JPH05243540A - Solid-state image sensing element and its manufacture - Google Patents

Abstract

PURPOSE:To prevent unnecessary light from falling on a photo-detecting surface of a sensor chip by preventing light from entering from the rear of a package of a solid-state image sensing element of resin mold type. CONSTITUTION:A side whereon a sensor chip 1 of a lead frame is mounted is covered with light transmitting resin 31 and the opposite side thereof is covered with non-light transmitting resin to form a resin package. Thereby, an island part 2a and a lead part 2b of a lead frame is covered with non-light transmitting resin 32 to prevent light from entering from the rear side of a resin package and to prevent light reflection at the lead frame simultaneously. A side surface of the package is screened being covered with a lens mount 41 of an optical lens 40.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a resin mold type CC.
The present invention relates to a solid-state image sensor such as a D image sensor and a method for manufacturing the same.

[0002]

2. Description of the Related Art Conventionally, a ceramic package used for a solid-state image pickup device such as a CCD image sensor is one of the factors that increase the manufacturing cost of the solid-state image pickup device because the assembly process is complicated and the ceramic package itself is expensive. Has become. Therefore, as a method of reducing the manufacturing cost of the solid-state imaging device, it is considered to form the package with a translucent resin. Molding the sensor chip with a light-transmissive resin to form a solid-state image sensor simplifies the assembly process and makes the material itself cheaper than when using a ceramic package. It can be significantly reduced.

FIG. 6 is a cross-sectional view of a solid-state image pickup device in which a package is formed of translucent resin. The sensor chip 1 in which a plurality of photoelectric conversion elements are arranged in a matrix is mounted on the island portion 2a of the lead frame 2, and the lead frame 2 is attached to the input / output pad of the sensor chip 1.
The lead portion 2b is connected via a wire such as a gold wire.
Then, the sensor chip 1 is molded together with the island portion 2a by the translucent resin package 3. The resin package 3 is provided with a positioning hole 4 (which may be a cutout in some cases) for mounting the solid-state imaging device on the substrate. Further, since the resin package 3 has lower hardness and is more likely to be damaged than glass or the like, a glass plate 5 for surface protection is mounted on the surface of the resin package 3 facing the light receiving surface of the sensor chip 1. ..

The solid-state image pickup device using such a resin package 3 does not require a complicated assembling process as in a solid-state image pickup device using a ceramic package, and the material of the package itself is cheaper than ceramics. However, light shielding for preventing unnecessary light from hitting the light receiving surface of the sensor chip 1 becomes a problem. That is, in the solid-state imaging device molded by the transparent resin package 3, light entering from the side surface or the back surface of the resin package 3 is reflected by the lead frame 2 or a wire connecting the lead frame 2 and the sensor chip 1, Since it hits the light receiving surface of the chip 1, it is necessary to shield the side surface and the back surface of the resin package 3 from light. Therefore, the applicant of the present application has proposed Japanese Patent Application No. 3-249706 with a solid-state imaging device in which unwanted light is prevented from entering from the side surface and the back surface of the package.

7 to 9 are cross-sectional views illustrating a method of manufacturing a solid-state image pickup device in which light is prevented from entering from the side surface and the back surface of the package. The lead frame 2 includes an island portion 2a on which the sensor chip 1 is mounted, lead portions 2b arranged around the island portion 2a, and a lead portion 2b.
The sensor chip 1 is attached to the island portion 2a, the input / output pad of the sensor chip 1 and the tip of the lead portion 2b are connected by a wire, and the lead portion 2b is connected to the island portion 2a. Can be folded vertically. Recess 1 of mold 10 forming resin package 3
An opening 1 for accommodating a glass plate 5 serving as a protective plate
2 is provided, and the glass plate 5 is arranged so as to be supported by a step on the periphery of the opening 12. Also, the recess 1
2 is provided with a projecting portion 13 corresponding to the through hole 4 of the resin package 3 and fixing the island portion 2a of the lead frame 2. The lead frame 2 is recessed by fitting the island portion 2a into the projecting portion 13. It is stored in 11.

Subsequently, as shown in FIG. 8, a thermosetting translucent resin 21 is filled between the light receiving surface of the sensor chip 1 in the recess 11 and the glass plate 5. This translucent resin 21
Is injected without excess or deficiency so as not to create a gap between the sensor chip 1 and the glass plate 5 and to prevent a large amount from protruding from the glass plate 5. Then, only the surface of the translucent resin 21 is cured by heat treatment for a short time.

Next, as shown in FIG. 9, the inside of the recess 11 is filled with the non-translucent resin 22 so as to cover the semi-cured translucent resin 21. This non-translucent resin 22 is
Since the peripheral portions of the sensor chip 1 and the glass plate 5 are in contact with the translucent resin 21, the same material as that of the translucent resin 21 is taken into consideration in consideration of the adhesion to the translucent resin 21 and the contraction rate of each other. Is obtained by coloring with a black dye. Then, the non-translucent resin 22 is heat-treated together with the translucent resin 21 to be completely cured to form the resin package 20. After the resin package 20 is formed, the resin package is taken out of the mold 10 and the outer frame 2 of the lead frame 2 is removed.
The solid-state image sensor is completed by cutting c.

According to the manufacturing method described above, the light-shielding property is excellent by adding the step of injecting the translucent resin 21 as shown in FIG. 3 without using a special manufacturing jig. A solid-state image sensor can be obtained.

[0009]

However, according to the above-described manufacturing method, the amount of resin injected in the step of injecting the translucent resin 21 into the gap between the sensor chip 1 and the glass plate 5 can be controlled. It is difficult, and further, the condition setting of the heat treatment for once hardening the translucent resin 21 becomes strict, so that the production yield is not stable, and as a result, the yield is lowered and the production cost is sufficiently reduced. I can't.

Therefore, an object of the present invention is to facilitate the work in each step and to stabilize the manufacturing yield.

[0011]

The present invention has been made to solve the above-mentioned problems, and has a first feature that it is a semiconductor in which a plurality of photoelectric conversion elements are arranged in a matrix. A lead frame composed of a chip, an island portion to which the semiconductor chip is mounted, and a lead portion that is bent substantially perpendicular to the island portion and is electrically connected to an input / output pad of the semiconductor chip;
A solid-state imaging device comprising: a thermosetting resin that seals the semiconductor chip together with the island portion to form a package, wherein the thermosetting resin is a surface of the lead frame on which the semiconductor chip is mounted. And a non-translucent second resin covering the back surface side of the lead frame.

A second feature is that a semiconductor chip having a plurality of photoelectric conversion elements arranged in a matrix is mounted on an island portion of a lead frame, and the lead portion of the lead frame is attached to the semiconductor chip. And the substantially vertical bending step, and the lead frame in which the semiconductor chip is mounted in the recess forming the package is housed, and at least the gap between the bottom of the recess and the semiconductor chip is transparent to the first thermosetting resin. And a step of filling the remaining concave portion with a non-translucent second thermosetting resin, and heating with the first thermosetting resin to heat the first and second thermosetting resins. Hardening to seal the semiconductor chip together with the island portion of the lead frame.

[0013]

According to the present invention, the back surface side of the island portion of the lead frame on which the semiconductor chip is mounted has the second non-translucent surface.
The light-receiving surface of the semiconductor chip is prevented from being irradiated with unnecessary light incident from the back surface side of the package, and at the same time, the amount of the light-transmitting first thermosetting resin is excessive or insufficient. In the case of occurrence of light, the non-translucent second thermosetting resin does not wrap around to the light-receiving surface side of the semiconductor chip, so that the conditions for controlling the amount of resin injected and the heat treatment in the manufacturing process are relaxed. To be done.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a plan view of a solid-state image sensor according to the present invention.
FIG. 2 is a sectional view taken along the line XY. In these drawings, the sensor chip 1 and the lead frame 2 are the same as those in FIG. 6, and the same parts are designated by the same reference numerals. A feature of the present invention is that the package 30 is composed of a transparent resin 31 and a non-transparent resin 32, and the side corresponding to the light receiving surface of the sensor chip 1 is covered with the transparent resin 31. However, the back side of the sensor chip 1 is covered with the non-translucent resin 22. That is, the translucent resin 31 and the non-translucent resin 32 are connected to the island portion 2 a of the lead frame 2.
Are used as boundaries to form the package 30 and mainly shield unnecessary light entering from the back surface side of the package 30. In addition, the transparent resin 3 of the resin package 30
As in FIG. 6, a glass plate 5 for resin protection is mounted on the surface of the portion 0, and a positioning hole 33 (a cutout in some cases) for mounting the solid-state imaging device on the substrate is formed. Is provided. The hole 33 is formed from the resin 31 side of the package 30 to the middle of the resin 32,
Through this hole 33, unnecessary light is prevented from leaking from the back surface side of the package 30.

Accordingly, the island portion 2a and the lead portion 2b of the lead frame 2 are partially covered with the non-translucent resin 22 from the peripheral portion of the light receiving surface of the sensor chip 1, and the light from the rear surface side of the resin package 30 is irradiated. Is prevented, and at the same time, reflection of light on the lead frame 2 is prevented. In the solid-state image sensor in which such a package 30 is adopted,
Light will enter from the side surface of the package 30, but normally when the solid-state imaging device is used in the device,
As shown in FIG. 3, since it is covered with the lens mount 41 for mounting the optical lens 40 for forming a subject image on the light receiving surface of the sensor chip 1, unnecessary light is emitted to the side surface of the package 30. There is no such thing and there is no practical problem.

4 and 5 are sectional views showing a method of manufacturing the solid-state image pickup device of the present invention. The lead frame 2 is housed in the recess 11 of the mold 10 after the sensor chip 1 is mounted on the island portion 2a and the lead portion 2b is bent perpendicularly to the sensor chip 1. This mold 10
6 is the same as FIG. 6, and the glass plate 5 is arranged in the opening 12 provided on the bottom surface of the recess 11. The lead frame 2 in which the sensor chip 1 is mounted in the recess 11 of the mold 10.
The process up to housing is the same as the conventional process shown in FIG.

Subsequently, as shown in FIG. 4, a thermosetting translucent resin 31 is filled between the lead frame 2 and the bottom surface of the mold 10. The light-transmissive resin 21 is injected in an amount sufficient to cover the sensor chip 1. At this time, the island portion 2a on which the sensor chip 1 is mounted
By setting the tip of the lead portion 2b closer to the bottom surface of the mold 10 than the tip portion of the lead portion 2b,
It is easy to cover only the sensor chip 1. Then, only the surface portion of the translucent resin 31 is cured by heat treatment for a short time.

Next, as shown in FIG. 5, the semi-cured translucent resin 31 and the lead portion 2b are covered so that the remaining recess 11 is filled with the non-translucent resin 32. Since the non-translucent resin 32 covers the lead portion 2b exposed from the resin 31, reflection of light on the leads 2b and the like is prevented. Further, since the resin 32 adheres to the resin 31 in the gap between the lead portions 2b, the resin 31 is similar to that shown in FIG.
Considering the adhesiveness with and the contraction rate of each other, the translucent resin 31
It is obtained by coloring the same material as above with a black dyeing agent.
After that, the non-translucent resin 32 is heat-treated together with the translucent resin 31 to be completely cured to form the resin package 30, and after the resin package 30 is cured, the resin package 30 together with the lead frame 2 is molded. Then, the outer frame 2c of the lead frame 2 is cut.

According to the manufacturing method as described above, in the process of injecting the resin 31 as shown in FIG. 4, even if the amount of the resin 31 is excessive or insufficient, defects are less likely to occur,
Manufacturing yield is stable.

[0020]

According to the present invention, since the manufacturing yield when the sensor chip is molded with the resin package can be stabilized, the manufacturing cost of the solid-state image pickup element is greatly reduced together with the cost reduction of the package itself. be able to.

[Brief description of drawings]

FIG. 1 is a plan view of a solid-state image sensor according to the present invention.

FIG. 2 is a sectional view of a solid-state image sensor according to the present invention.

FIG. 3 is a cross-sectional view illustrating a method for mounting a solid-state image sensor according to the present invention.

FIG. 4 is a cross-sectional view illustrating the first step of the method for manufacturing a solid-state image sensor according to the present invention.

FIG. 5 is a cross-sectional view illustrating a second step of the method for manufacturing a solid-state image sensor according to the present invention.

FIG. 6 is a cross-sectional view of a conventional solid-state image sensor.

FIG. 7 is a cross-sectional view illustrating a first step of a conventional method for manufacturing a solid-state image sensor.

FIG. 8 is a cross-sectional view illustrating the second step of the conventional method for manufacturing a solid-state image sensor.

FIG. 9 is a cross-sectional view illustrating a third step of the conventional method for manufacturing a solid-state imaging device.

[Explanation of symbols]

 1 Sensor Chip 2 Lead Frame 2a Island Part 2b Lead Part 3, 21, 31 Translucent Resin 5 Glass Plate 10 Mold 11 Recess 12 Opening 20, 30 Resin Package 22, 32 Non-Translucent Resin 33 Positioning Hole 40 Optical lens 41 Lens mount

Continuation of the front page (51) Int.Cl. ⁵ Identification code Office reference number FI technical display location H01L 23/31

Claims (5)

[Claims] 1. A semiconductor chip in which a plurality of photoelectric conversion elements are arranged in a matrix, an island portion on which the semiconductor chip is mounted, and a semiconductor chip that is bent substantially perpendicular to the island portion and is input / output to / from the semiconductor chip. What is claimed is: 1. A solid-state imaging device, comprising: a lead frame including a lead portion electrically connected to a pad; and a thermosetting resin that forms a package by sealing the semiconductor chip together with the island portion. The transparent resin is a translucent first resin covering the front surface side of the lead frame on which the semiconductor chip is mounted, and a non-translucent second resin covering the back surface side of the lead frame, A solid-state image sensor, comprising: 2. The solid-state image sensor according to claim 1, wherein the lead portion of the lead frame is covered with the second resin. 3. A positioning hole or notch corresponding to the island portion of the lead frame is formed at a specific position of the thermosetting resin from the front surface side of the first resin to the middle of the second resin. The solid-state imaging device according to claim 1, wherein 4. A step of mounting a semiconductor chip having a plurality of photoelectric conversion elements arranged in a matrix on an island portion of a lead frame and bending the lead portion of the lead frame substantially perpendicular to the semiconductor chip, and a package. A step of accommodating the lead frame in which the semiconductor chip is mounted in a recess having a shape and filling at least a gap between the bottom surface of the recess and the semiconductor chip with a translucent first thermosetting resin; The recess is filled with a non-translucent second thermosetting resin, and is overheated together with the first thermosetting resin to cure the first and second thermosetting resins to lead the semiconductor chip to the lead. A method for manufacturing a solid-state imaging device, which comprises sealing with an island portion of a frame. 5. The first thermosetting resin filled in the recess is heated to cure at least the surface of the resin, and then the second thermosetting resin is filled in the recess. The method for manufacturing a solid-state image pickup device according to claim 4, wherein the solid-state image pickup device is manufactured.