示したメモリ装置用部
品取付板とともに使用されるメモリ装置用部品取付板を
示す概略図である。図に示すように、基体板３５と同形
状の基体板３１の第１の面に入出力端子３２が形成さ
れ、基体板３１の第１の面に駆動電子部品用端子３３が
形成され、基体板３１の第２の面の接続用端子２４と対
応する位置にメモリ装置用部品取付板２９の接続用端子
２８と同様の接続用端子（図示せず）が形成されてい
る。FIG. 6 is a schematic diagram showing a memory device component mounting plate used together with the memory device component mounting plate shown in FIGS. As shown in the drawing, the input / output terminals 32 are formed on the first surface of the base plate 31 having the same shape as the base plate 35, and the drive electronic component terminals 33 are formed on the first surface of the base plate 31. Connection terminals (not shown) similar to the connection terminals 28 of the memory device component mounting plate 29 are formed at positions corresponding to the connection terminals 24 on the second surface of the plate 31.
【００１３】これらのメモリ装置用部品取付板において
は、メモリ電子部品収納穴２３内にメモリ電子部品（図
示せず）を収納して、メモリ電子部品をメモリ装置用部
品取付板２９に取り付け、図７に示すように、このメモ
リ装置用部品取付板２９を複数枚重ね、一番上にメモリ
装置用部品取付板３４を重ね、隣接するメモリ装置用部
品取付板２９の接続用端子２４と接続用端子２８とを異
方性導電ゴム４１により接続し、メモリ装置用部品取付
板３４に形成された接続用端子とメモリ装置用部品取付
板３４に隣接するメモリ装置用部品取付板２９の接続用
端子２４とを異方性導電ゴム４１により接続して、メモ
リユニットとすれば、メモリ装置用部品取付板２９の枚
数によりメモリユニットのメモリ容量を容易に変更する
ことができ、また図７に示すメモリユニットは図１、図
２に示したメモリ装置用部品取付板にメモリ電子部品９
等を取り付けたメモリユニットと比較して配線が短くな
るから、メモリ装置の処理速度を速くすることができ
る。In these memory device component mounting plates, memory electronic components (not shown) are housed in the memory electronic component housing holes 23, and the memory electronic components are mounted on the memory device component mounting plate 29. As shown in FIG. 7, a plurality of memory device component mounting plates 29 are stacked, a memory device component mounting plate 34 is stacked on top, and the connection terminals 24 of the adjacent memory device component mounting plates 29 are connected. The terminal 28 is connected by the anisotropic conductive rubber 41, and the connection terminal formed on the memory device component mounting plate 34 and the connection terminal of the memory device component mounting plate 29 adjacent to the memory device component mounting plate 34. If 24 and 24 are connected by anisotropic conductive rubber 41 to form a memory unit, the memory capacity of the memory unit can be easily changed depending on the number of memory device component mounting plates 29. The memory unit 1 shown in 7, the memory electronic components 9 in the memory device component attachment plate shown in FIG. 2
Since the wiring is shorter than that of the memory unit to which the like is attached, the processing speed of the memory device can be increased.
【００１４】[0014]
【発明の効果】以上説明したように、第１発明において
は、メモリ電子部品収納穴内にメモリ電子部品を収納す
れば、電子部品を取り付けた状態での厚さが小さいか
ら、メモリ装置をコンパクトにすることができる。As described above, according to the first aspect of the present invention, when the memory electronic component is stored in the memory electronic component storing hole, the thickness of the electronic component mounted is small, so that the memory device can be made compact. can do.
【００１５】また、第２発明においては、メモリ電子部
品収納穴内にメモリ電子部品を収納した複数枚のメモリ
装置用部品取付板を重ね、隣接するメモリ装置用部品取
付板の第１の接続用端子と第２の接続用端子とを接続す
れば、メモリ装置用部品取付板の枚数によりメモリ容量
を容易に変更することができる。In the second aspect of the invention, a plurality of memory device component mounting plates accommodating memory electronic components are stacked in the memory electronic component accommodating holes, and the first connection terminals of the adjacent memory device component mounting plates are stacked. And the second connection terminal, the memory capacity can be easily changed depending on the number of memory device component mounting plates.
【図１】この発明に係るメモリ装置用部品取付板を示す
概略図である。FIG. 1 is a schematic view showing a component mounting plate for a memory device according to the present invention.
【図２】図１のＡ−Ａ拡大断面図である。FIG. 2 is an enlarged sectional view taken along line AA of FIG.
【図３】図１、図２に示したメモリ装置用部品取付板に
メモリ電子部品を取り付けた状態を示す断面図である。FIG. 3 is a cross-sectional view showing a state in which a memory electronic component is mounted on the component mounting plate for the memory device shown in FIGS. 1 and 2.
【図４】この発明に係る他のメモリ装置用部品取付板を
示す概略図である。FIG. 4 is a schematic view showing another component mounting plate for a memory device according to the present invention.
【図５】図４のＢ−Ｂ拡大断面図である。5 is an enlarged sectional view taken along line BB of FIG.
【図６】図４、図５に示したメモリ装置用部品取付板と
ともに使用されるメモリ装置用部品取付板を示す概略図
である。6 is a schematic view showing a component mounting plate for a memory device used together with the component mounting plate for a memory device shown in FIGS. 4 and 5. FIG.
【図７】図４、図６に示したメモリ装置用部品取付板で
構成されたメモリユニットを示す図である。FIG. 7 is a diagram showing a memory unit including the memory device component mounting plate shown in FIGS. 4 and 6;
３…メモリ電子部品収納穴 ９…メモリ電子部品 １３…基体板 ２３…メモリ電子部品収納穴 ２４…第１の接続用端子 ２８…第２の接続用端子 ２９…メモリ装置用部品取付板 ３４…メモリ装置用部品取付板 ３５…基体板 ４１…異方性導電ゴム 3 ... Memory electronic component storage hole 9 ... Memory electronic component 13 ... Base plate 23 ... Memory electronic component storage hole 24 ... First connection terminal 28 ... Second connection terminal 29 ... Memory device component mounting plate 34 ... Memory Device component mounting plate 35 ... Base plate 41 ... Anisotropic conductive rubber
Claims (2)
メモリ装置用部品取付板において、上記基体板に複数の
メモリ電子部品収納穴を設けたことを特徴とするメモリ
装置用部品取付板。1. A component mounting plate for a memory device, wherein a memory electronic component is mounted on a base plate, wherein a plurality of memory electronic component housing holes are provided in the base plate.
メモリ装置用部品取付板において、上記基体板に複数の
メモリ電子部品収納穴を設け、上記基体板の第１の表面
に第１の接続用端子を設け、上記基体板の第２の表面の
上記第１の接続用端子に対応する位置に第２の接続用端
子を設けたことを特徴とするメモリ装置用部品取付板。2. A component mounting plate for a memory device, in which a memory electronic component is mounted on a base plate, wherein a plurality of memory electronic component storage holes are provided in the base plate, and a first connection is provided on a first surface of the base plate. A component mounting plate for a memory device, wherein a terminal is provided, and a second connecting terminal is provided at a position corresponding to the first connecting terminal on the second surface of the base plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6114814A JP2550477B2 (en) | 1994-05-27 | 1994-05-27 | Memory device component mounting plate and memory unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6114814A JP2550477B2 (en) | 1994-05-27 | 1994-05-27 | Memory device component mounting plate and memory unit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07321439A true JPH07321439A (en) | 1995-12-08 |
| JP2550477B2 JP2550477B2 (en) | 1996-11-06 |
Family
ID=14647357
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6114814A Expired - Lifetime JP2550477B2 (en) | 1994-05-27 | 1994-05-27 | Memory device component mounting plate and memory unit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2550477B2 (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6245870U (en) * | 1985-08-27 | 1987-03-19 | ||
| JPS62184775U (en) * | 1986-05-14 | 1987-11-24 | ||
| JPH0197581U (en) * | 1987-12-19 | 1989-06-29 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE879822A (en) * | 1979-02-20 | 1980-03-03 | Erba Farmitalia | ERGOLINE DERIVATIVES |
-
1994
- 1994-05-27 JP JP6114814A patent/JP2550477B2/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6245870U (en) * | 1985-08-27 | 1987-03-19 | ||
| JPS62184775U (en) * | 1986-05-14 | 1987-11-24 | ||
| JPH0197581U (en) * | 1987-12-19 | 1989-06-29 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2550477B2 (en) | 1996-11-06 |
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