JPS5929071U - Inner layer structure of multilayer printed wiring board - Google Patents

Inner layer structure of multilayer printed wiring board

Info

Publication number
JPS5929071U
JPS5929071U JP12314882U JP12314882U JPS5929071U JP S5929071 U JPS5929071 U JP S5929071U JP 12314882 U JP12314882 U JP 12314882U JP 12314882 U JP12314882 U JP 12314882U JP S5929071 U JPS5929071 U JP S5929071U
Authority
JP
Japan
Prior art keywords
inner layer
wiring board
printed wiring
multilayer printed
layer structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12314882U
Other languages
Japanese (ja)
Inventor
石渡　良晴
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP12314882U priority Critical patent/JPS5929071U/en
Publication of JPS5929071U publication Critical patent/JPS5929071U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の多層印刷配線板の構成を示す図で、第
２図は本考案の多層印刷配線板の断面図である。 １・・・外層、２・・・内層、３ａ・・・第１内層パタ
ーン、３ｂ・・・第２内層パターン、４・・・銅箔除去
部、５・・・銅箔を除去しない部分、６．　７．　８・
・・スルーホール。FIG. 1 is a diagram showing the structure of the multilayer printed wiring board of the present invention, and FIG. 2 is a sectional view of the multilayer printed wiring board of the present invention. DESCRIPTION OF SYMBOLS 1... Outer layer, 2... Inner layer, 3a... First inner layer pattern, 3b... Second inner layer pattern, 4... Copper foil removed portion, 5... Portion where copper foil is not removed. 6. 7. 8・
...Through hole.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] パターンを構成された内層と、この内層の両側を挾む外
層とを有する多層印刷配線板の内層構造において、内層
に構成されたパターンの基本格子が交差する部位に円形
もしくは多角形状の銅箔除去部を設けたことを特徴とす
る多層印刷配線板の内層構造。In the inner layer structure of a multilayer printed wiring board that has an inner layer configured with a pattern and an outer layer sandwiching both sides of this inner layer, a circular or polygonal copper foil is removed at the intersection of the basic grid of the pattern configured on the inner layer. An inner layer structure of a multilayer printed wiring board characterized by having a section.
JP12314882U 1982-08-13 1982-08-13 Inner layer structure of multilayer printed wiring board Pending JPS5929071U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12314882U JPS5929071U (en) 1982-08-13 1982-08-13 Inner layer structure of multilayer printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12314882U JPS5929071U (en) 1982-08-13 1982-08-13 Inner layer structure of multilayer printed wiring board

Publications (1)

Publication Number Publication Date
JPS5929071U true JPS5929071U (en) 1984-02-23

Family

ID=30281224

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12314882U Pending JPS5929071U (en) 1982-08-13 1982-08-13 Inner layer structure of multilayer printed wiring board

Country Status (1)

Country Link
JP (1) JPS5929071U (en)

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