JPH0345676U - - Google Patents
Info
- Publication number
- JPH0345676U JPH0345676U JP10770289U JP10770289U JPH0345676U JP H0345676 U JPH0345676 U JP H0345676U JP 10770289 U JP10770289 U JP 10770289U JP 10770289 U JP10770289 U JP 10770289U JP H0345676 U JPH0345676 U JP H0345676U
- Authority
- JP
- Japan
- Prior art keywords
- view
- perspective
- showing
- laser device
- semiconductor laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 10
- 230000003287 optical effect Effects 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Description
第１図Ａ，Ｂは本考案を半導体レーザ装置に適
用した第１の実施例を示し、同図Ａは斜視図、同
図Ｂは断面図、第２図Ａ，Ｂは第１の実施例の半
導体レーザ装置の製造方法を工程順に示すもので
、同図Ａはボンデイング終了後における状態を示
す斜視図、同図Ｂは筒状部形成後における状態を
示す斜視図、第３図Ａ乃至Ｃは基板の各別の変形
例を示す斜視図、第４図は本考案を半導体レーザ
装置に適用した第２の実施例を示す斜視図、第５
図は本考案を半導体レーザ装置に適用した第３の
実施例を示す斜視図、第６図Ａ，Ｂは第５図に示
した半導体レーザ装置の各別の変形例を示す斜視
図、第７図は本考案を半導体レーザ装置に適用し
た第４の実施例を示す斜視図、第８図は本考案を
半導体レーザ装置に適用した第５の実施例を示す
断面図である。
符号の説明、１……基板、５……光半導体素子
、７……筒状部。
1A and 1B show a first embodiment in which the present invention is applied to a semiconductor laser device, FIG. 1A is a perspective view, FIG. 1B is a sectional view, and FIGS. 2A and B are the first embodiment. Figure 3A is a perspective view showing the state after the bonding is completed, Figure B is a perspective view showing the state after the cylindrical part is formed, and Figures 3A to 3C show the manufacturing method of the semiconductor laser device in the order of steps. 4 is a perspective view showing different modified examples of the substrate, FIG. 4 is a perspective view showing a second embodiment in which the present invention is applied to a semiconductor laser device, and FIG.
The figure is a perspective view showing a third embodiment in which the present invention is applied to a semiconductor laser device, FIGS. 6A and 6B are perspective views showing different modifications of the semiconductor laser device shown in FIG. 5, and FIG. The figure is a perspective view showing a fourth embodiment in which the present invention is applied to a semiconductor laser device, and FIG. 8 is a sectional view showing a fifth embodiment in which the present invention is applied to a semiconductor laser device. Explanation of symbols: 1...Substrate, 5...Optical semiconductor element, 7... Cylindrical part.
Claims (1)
る ことを特徴とする光半導体装置。[Claims for Utility Model Registration] An optical semiconductor device comprising: a cylindrical portion formed in a part of a substrate; and an optical semiconductor element mounted within the cylindrical portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10770289U JP2501811Y2 (en) | 1989-09-12 | 1989-09-12 | Optical semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10770289U JP2501811Y2 (en) | 1989-09-12 | 1989-09-12 | Optical semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0345676U true JPH0345676U (en) | 1991-04-26 |
| JP2501811Y2 JP2501811Y2 (en) | 1996-06-19 |
Family
ID=31656382
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10770289U Expired - Fee Related JP2501811Y2 (en) | 1989-09-12 | 1989-09-12 | Optical semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2501811Y2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006303384A (en) * | 2005-04-25 | 2006-11-02 | Shinko Electric Ind Co Ltd | Stem for optical semiconductor device, and the optical semiconductor device |
| JP2009135269A (en) * | 2007-11-30 | 2009-06-18 | Shinko Electric Ind Co Ltd | Package for optical semiconductor element and optical semiconductor device |
| KR101271134B1 (en) * | 2011-12-27 | 2013-06-04 | 삼성중공업 주식회사 | Moonpool hose transfer apparatus and drilling ship having the same |
-
1989
- 1989-09-12 JP JP10770289U patent/JP2501811Y2/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006303384A (en) * | 2005-04-25 | 2006-11-02 | Shinko Electric Ind Co Ltd | Stem for optical semiconductor device, and the optical semiconductor device |
| JP2009135269A (en) * | 2007-11-30 | 2009-06-18 | Shinko Electric Ind Co Ltd | Package for optical semiconductor element and optical semiconductor device |
| KR101271134B1 (en) * | 2011-12-27 | 2013-06-04 | 삼성중공업 주식회사 | Moonpool hose transfer apparatus and drilling ship having the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2501811Y2 (en) | 1996-06-19 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |