JP3034370B2 - Solid-state imaging device and manufacturing method thereof - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solid-state imaging device, and more particularly, to a technique for attaching a light-transmitting cap to an envelope of the solid-state imaging device.

[0002]

2. Description of the Related Art Conventionally, in a solid-state image pickup device, a solid-state image pickup device is arranged in an envelope for protection thereof, and an entrance opening of the solid-state image pickup device for external light to be imaged to the solid-state image pickup device. Has a structure in which a translucent cap is attached.

[0003] Initially, the light-transmitting cap is attached to the envelope by preparing a light-transmitting cap in which a light-transmitting plate is attached to the opening of a metal plate frame whose center is open. A low-melting glass such as frit glass is sandwiched between a bonding surface provided on a metal frame portion of the cap and a bonding surface of the envelope, and this is heated to about 350 ° C.
The translucent cap was fixed to the envelope. Alternatively, a metallized portion is formed on each joint surface of the metal frame and the envelope, and a seam welding process for welding the metallized portion is performed to fix the translucent cap to the envelope. . However, in the former method, the solid-state image pickup device disposed in the envelope is exposed to a high temperature of about 350 ° C., and in the case of an image pickup device with a color filter in recent years, it can be cut off only by the temperature. It is at most about 150 ° C. and cannot be adopted. Therefore, it is conceivable to use the latter method. However, this method also requires a large number of processes for pre-processing for bonding, so it is not suitable for mass production and the degree of dust is high. Hard to do. Also,
Both the former method and the latter method require a complicated structure or shape to have a metal frame on the translucent cap,
The translucent cap itself becomes expensive.

Therefore, a method using a thermosetting adhesive described below, which does not cause the problems as described above, has been developed. That is, first, the thermosetting adhesive is applied to the joint of the envelope or the translucent cap, and then placed in an oven bath or the like at a constant temperature of 150 ° C. for about 1.5 to 2 hours. The thermosetting adhesive is solidified, and the translucent cap is fixed to the envelope.

According to this method, although heat treatment is involved,
Even with the durability of the image sensor with a color filter, it is of a degree that can be withstood for the time being, and since there is no particular need for pre-processing for bonding to the translucent cap or the envelope, there is no problem of dust increase, In recent years, this technique has been considered the most popular.

[0006]

However, as described above, the curing time of the thermosetting adhesive is very long (usually 1.
(5 to 2 hours), the productivity was poor. Although the curing time is long, batch processing is used to process a plurality (generally 50) of the individuals collectively. However, in view of the series of operations on the production line, processing is not performed during batch processing. After all, productivity does not improve much after all.

There is also a problem that a large working space is required for cooling the solid-state imaging device to be processed after being taken out of the thermostat.

Further, although the heat treatment is such that the color filter can withstand it, it is close to the limit and must be said to be unsuitable for an image pickup apparatus with a color filter.

The present invention has been made in view of the above-mentioned problems of the prior art, and has as its object to mount a light-transmitting cap on an envelope in a short time and without heat treatment. And a method of manufacturing the same.

[0010]

According to a first aspect of the present invention, there is provided a solid-state imaging device according to the present invention, comprising: an envelope; a solid-state imaging device provided in the envelope; A light-transmitting cap for allowing light to be imaged from outside the envelope to enter the solid-state imaging device; and a joining portion formed by an ultraviolet-curable adhesive for fixing the light-transmitting cap to the envelope. The UV-curable adhesive has a size of 0.5 to 1
And a joint part having 0 μm glass beads therein, and wherein a coefficient of thermal expansion of the glass beads is substantially equal to a coefficient of thermal expansion of the translucent cap.

According to a second aspect of the present invention, there is provided a solid-state imaging device comprising:
The ultraviolet-curing adhesive is characterized in that it is an adhesive containing an epoxy resin as a main component.

According to a third aspect of the present invention, there is provided a solid-state imaging device comprising:
The translucent cap is provided on at least one of the front and back surfaces, and is provided with a non-reflection portion for preventing reflection of light.

According to a fourth aspect of the present invention, there is provided a solid-state imaging device comprising:
The non-reflective portion is provided with a non-reflective surface as a light-transmitting cap-side bonding surface in the bonding portion.

According to a fifth aspect of the present invention, there is provided a solid-state imaging device comprising:
A light-shielding portion is provided on at least one of the front and back surfaces of the light-transmitting cap, and shields at least a part of the solid-state imaging device from incident light. The light-shielding portion is formed by a thin-film forming method or a thick-film forming method, in addition to the light-cap-side bonding surface.

According to a sixth aspect of the present invention, in the method of manufacturing a solid-state imaging device according to the present invention, the size of the package is 0.5 mm on the cap joining surface of the envelope.
Applying an ultraviolet-curable adhesive containing glass beads having a thermal expansion coefficient of about 10 μm and a thermal expansion coefficient substantially equal to that of the light-transmitting cap bonded to the cap bonding surface; Irradiating the ultraviolet-curable adhesive with ultraviolet light in a state in which the ultraviolet-curable adhesive is placed, thereby curing the ultraviolet-curable adhesive to integrate the envelope and the translucent cap. It is characterized by.

According to a seventh aspect of the present invention, in the method of manufacturing a solid-state imaging device according to the present invention, when irradiating the ultraviolet-curable adhesive with ultraviolet light, an ultraviolet light shielding portion for at least a part of the solid-state imaging device disposed in the envelope is provided. It is characterized by being arranged.

In the method of manufacturing a solid-state imaging device according to the present invention, at least a part of the solid-state imaging device is formed on at least one of the front and back surfaces of the translucent cap by a thin film forming method or a thick film forming method. A step of forming a light-shielding portion for shielding an incident light beam, wherein the step of forming the light-shielding portion such that a non-provided surface of the light-shielding portion is a light-transmitting cap-side bonding surface of the bonding portion. , Are further provided.

[0018]

[0019]

According to the present invention, an ultraviolet curing adhesive is used as an adhesive for fixing the translucent cap to the envelope, and the curing time of the ultraviolet curing adhesive is reduced. Since it takes only about one minute, the mounting of the translucent cap can be performed in a short time.

Further, no heat treatment is required for curing the ultraviolet-curable adhesive, and therefore, a step of cooling the image pickup device to be processed after the curing treatment is not required. Can be shortened, and a space for cooling is not required.

Therefore, it is possible to improve productivity without causing a stagnation of processing in the production line, and to reduce the space of the production line.

Since no heat treatment is involved, the light-transmitting cap can be mounted without considering the heat resistance of the image pickup device with a color filter. Further, since the ultraviolet curable adhesive contains glass beads having a size of 0.5 to 10 μm, the curving of the translucent cap and the airtightness inside the envelope can be improved. That is,
The joint surface of the envelope is generally uneven and uneven, and is not flat. Therefore, it is conceivable to fill the recess with an ultraviolet curable adhesive to achieve smoothing. In this case, a sufficient amount of the ultraviolet curable adhesive is used to fill the recess. However, in this case, the translucent cap is likely to bend due to the strain stress generated when the ultraviolet curable adhesive is cured. Also, since bubbles are inevitably generated in the solidified adhesive, the fact that the amount of the adhesive is large means that the amount of the bubbles is also large,
The airtightness of the envelope will be impaired. Therefore, it is desirable to reduce the amount of the UV-curable adhesive used as much as possible. Therefore, the size of the UV-curable adhesive is 0.5 to 10
By incorporating the glass beads of μm, the curving of the translucent cap and the improvement of the airtightness inside the envelope can be achieved. Further, by using glass beads having a size of 0.5 to 10 μm, it is possible to avoid the attenuation of the curing ultraviolet rays.

In particular, according to the solid-state imaging device of the present invention, the translucent cap has a non-reflection portion for preventing reflection of light, and the non-reflection portion of the non-reflection portion is provided at the joint portion. Since it is provided as the light-transmitting cap-side joining surface, even when a non-reflective portion that does not easily transmit ultraviolet light is used, the adhesive curing treatment can be performed satisfactorily.

According to the solid-state imaging device of the present invention, the light-transmitting cap is provided with a light-shielding portion for hiding at least a part of the solid-state imaging device from incident light. Since the non-installation surface of the light-shielding portion is provided as the light-transmitting cap-side bonding surface in the bonding portion, it is possible to prevent the flare of the image pickup device, and at the same time, it is possible to improve the adhesion of the light-transmitting cap to the envelope. It can be carried out.

Further, according to the method of manufacturing a solid-state imaging device according to the present invention, the light-transmitting cap can be mounted in a short time without requiring heat treatment, as in the first embodiment. . In addition, since glass beads are included in the UV-curable adhesive, a good adhesive state can be obtained by using a small amount of the UV-curable adhesive, and the curving of the translucent cap and the envelope can be reduced. The inside airtightness can be improved.

According to the method of manufacturing a solid-state image pickup device of the present invention, the image pickup device can be protected from ultraviolet light even if the light-transmitting cap has no ultraviolet light shielding portion.

[0027]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 shows a first embodiment of the present invention, in particular, FIG. 1 (a) shows the structure of a solid-state image pickup device, and FIG. 1 (b) shows the structure of an ultraviolet irradiation device used for its manufacture.

First, in FIG. 1A, reference numeral 1 denotes an envelope. The envelope 1 has a bottom 1A at its lower end and an opening 1B for introducing extraneous light to be captured at its upper end. The inner circumference is stepwise reduced from the opening to the bottom, and
Two step portions 1C and 1D are formed.

The solid-state imaging device 2 is mounted and fixed on the bottom 1A in the envelope 1 by an epoxy-based mounting agent. 1E is an external lead.
The internal wiring electrode of the envelope 1 connected to the step exists on the step 1D, and a thin wire 3 made of Au, Al, or the like is connected between the electrode on the step 1D and the electrode of the solid-state imaging device 2. The solid-state imaging device 2 and the external lead 1E are electrically connected.

A translucent cap 4 made of optical glass having a thermal expansion coefficient substantially equal to that of the envelope 1 is fitted into the opening 1B, and is mounted and fixed on the step 1C by bonding with an adhesive. I have. Reference numeral 5 denotes the joint. The bonding portion 5 is obtained by curing an ultraviolet curable adhesive mainly composed of an epoxy resin (for example, XNR5493 manufactured by Nagase Ciba Co., Ltd.).

As described above, the translucent cap 4 is attached to the envelope 1.
An ultraviolet-curing adhesive is used as an adhesive for fixing the light-transmitting cap 4 to the light-transmitting cap 4. It can be done in time processing.

In addition, no heat treatment is required for curing the ultraviolet curable adhesive, and thus, a step of cooling the image pickup device to be processed after the curing treatment is not required. The time can be shortened, and a space for cooling, which is required when a thermosetting adhesive is used, is not required.

Therefore, it is possible to improve the productivity without causing a stagnation of the processing in the production line, and to reduce the space of the production line.

Since the heat treatment is not involved, the light-transmitting cap 4 can be attached without further considering the heat resistance of the image pickup device with an organic color filter.

Next, in FIG. 1 (b), the ultraviolet irradiation device used for manufacturing the imaging device of the present invention is a duct 6
, High pressure mercury lamp 7, light reflecting member 8, shutter member 9
And a dichroic filter 10, an ultraviolet transmitting plate 11, and a light-shielding support member 12.

The duct 6 is generally constituted by an outer component 13 having a substantially rectangular cylindrical shape and an inner component 14 having the same rectangular cylindrical shape. The inner component 14 is coaxial with the outer component 13. An air duct is formed between the two members 13 and 14 and in the inside component member 14. The outer component member 13 includes a body 131, an air introduction tube 132, and a light projecting opening 133.
1 is connected to one end of the main body 131.
At the other end. Dichroic filter 10
The body 13 is closed with the light-emitting opening 133 closed.
1 inside. The attachment is performed with an adhesive or a screw. The inner component member 14 is the body portion 14
1, an air discharge pipe 142 and a light projecting opening 143,
The air discharge pipe part 142 is connected to one end of the body part 141 on the same side as the air introduction pipe part 132, and the light projection opening 143 is the other end of the body part 141 and is coaxial with one of the light projection openings 133. They are formed so as to face each other at intervals on a line. As a result, the air a from the air introduction tube 132 passes through a passage formed between the outer body 131 and the inner body 141, and then wraps around into the inner body 141, and the inner body 141 After passing through the inside 141, the air is finally discharged from the air discharge pipe 142 to the outside.

The mercury lamp 7 is disposed substantially at the center of the inner body 141, which is one of the paths of the air a, so that the air a prevents overheating. .

The light-reflecting member 8 has a shape such that its cross section describes a parabola, the concave side of which is the lamp 7 side, and
The lamp 7 is separated from the side opposite to the side where the light emitting openings 133 and 143 are located so as to be covered by the lamp 7, and emits light emitted by the lamp 7 to the reflecting member 8 side. It serves to reflect light toward the light openings 133 and 143.

The shutter 9 is provided between the lamp 7 and the light projecting opening 13.
3 is provided so as to be openable and closable, and controls light shielding and light projection.

The dichroic filter 10 has a function of passing only light in the ultraviolet range from the light from the lamp 7, whereby only the ultraviolet light u is extracted from the light from the lamp 7 and cuts off heat due to infrared rays and the like. I have.

The ultraviolet transmitting plate 11 is made of a material such as a quartz plate that transmits ultraviolet light well.
Is made of a soft elastic material (for example, a material such as silicon rubber) which is impermeable to ultraviolet light and does not damage the transparent cap 4 when placed on the translucent cap 4.
One end is attached to the center of the ultraviolet transmitting plate 11 with a silicon-based adhesive or the like, and the other end is a mounting surface on the translucent cap 4 during the curing process of the ultraviolet curing adhesive.

Hereinafter, a process of attaching the translucent cap 4 to the envelope 1 in the method of manufacturing a solid-state imaging device according to the present invention using the ultraviolet irradiation device having such a configuration will be described.

First, an ultraviolet curing adhesive is printed and applied to at least one of the stepped portion 1C of the envelope 1 and the translucent cap 4, or the adhesive is injected from a needle-shaped nozzle. Apply by dispense method.

Next, the translucent cap 4 is placed on the step 1C of the envelope 1. For this mounting operation, various methods known in the art can be employed, in addition to a manual method in which the translucent cap 4 is pinched with tweezers and mounted on the step 1C, a method using an automatic machine using a vacuum chuck or the like.

Thereafter, as shown in FIG. 1 (b), the imaging device to be processed is moved relative to the ultraviolet irradiation device so that the light projecting openings 133 and 143 of the ultraviolet irradiation device and the translucent cap 4 are opposed to each other. set. Further, the ultraviolet transmitting plate 11
The assembly composed of the light-shielding support member 12 and the light-shielding support member 12 is placed on the translucent cap 4, and in this state, the ultraviolet transmitting plate 11 side is positioned, and pressure is applied from the external lead 1E side of the imaging device as indicated by the arrow p, and the adhesive To enhance the so-called wettability. The pressure is about 1-5 [kg
/ Cm ² ], good wettability can be obtained.

In this state, the shutter 9 is opened and the lamp 7
Is irradiated on the imaging device to be processed. The lamp 7 is warmed up in advance so that a stable light beam can be obtained, and the projection and cutoff of the light are controlled by opening and closing the shutter 9. Therefore, when the shutter 9 is opened, the combined light of the light directly radiated from the lamp 7 and the reflected light from the reflection unit 8 passes through the dichroic filter 10 and is irradiated to the adhesive as ultraviolet rays u. The irradiation time is, for example, about one minute, and after that time, the shutter 9 is closed. Thus, the ultraviolet-curable adhesive can be sufficiently hardened.

At this time, considering in-line adaptability,
Appropriate numbers can be processed together. For example,
If the number to be collected is 12, the processing time is 5 seconds per one. If the time of 5 seconds is a convenient number that does not cause the stagnation of the processing on the production line, it means that the 12 pieces may be processed collectively.

Further, when irradiating the ultraviolet ray to the ultraviolet curable adhesive, the solid-state image pickup device 2 arranged in the envelope 1 is used.
The light-shielding support member 12 for the light-transmitting cap 4 does not have an ultraviolet light-shielding portion in the light-transmitting cap 4.
Can be reliably protected from ultraviolet rays u. As a result, there is no change in the electrical characteristics such as white spots on the image sensor 2 that have been confirmed as harm caused by ultraviolet rays and an increase in dark voltage.

FIG. 2 shows the structure of a solid-state imaging device according to a second embodiment of the present invention.

As shown in this figure, an antireflection film 15 is applied to the surface of the translucent cap 4 and an antireflection film 16 is applied to the back surface. These anti-reflection films 15 and 16 are for minimizing the light to be imaged due to the reflection on the front and back surfaces of the translucent cap 4, and the joining portion 5 at the periphery of the translucent cap 4 exists. It is provided only in the central region excluding the region. This makes it possible to efficiently irradiate the ultraviolet ray u to the ultraviolet curable adhesive forming the joint portion 5. That is, the antireflection films 15, 1
6 depends on the film configuration, but to achieve the above-mentioned purpose,
Those having a high transmittance in the visible light region (wavelength: 400 to 600 nm) are conversely in the ultraviolet region (200 to 400 nm).
In m), the transmittance decreases to 10% or less. Therefore, when the antireflection films 15 and 16 are provided up to the irradiation region of the adhesive curing ultraviolet rays in the translucent cap 4, the ultraviolet rays are attenuated by the antireflection films 15 and 16 and the efficiency is low. Therefore, in the present embodiment, the antireflection films 15 and 16 are provided so as to remove the ultraviolet irradiation region of the translucent cap 4, so that the ultraviolet light u can be irradiated efficiently.

As for the antireflection film, a patent application (Japanese Patent Application No. 1-98801) has already been filed by the inventor of the present invention, and an application has already been published (Japanese Patent Application Laid-Open No. 2-27887).
No. 1).

According to the manufacturing method, in the case of the present embodiment, the antireflection films 15 and 1 are attached to the translucent cap 4 before the cap is attached.
6 is the same as the first embodiment except that 6 is provided.

FIGS. 3A and 3B show the structure of a solid-state imaging device according to a third embodiment of the present invention. In particular, FIG. 3A is a vertical sectional view of the whole, and FIG. Is shown.

In the device shown in this figure, a light shielding film 17 is provided on the back surface of the translucent cap 4. This light shielding film 17
The area of the transparent cap 4 serving as a direct light path to the imaging device 2 and the ultraviolet light u for curing the adhesive are formed by a thin film forming method (for example, a CVD method) or a thick film forming method (for example, a screen printing method). It is formed in an area excluding the irradiation area. Thereby, flare of the image sensor 2 can be prevented. That is, it is conceivable that the light incident on the image sensor 2 may be combined with not only the direct light but also light that is diffusely reflected in the envelope 1 and goes around the image sensor 2 (hereinafter referred to as stray light). Then, the charge is abnormally increased only at the portion of the image sensor 2 where such light is incident, and the portion becomes abnormally bright only at the corresponding portion on the screen, and the subject cannot be faithfully reproduced. Thus, the light-shielding film 17 covers the light incident area of the translucent cap 4 which causes the stray light.

FIG. 4 is an enlarged view showing a structure of a main part of a solid-state imaging device according to a fourth embodiment of the present invention.

The structure shown in this figure is characterized in that glass beads 18 of about 0.5 to 10 μm are mixed in the joint portion 5 made of an ultraviolet curable adhesive. In this case, the glass beads 18 are mixed in the adhesive before irradiation with ultraviolet rays.

As a result, it is possible to alleviate the curvature of the translucent cap 4 and to improve the airtightness inside the envelope 1.

That is, the joint surface of the envelope 1 is generally uneven and uneven as shown in the figure, and is not flat. Therefore, it is conceivable to fill the recess with an adhesive to achieve smoothing. In this case, a sufficient amount of adhesive will be used to fill the recess. However, in this case, the translucent cap 4 is likely to bend due to the strain stress generated when the adhesive is cured. Also, since bubbles are inevitably generated in the solidified adhesive, the fact that the amount of the adhesive is large means that the amount of the bubbles is also large,
The airtightness from the outside in the envelope 1 will be impaired. Therefore, the amount of the adhesive used should be as small as possible.

Therefore, as in this embodiment, glass beads 18 having the same glass property as the light-transmitting cap 4 and having substantially the same thermal expansion coefficient are mixed in the adhesive, and the glass beads 18 are mixed.
This fills the recess in the joint surface of the envelope 1 and smoothes the joint surface. Thereby, a good adhesion state can be obtained despite the small amount of the adhesive used, and the curving of the translucent cap 4 and the improvement of the airtightness inside the envelope 1 can be achieved. It is.

There is a concern that the mixing of the glass beads 18 may attenuate the curing ultraviolet rays. However, by using glass beads 18 having a small particle size, the problem can be avoided.

The embodiments of the present invention have been described above, but the present invention is not limited to the above embodiments.

For example, in each of the above embodiments, the light-transmitting cap 4 is inserted into the envelope 1, and the inner wall of the envelope 1 exists on the side of the light-transmitting cap 4. The configuration is such that misalignment of the sex cap 4 can be prevented.

However, it is not always necessary to adopt such a structure. Even if the structure is simply mounted on the envelope 1, that is, the upper surface of the envelope 1 is a bonding surface,
The present invention holds.

[0065]

As described above, according to the present invention, an ultraviolet curable adhesive is used as an adhesive for fixing the translucent cap to the envelope. Since the adhesive requires only about one minute to cure, the light-transmitting cap can be mounted in a short time.

In addition, no heat treatment is required for curing the ultraviolet curable adhesive, and therefore, a step of cooling the image pickup device after the curing treatment is not required. Can be shortened, and a space for cooling is not required.

Therefore, it is possible to improve the productivity without causing a stagnation of the processing in the production line, and to reduce the space of the production line.

Since no heat treatment is involved, the translucent cap can be attached without further considering the heat resistance of the image pickup device with a color filter. Further, since the ultraviolet curable adhesive contains glass beads having a size of 0.5 to 10 μm, the curving of the translucent cap and the airtightness inside the envelope can be improved. That is,
The joint surface of the envelope is generally uneven and uneven, and is not flat. Therefore, it is conceivable to fill the recess with an ultraviolet curable adhesive to achieve smoothing. In this case, a sufficient amount of the ultraviolet curable adhesive is used to fill the recess. However, in this case, the translucent cap is likely to bend due to the strain stress generated when the ultraviolet curable adhesive is cured. Also, since bubbles are inevitably generated in the solidified adhesive, the fact that the amount of the adhesive is large means that the amount of the bubbles is also large,
The airtightness of the envelope will be impaired. Therefore, it is desirable to reduce the amount of the UV-curable adhesive used as much as possible. Therefore, the size of the UV-curable adhesive is 0.5 to 10
By incorporating the glass beads of μm, the curving of the translucent cap and the improvement of the airtightness inside the envelope can be achieved. Further, by using glass beads having a size of 0.5 to 10 μm, it is possible to avoid the attenuation of the curing ultraviolet rays.

In particular, according to the solid-state imaging device of the present invention, the light-transmitting cap has a non-reflection portion for preventing reflection of light, and the non-reflection portion of the non-reflection portion is connected to the joint portion. Since it is provided as the light-transmitting cap-side joining surface, even when a non-reflective portion that does not easily transmit ultraviolet light is used, the adhesive curing treatment can be performed satisfactorily.

According to the solid-state imaging device of the present invention, the light-transmitting cap is provided with a light-shielding portion for hiding at least a part of the solid-state imaging device from incident light. Since the non-installation surface of the light-shielding portion is provided as the light-transmitting cap-side bonding surface in the bonding portion, it is possible to prevent the flare of the image pickup device, and at the same time, it is possible to improve the adhesion of the light-transmitting cap to the envelope. It can be carried out.

Further, according to the method of manufacturing a solid-state imaging device of the present invention, as in the case of the first aspect, the light-transmitting cap can be mounted in a short time without requiring heat treatment. . In addition, since glass beads are included in the UV-curable adhesive, a good adhesive state can be obtained by using a small amount of the UV-curable adhesive, and the curving of the translucent cap and the envelope can be reduced. The inside airtightness can be improved.

According to the method of manufacturing a solid-state image pickup device according to the present invention, the image pickup device can be protected from ultraviolet light even if the light-transmitting cap has no ultraviolet light shielding portion.

[Brief description of the drawings]

FIG. 1 is a structural explanatory view showing a cross-sectional structure (a) of a solid-state imaging device according to a first embodiment of the present invention and a cross-sectional structure of an ultraviolet irradiation device used for manufacturing the solid-state imaging device.

FIG. 2 is a structural explanatory view showing a cross-sectional structure of a solid-state imaging device according to a second embodiment of the present invention.

FIG. 3 is a structural explanatory view showing a cross-sectional structure (a) of a solid-state imaging device according to a third embodiment of the present invention and a back surface structure (b) of a translucent cap thereof.

FIG. 4 is a structural explanatory view showing a main part sectional structure of a solid-state imaging device according to a fourth embodiment of the present invention;

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 envelope 2 solid-state imaging device 4 translucent cap 5 UV-curable adhesive joint 7 UV irradiation lamp 10 dichroic optical filter 11 UV transmission plate 12 light-shielding support member 15, 16 antireflection film 17 light-shielding film 18 glass beads u ultraviolet rays

Continuation of the front page (56) References JP-A-58-170052 (JP, A) JP-A-56-116649 (JP, A) JP-A-61-65474 (JP, A) JP-A-2-68959 (JP) JP-A-2-278871 (JP, A) JP-A-63-120464 (JP, A) JP-A-63-270779 (JP, A) JP-A-57-165476 (JP, A) 59-202277 (JP, A) Fully open 1987-118461 (JP, U) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01L 27/14 C09J 5/00 H01L 23/02 H01L 23 / 10 H04N 5/335

Claims (8)

(57) [Claims] 1. An envelope, a solid-state imaging device disposed in the envelope, and light to be imaged attached to the envelope and from outside the envelope incident on the solid-state imaging device. A light-transmitting cap, and a joint formed by an ultraviolet-curable adhesive for fixing the light-transmitting cap to the envelope, wherein the ultraviolet-curable adhesive has a size of 0.5 to 10 μm. of the joint the glass beads is inherent, with has a thermal expansion coefficient of the glass beads of the transparent cap
A solid-state imaging device having a thermal expansion coefficient substantially equal to that of the solid-state imaging device. 2. The solid-state imaging device according to claim 1, wherein the ultraviolet curable adhesive is an adhesive containing an epoxy resin as a main component. 3. The solid-state imaging device according to claim 1, further comprising a non-reflection portion provided on at least one of the front and back surfaces of the translucent cap and for preventing reflection of light. 4. The solid-state imaging device according to claim 3 , wherein the non-reflection portion is provided as a non-reflective surface as a light-transmitting cap side bonding surface in the bonding portion. 5. comprising a light shielding portion for Komo敝at least a portion of and the solid-state imaging device provided on at least one of the front and rear surfaces of the translucent cap with respect to the incident light, a non設面of the light shielding portion, 2. The solid-state imaging device according to claim 1, wherein the light-shielding portion is formed by a thin-film forming method or a thick-film forming method, while being a light-transmitting cap-side bonding surface in the bonding portion. 6. The method according to claim 6 , wherein the size of the cap is about 0.
5 to 10 μm and a coefficient of thermal expansion of the cap joint surface
Approximately equal to the step of applying a UV curing adhesive that the glass beads is inherent, the ultraviolet curable adhesive in a state of mounting the translucent cap to the cap joint surface a translucent cap that is bonded to Irradiating an ultraviolet ray to the agent to cure the ultraviolet-curable adhesive, thereby integrating the envelope and the translucent cap. 7. The solid-state imaging device according to claim 6, wherein an ultraviolet light shielding portion for at least a part of the solid-state imaging device disposed in the envelope is provided for irradiating the ultraviolet-curable adhesive with ultraviolet light. Device manufacturing method. 8. A step of forming, on at least one of the front and back surfaces of the translucent cap, a light-shielding portion for covering at least a part of the solid-state imaging device from incident light rays by a thin film forming method or a thick film forming method. The solid-state imaging device according to claim 7 , further comprising a step of forming the light-shielding portion such that a non-provided surface of the light-shielding portion is a light-transmitting cap-side bonding surface in the bonding portion. Production method.