JPH01157437U - - Google Patents
Info
- Publication number
- JPH01157437U JPH01157437U JP4669888U JP4669888U JPH01157437U JP H01157437 U JPH01157437 U JP H01157437U JP 4669888 U JP4669888 U JP 4669888U JP 4669888 U JP4669888 U JP 4669888U JP H01157437 U JPH01157437 U JP H01157437U
- Authority
- JP
- Japan
- Prior art keywords
- package
- terminals
- groove
- wiring board
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009434 installation Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の一実施例である。
図において、１はＩＣパツケージ、２は端子、
３は溝、４は配設側面、８はフツトプリント、９
は印刷配線板である。
FIG. 1 shows an embodiment of the present invention. In the figure, 1 is an IC package, 2 is a terminal,
3 is the groove, 4 is the installation side, 8 is the foot print, 9
is a printed wiring board.
Claims (1)
の隣接該端子２間に、印刷配線板９の表面に対し
て垂直な溝３を設けたことを特徴とする表面実装
型ＩＣパツケージ。 Outer periphery of IC package 1, side surface 4 where terminals 2 are arranged
A surface mount type IC package characterized in that a groove 3 perpendicular to the surface of a printed wiring board 9 is provided between the adjacent terminals 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4669888U JPH01157437U (en) | 1988-04-06 | 1988-04-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4669888U JPH01157437U (en) | 1988-04-06 | 1988-04-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01157437U true JPH01157437U (en) | 1989-10-30 |
Family
ID=31272954
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4669888U Pending JPH01157437U (en) | 1988-04-06 | 1988-04-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01157437U (en) |
-
1988
- 1988-04-06 JP JP4669888U patent/JPH01157437U/ja active Pending