JPS6359375U - - Google Patents
Info
- Publication number
- JPS6359375U JPS6359375U JP15398686U JP15398686U JPS6359375U JP S6359375 U JPS6359375 U JP S6359375U JP 15398686 U JP15398686 U JP 15398686U JP 15398686 U JP15398686 U JP 15398686U JP S6359375 U JPS6359375 U JP S6359375U
- Authority
- JP
- Japan
- Prior art keywords
- land portion
- printed wiring
- wiring board
- hole
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims 2
- 239000004020 conductor Substances 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Description
第１図は本考案に係るプリント配線基板の要部
の平面図、第２図は本考案に係るプリント配線基
板にダイオードを実装して示す断面図、第３図及
び第４図はそれぞれ本考案の他の実施例を示す平
面図、第５図乃至第７図はそれぞれ従来のプリン
ト配線基板の要部を示す平面図、第８図は第５図
のプリント配線基板に絶縁性印刷インクを設けた
状態を示す平面図である。
１０……孔、１１……ランド部、１２ａ〜１２
ｃ……導体パターン、１３……ソルダーレジスト
、１４……シンボルマーク、１４ａ，１４ａ′…
…絶縁部、１４ｂ，１４ｃ，１４ｄ……表示部。
Fig. 1 is a plan view of the main parts of the printed wiring board according to the present invention, Fig. 2 is a sectional view showing the printed wiring board according to the present invention with a diode mounted thereon, and Figs. 3 and 4 are respectively the main parts of the printed wiring board according to the present invention. FIGS. 5 to 7 are plan views showing main parts of conventional printed wiring boards, respectively, and FIG. 8 is a plan view showing other embodiments of the printed wiring board shown in FIG. FIG. 10... Hole, 11... Land portion, 12a-12
c... Conductor pattern, 13... Solder resist, 14... Symbol mark, 14a, 14a'...
...Insulating section, 14b, 14c, 14d...Display section.
Claims (1)
周囲に設けられて前記リード線と接続されるラン
ド部と、該ランド部の近傍に設けられている導体
パターン上に設けられているソルダーレジストと
、該ソルダーレジスト上に設けられて前記電子部
品を表示するシンボルマークとを備えるプリント
配線基板であつて、前記シンボルマークは前記ラ
ンド部側の端部に絶縁部が形成され、中央に表示
部が形成されていることを特徴とするプリント配
線基板。 A hole into which a lead wire of an electronic component is inserted, a land portion provided around the hole and connected to the lead wire, and a solder provided on a conductive pattern provided near the land portion. A printed wiring board comprising a resist and a symbol mark provided on the solder resist to display the electronic component, wherein the symbol mark has an insulating portion formed at an end on the land portion side and is displayed in the center. 1. A printed wiring board characterized in that a portion is formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15398686U JPS6359375U (en) | 1986-10-07 | 1986-10-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15398686U JPS6359375U (en) | 1986-10-07 | 1986-10-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6359375U true JPS6359375U (en) | 1988-04-20 |
Family
ID=31073371
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15398686U Pending JPS6359375U (en) | 1986-10-07 | 1986-10-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6359375U (en) |
-
1986
- 1986-10-07 JP JP15398686U patent/JPS6359375U/ja active Pending
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