JPH01157438U - - Google Patents
Info
- Publication number
- JPH01157438U JPH01157438U JP4669988U JP4669988U JPH01157438U JP H01157438 U JPH01157438 U JP H01157438U JP 4669988 U JP4669988 U JP 4669988U JP 4669988 U JP4669988 U JP 4669988U JP H01157438 U JPH01157438 U JP H01157438U
- Authority
- JP
- Japan
- Prior art keywords
- package
- terminals
- wiring board
- convex portion
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第1図は本考案の一実施例である。
図において、1はICパツケージ、2は端子、
3は凸部、8はフツトプリント、9は印刷配線板
である。
FIG. 1 shows an embodiment of the present invention. In the figure, 1 is an IC package, 2 is a terminal,
3 is a convex portion, 8 is a foot print, and 9 is a printed wiring board.
Claims (1)
該ICパツケージ1の外周、端子2の配設辺に、
先端がフツトプリント8の間を絶縁する如く表面
に接する凸部3を、該端子2の配設に見合つて備
えたことを特徴とする表面実装型ICパツケージ
。 When mounting the IC package 1 on the printed wiring board 9,
On the outer periphery of the IC package 1, on the side where the terminals 2 are arranged,
A surface mount type IC package characterized in that a convex portion 3 whose tip is in contact with the surface so as to insulate between footprints 8 is provided in a manner commensurate with the arrangement of the terminals 2.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4669988U JPH01157438U (en) | 1988-04-06 | 1988-04-06 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4669988U JPH01157438U (en) | 1988-04-06 | 1988-04-06 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01157438U true JPH01157438U (en) | 1989-10-30 |
Family
ID=31272955
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4669988U Pending JPH01157438U (en) | 1988-04-06 | 1988-04-06 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01157438U (en) |
-
1988
- 1988-04-06 JP JP4669988U patent/JPH01157438U/ja active Pending