JP2013074154A - Multilayer wiring board and manufacturing method of the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a multilayer wiring board which allows high-density wiring without building up layers or bonding multiple pieces of the multilayer wiring boards together to thereby enable cost reduction and secure the yield, and also to provide a manufacturing method of the multilayer wiring board.SOLUTION: The multilayer wiring board comprises: a plurality of wiring layers; an insulating layer arranged between the wiring layers; and an interlayer connection electrically connecting the wiring layers to each other. The plurality of wiring layers include: a surface wiring layer; a plurality of low-density wiring layers arranged in an inner layer on the surface wiring layer side; and a high-density wiring layer arranged on a further inner layer side than the low-density wiring layers. The interlayer connection is formed of a through-hole which penetrates the whole of the multilayer wiring board including the surface wiring layer, the low-density wiring layer and the high-density wiring layers. The diameter of the through-hole is greater in the surface wiring layer and the low-density wiring layer than it is in the high-density wiring layers. The invention also provides a manufacturing method of the multilayer wiring board described above.

Description

  The present invention relates to a multilayer wiring board capable of high-density wiring and a method for manufacturing the same.

  In multilayer wiring boards used for applications such as backboards, as the density increases, the number of wiring layers exceeds 20 layers, and the thickness of the multilayer wiring board exceeds 3 mm. It has become. In such a multi-layer wiring board having a high thickness and a high multi-layer structure, the inner layer board in which wiring layers and interlayer connections between these wiring layers are formed on both sides is laminated and integrated by the number corresponding to the number of necessary wiring layers. After forming the plate, it is common to form a through-hole penetrating the entire laminated plate, and to form an interlayer connection by performing through-hole plating (hereinafter, such a manufacturing method is referred to as “conventional method”). ").

  However, in recent years, higher density has been demanded. As a method to meet this demand, a method of reducing the hole diameter of the through hole and improving the contact of the through hole plating (Patent Document 1), or the conventional method described above. A method of forming a wiring layer and an IVH (Interstitial Via Hole) using a so-called build-up method (Patent Document 2) or a multilayer wiring board formed by a conventional method is pasted on a multilayer wiring board formed by a method. A method of matching (Patent Document 3), and the like are disclosed.

JP 2010-275603 A JP 2004-069692 A Japanese Patent Laid-Open No. 06-326466

  However, in the multilayer wiring board of Patent Document 1, when the wiring layer is a multilayer wiring board having a high thickness such that the wiring layer exceeds 20 layers and the thickness of the multilayer wiring board exceeds 3 mm, The drilling method for forming a through-hole penetrating the entire plate thickness is limited to a drill, and the minimum hole diameter (drill diameter) that can be formed is about 0.2 mm. In addition, in the case of such a small-diameter through hole, there is a problem with the through-hole plating. In the case of a through-hole having a diameter of about 0.2 mm, the plate thickness is about 3 mm (the aspect ratio is about 15). .) Is the limit. Therefore, it is difficult to further increase the density by miniaturizing the through holes.

  In the multilayer wiring board of Patent Document 2, since a build-up layer is provided on the multilayer wiring board formed by the conventional method, the interlayer connection can be formed using IVH as well as through holes. Can be achieved. However, the build-up method tends to reduce the yield as compared with the conventional method, and becomes a large cost problem in a relatively expensive multi-layer wiring board.

  In the multilayer wiring board of Patent Document 3, the multilayer wiring boards formed by the conventional method are bonded together. At that time, the through holes formed in the respective multilayer wiring boards are separated from the IVH in the multilayer wiring board after bonding. Become. For this reason, it is possible to achieve a higher density than forming an interlayer connection with a through hole penetrating the entire plate thickness. However, since the multilayer wiring boards for bonding are separately manufactured, and through holes and plating are also formed on the multilayer wiring boards after bonding, the number of man-hours is still significantly larger than conventional methods. There are increasing problems.

  The present invention has been made in view of the above-mentioned problems, and enables high-density wiring without performing build-up and bonding of multi-layer wiring boards, thereby reducing the cost and ensuring the yield. A substrate and a manufacturing method thereof are provided.

The present invention relates to the following.
1. A multilayer wiring board having a plurality of wiring layers, an insulating layer disposed between these wiring layers, and an interlayer connection for electrically connecting the wiring layers, the plurality of wiring layers being a surface layer A wiring layer, a plurality of low-density wiring layers arranged on the inner layer on the surface wiring layer side, and a high-density wiring layer arranged on the inner layer side of the low-density wiring layer, and the interlayer connection is A through-hole penetrating the entire multilayer wiring board including the surface wiring layer, the low-density wiring layer, and the high-density wiring layer is formed, and the diameter of the through-hole in the surface wiring layer and the low-density wiring layer is high. A multilayer wiring board formed to be larger than the diameter of the through hole in the density wiring layer.
2. In Item 1, the plurality of low-density wiring layers arranged on the inner layer on the surface wiring layer side are V / G layers, and the high-density wiring layer arranged on the inner layer side than the low-density wiring layer is a signal layer. Multilayer wiring board.
3. Item 5. The multilayer wiring board according to item 1 or 2, wherein the inner wall of the through hole has a taper at a location where the diameter of the through hole changes.
4). A multilayer wiring board having a surface wiring layer, a plurality of low density wiring layers arranged on the inner layer on the surface wiring layer side, and a high density wiring layer arranged on the inner layer side from the low density wiring layer is manufactured. Passing through the entire multilayer wiring board including the surface layer wiring layer, the low density wiring layer, and the high density wiring layer, and the diameters of the surface layer wiring layer and the low density wiring layer are the same as those in the high density wiring layer. A method for manufacturing a multilayer wiring board, comprising: a step of forming a through hole larger than a diameter; and a step of forming an interlayer connection by plating the through hole.
5. In Item 4, in the step of forming the through hole, a non-through hole is formed by a drill from one surface layer wiring layer side of the multilayer wiring board, and then the other surface layer wiring layer side of the multilayer wiring board is used by using the drill. Drilling so as to reach the non-through hole, forming a through hole penetrating the entire multilayer wiring board, and using a drill having a diameter larger than the drill at the position of the through hole And a step of drilling from the surface wiring layer side of the multilayer wiring board to the depth of the low density wiring layer.

  According to the present invention, it is possible to provide a multilayer wiring board capable of reducing costs and ensuring a yield by providing high-density wiring without performing build-up or bonding of multilayer wiring boards, and a method for manufacturing the same. Can do.

It is sectional drawing of the multilayer wiring board of the Example of this invention. It is a top view of the signal layer and V / G layer of the multilayer wiring board of the Example of this invention.

  As shown in FIG. 1, the multilayer wiring board of the present invention has a plurality of wiring layers 2, 3, 7 and an insulating layer disposed between these wiring layers 2, 3, 7. A multilayer wiring board 1 having layers 4 and 5 and an interlayer connection 6 for electrically connecting the wiring layers 2, 3, and 7, wherein the plurality of wiring layers 2, 3, and 7 are surface layer wiring layers 7, a plurality of low density wiring layers 3 arranged in the inner layer on the surface wiring layer 7 side, and a high density wiring layer 2 arranged on the inner layer side of the low density wiring layer 3, A connection 6 is formed by through holes 9 and 10 penetrating the entire multilayer wiring board 1 including the surface layer wiring layer 7, the low density wiring layer 3, and the high density wiring layer 2. The diameter of the through hole 10 in the density wiring layer 3 is larger than the diameter of the through hole 9 in the high density wiring layer 2. That is a multilayer wiring substrate 1.

  The wiring layer in the present invention refers to a device on which an electronic component or the like is mounted or an electrical continuity with the mounted electronic component or the like, and can be formed by etching a metal foil or plating. The wiring layer has a surface wiring layer, a plurality of high-density wiring layers arranged on the inner layer on the surface wiring layer side, and a low-density wiring layer arranged on the inner layer side from the high-density wiring layer. Yes.

  The insulating layer is disposed between the wiring layers and maintains the insulation between the wiring layers or supports the wiring layers. If it is used for a general multilayer wiring board, it can be used without any particular limitation, and as such, there are glass epoxy and glass polyimide having a reinforcing material, an epoxy adhesive sheet without a reinforcing material, and the like. Can be mentioned.

  Interlayer connection refers to electrical connection between different wiring layers. Examples include via holes using non-through holes and through holes using through holes, which are used in general multilayer wiring boards. Non-through holes and through-holes can be formed by laser, drilling, punching, etc. used in the production of general multilayer wiring boards. The inner walls of these non-through holes and through-holes can be plated or non-through. Interlayer connection can be formed by, for example, filling a hole or a through hole with plating or a conductive paste.

  The surface layer wiring layer is a wiring layer arranged on the outermost side among the plurality of wiring layers of the multilayer wiring board of the present invention, and is also called an outer layer circuit. In addition to connection terminals for mounting surface-mounted electronic components and lands for mounting insertion components, the surface wiring layer is a wiring (signal line) for electrically connecting these connection terminals and lands. )have.

  The low density wiring layer is a wiring layer including a so-called V / G layer (power supply / ground layer). The V / G layer is a wiring layer used as a common reference for a common power source, ground potential, shield, etc. of an electric circuit. The V / G layer generally has a larger line width than the signal layer. For example, a solid wiring layer excluding the through holes 9 and 10 and the clearance 15 as shown in FIG.

  The high density wiring layer refers to a so-called signal layer, and the signal layer refers to a wiring layer having signal lines. Specifically, it refers to wiring for transmitting electrical signals to and from electronic components mounted on a multilayer wiring board. The signal layer is generally finer in line / space than the V / G layer (power supply / ground layer). For example, as shown in FIG. 2A, the signal layer has a diameter of 0.15 mm at a pitch of 0.4 mm. In the case of having a non-through hole, the signal line has a line width (line) of 0.067 mm and a gap (space) with a land of 0.092 mm.

  The low density wiring layer is disposed on the inner layer on the surface wiring layer side, and the high density wiring layer is disposed on the inner layer side with respect to the low density wiring layer. That is, in the thickness direction of the multilayer wiring board, the low-density wiring layer is arranged on the surface wiring layer side, and the high-density wiring layer is arranged somewhat biased on the inner layer side (center side in the thickness direction). Furthermore, it is desirable that the high-density wiring layer is not disposed on the surface wiring layer side but only on the inner layer side (center side in the plate thickness direction). As a result, an interlayer connection is formed with a relatively large diameter through hole on the surface wiring layer side of the multilayer wiring board, and a relatively small diameter is formed on the inner layer side (center side in the plate thickness direction) of the multilayer wiring board. It is possible to form an interlayer connection with the through hole.

  The interlayer connection is formed by a through hole penetrating the entire multilayer wiring board including the surface layer wiring layer, the low density wiring layer, and the high density wiring layer, and the diameter of the through hole in the surface layer wiring layer and the low density wiring layer is high. It is formed larger than the diameter of the through hole in the density wiring layer. That is, as shown in FIG. 1, the through hole 9 (through hole in the high-density wiring layer) having a diameter 17 of the through-hole in the high-density wiring layer provided on the inner layer side (center side in the plate thickness direction) of the multilayer wiring board 1 is provided. The hole 9) is connected to the through hole 10 (through hole 10 in the low density wiring layer) provided on the surface wiring layer 7 side of the multilayer wiring board 1 and having a through hole diameter 18 in the low density wiring layer. Through-holes 9 and 10 penetrating through the entire thickness direction of the wiring board 1 are formed. Thereby, since the through-holes 10 in the low-density wiring layer having a relatively large diameter are provided on the surface wiring layer 7 side of the through-holes 9 and 10 penetrating the entire multilayer wiring board 1 in the plate thickness direction, Compared with the case where the through-holes 9 are formed in the high-density wiring layer over the entire thickness direction of the multilayer wiring board 1, the plating throwing power at the time of through-hole plating is improved. Therefore, even in the case of a multilayer wiring board having a wiring layer exceeding 20 layers and a thickness exceeding 3 mm, it is easy to form an interlayer connection, and high density can be achieved without performing build-up or lamination of the multilayer wiring boards. Since the wiring can be provided, the cost can be reduced and the yield can be secured.

  It is desirable that the inner wall of the through hole has a taper at a location where the diameter of the through hole changes. Thereby, since the cross-sectional shape of the through hole does not have an acute step, the flow of the plating solution into the through hole becomes smooth at the time of through-hole plating, so that the plating coverage can be improved. . Thus, in order to have a taper on the inner wall of the through hole at a location where the diameter of the through hole changes, after forming the through hole with a drill blade having a small diameter, on the same axis as this through hole, This can be realized by a method of drilling halfway through the plate thickness using a drill blade having a larger diameter.

  As a method for manufacturing a multilayer wiring board according to the present invention, a surface layer wiring layer, a plurality of low density wiring layers disposed in an inner layer on the surface layer wiring layer side, and a high layer disposed on an inner layer side from the low density wiring layer are provided. A multilayer wiring board having a density wiring layer; and the entire multilayer wiring board including the surface wiring layer, the low density wiring layer, and the high density wiring layer, and the surface layer wiring layer and the low density wiring layer. A method for manufacturing a multilayer wiring board, comprising: a step of forming a through hole having a diameter in the wiring layer larger than a diameter in the high-density wiring layer; and a step of forming an interlayer connection by plating the through hole. Can be mentioned.

  Further, the multilayer wiring board including the surface layer wiring layer, the low density wiring layer, and the high density wiring layer is penetrated, and the diameter of the surface layer wiring layer and the low density wiring layer is larger than the diameter of the high density wiring layer. In the step of forming a through hole that forms a large through hole, a non-through hole is formed by a drill from one surface layer wiring layer side of the multilayer wiring board, and then the other surface layer wiring layer of the multilayer wiring board is used by using the drill Drilling so as to reach the non-through hole from the side, forming a through hole penetrating the entire multilayer wiring board, and using a drill having a diameter larger than the drill at the position of the through hole And a step of drilling from the surface wiring layer side of the multilayer wiring board to the depth of the low density wiring layer.

  First, MCL-E-679 (manufactured by Hitachi Chemical Co., Ltd.) having a length of 510 mm, a width of 615 mm, and a thickness of 0.1 mm obtained by bonding a copper foil having a thickness of 18 μm to both surfaces of a core material to be an insulating layer. As many product numbers as the number of wiring layers required are prepared. As a dry film, an etching resist is formed using FOTEC SL-1329 (manufactured by Hitachi Chemical Co., Ltd., product name, “FOTEC” is a registered trademark), and etching is performed with a ferric chloride etchant to obtain a high density. Inner layer plates each having a wiring layer and a low-density wiring layer were formed. Here, in the high-density wiring layer, holes having a diameter of 0.15 mm are arranged at a pitch of 0.4 mm, and one wiring is formed between the holes having a pitch of 0.4 mm. The narrowest line / space is 0.067 mm / 0.092 mm. In the low density wiring layer, V / G lines are formed. The thicknesses of the high-density wiring layer and the low-density wiring layer were both finished at 15 μm.

  Next, GEA-679 (manufactured by Hitachi Chemical Co., Ltd., product name) is sandwiched between the inner layer plate and the inner layer plate, and between the inner layer plate and the copper foil (thickness 18 μm) serving as the surface wiring layer. Then, a hot press was performed under the conditions of a molding temperature of 175 ° C., a pressure of 2.5 MPa, and a molding time of 126 minutes. As a result, a multilayer wiring board having 38 wiring layers, a plate thickness of 4.0 mm, and an insulating layer thickness immediately below the surface wiring layer of 0.06 mm was produced.

  Next, a drill blade with a diameter of 0.15 mm is attached to ND-2RS410 (product name, manufactured by Hitachi Via Mechanics Co., Ltd.), which is an NC machine that performs drilling, and a board is formed from one surface wiring layer side of the multilayer wiring board. After drilling to a depth exceeding half of the thickness to form a non-through hole, this time drilling to connect to the previously formed non-through hole from the other surface wiring layer side of the multilayer wiring board A through hole having a diameter of 0.15 mm penetrating the entire multilayer wiring board was formed.

  Next, a drill blade having a diameter of 0.2 mm is attached to ND-2RS410 (product name, manufactured by Hitachi Via Mechanics Co., Ltd.), which is an NC machine that performs drilling, and a diameter of 0.15 mm that penetrates the entire multilayer wiring board. After drilling from the one surface wiring layer side of the multilayer wiring board to the depth range of the low density wiring layer at the position of the through hole of the multilayer wiring board, this time the low density from the other surface wiring layer side of the multilayer wiring board Drilling was performed up to the depth of the wiring layer. As a result, the entire multilayer wiring board including the surface wiring layer, the low density wiring layer, and the high density wiring layer is penetrated, and the diameter in the surface layer wiring layer and the low density wiring layer is larger than the diameter in the high density wiring layer. A hole was formed.

  Next, by electroless copper plating, copper plating having a thickness of 30 μm was formed in the non-through hole opened by the NC machine.

  An etching resist is formed as a dry film using Photec SL-1329 (manufactured by Hitachi Chemical Co., Ltd., product name, “FOTEC” is a registered trademark), and etching with a copper chloride etchant is performed to form a surface wiring layer. Then, the multilayer wiring board 1 shown in FIG. 1 was formed.

1. 1. Multilayer wiring board High-density wiring layer (signal layer)
3. Low density wiring layer (V / G layer)
4). Insulating layer (prepreg)
5. Insulation layer (core material)
6). Interlayer connection7. Surface wiring layer (outer layer circuit)
9. Through hole (in high density wiring layer) 10. Through hole (in low density wiring layer) 12. Signal line 13. Land 14. V / G
15. Clearance 16. Through hole pitch 17. Diameter of through hole (in high density wiring layer) 18. Diameter of through hole (in low density wiring layer) 19. Signal line width

Claims (5)

  A multilayer wiring board having a plurality of wiring layers, an insulating layer disposed between these wiring layers, and an interlayer connection for electrically connecting the wiring layers, the plurality of wiring layers being a surface layer A wiring layer, a plurality of low-density wiring layers arranged on the inner layer on the surface wiring layer side, and a high-density wiring layer arranged on the inner layer side of the low-density wiring layer, and the interlayer connection is A through-hole penetrating the entire multilayer wiring board including the surface wiring layer, the low-density wiring layer, and the high-density wiring layer is formed, and the diameter of the through-hole in the surface wiring layer and the low-density wiring layer is high. A multilayer wiring board formed to be larger than the diameter of the through hole in the density wiring layer.   2. The plurality of low density wiring layers arranged in the inner layer on the surface wiring layer side are V / G layers, and the high density wiring layer arranged on the inner layer side of the low density wiring layer is a signal layer. A multilayer wiring board.   3. The multilayer wiring board according to claim 1, wherein an inner wall of the through hole has a taper at a portion where the diameter of the through hole changes.   A multilayer wiring board having a surface wiring layer, a plurality of low density wiring layers arranged on the inner layer on the surface wiring layer side, and a high density wiring layer arranged on the inner layer side from the low density wiring layer is manufactured. Passing through the entire multilayer wiring board including the surface layer wiring layer, the low density wiring layer, and the high density wiring layer, and the diameters of the surface layer wiring layer and the low density wiring layer are the same as those in the high density wiring layer. A method for manufacturing a multilayer wiring board, comprising: a step of forming a through hole larger than a diameter; and a step of forming an interlayer connection by plating the through hole.   5. The step of forming a through hole according to claim 4, wherein a non-through hole is formed with a drill from one surface layer wiring layer side of the multilayer wiring board, and then the other surface layer wiring layer side of the multilayer wiring board is used with the drill. Drilling so as to reach the non-through hole, and forming a through hole penetrating the entire multilayer wiring board, and using a drill having a larger diameter than the drill at the position of the through hole Drilling the surface of the multilayer wiring board from the surface wiring layer side to the depth of the low-density wiring layer.

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