JPH01157438U - - Google Patents

Info

Publication number
JPH01157438U
JPH01157438U JP4669988U JP4669988U JPH01157438U JP H01157438 U JPH01157438 U JP H01157438U JP 4669988 U JP4669988 U JP 4669988U JP 4669988 U JP4669988 U JP 4669988U JP H01157438 U JPH01157438 U JP H01157438U
Authority
JP
Japan
Prior art keywords
package
terminals
wiring board
convex portion
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4669988U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4669988U priority Critical patent/JPH01157438U/ja
Publication of JPH01157438U publication Critical patent/JPH01157438U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例である。 図において、1はICパツケージ、2は端子、
3は凸部、8はフツトプリント、9は印刷配線板
である。
FIG. 1 shows an embodiment of the present invention. In the figure, 1 is an IC package, 2 is a terminal,
3 is a convex portion, 8 is a foot print, and 9 is a printed wiring board.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ICパツケージ1を印刷配線板9へ実装時に、
該ICパツケージ1の外周、端子2の配設辺に、
先端がフツトプリント8の間を絶縁する如く表面
に接する凸部3を、該端子2の配設に見合つて備
えたことを特徴とする表面実装型ICパツケージ
When mounting the IC package 1 on the printed wiring board 9,
On the outer periphery of the IC package 1, on the side where the terminals 2 are arranged,
A surface mount type IC package characterized in that a convex portion 3 whose tip is in contact with the surface so as to insulate between footprints 8 is provided in a manner commensurate with the arrangement of the terminals 2.
JP4669988U 1988-04-06 1988-04-06 Pending JPH01157438U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4669988U JPH01157438U (en) 1988-04-06 1988-04-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4669988U JPH01157438U (en) 1988-04-06 1988-04-06

Publications (1)

Publication Number Publication Date
JPH01157438U true JPH01157438U (en) 1989-10-30

Family

ID=31272955

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4669988U Pending JPH01157438U (en) 1988-04-06 1988-04-06

Country Status (1)

Country Link
JP (1) JPH01157438U (en)

Similar Documents

Publication Publication Date Title
JPH01157438U (en)
JPH01157437U (en)
JPH01161355U (en)
JPH0284371U (en)
JPH0221754U (en)
JPS6265876U (en)
JPH0170351U (en)
JPS62151777U (en)
JPH01161361U (en)
JPH0215702U (en)
JPS6323727U (en)
JPS61173172U (en)
JPH01140770U (en)
JPH0444161U (en)
JPH01129873U (en)
JPH0345U (en)
JPS61157369U (en)
JPH0166763U (en)
JPH0256477U (en)
JPH03128952U (en)
JPS6296882U (en)
JPH0241470U (en)
JPS61199684U (en)
JPS6360285U (en)
JPH0313768U (en)