CN205003313U - Optical element - Google Patents
Optical element Download PDFInfo
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- CN205003313U CN205003313U CN201520372925.9U CN201520372925U CN205003313U CN 205003313 U CN205003313 U CN 205003313U CN 201520372925 U CN201520372925 U CN 201520372925U CN 205003313 U CN205003313 U CN 205003313U
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Abstract
The utility model provides an optical element, optical element has the light shield layer of can the positively blocking the optical distance that constitutes reason light such as ghost image to the shining of ultraviolet ray of optical axis direction that can be through solid image sensor and positively joint are in the packing. Optical element is equipped with the optical element who uses in being among solid image sensor's the camera device, include: tow sides possess towards the incident of solid image sensor's light incidence and light transmission and towards the transparency carrier of the emitting face of solid image sensor outgoing, shape is in a part of first printing opacity portion that sees through that the central part of transparency carrier will be bare, in order to become the mode formation that frame form ground surrounded the periphery of first printing opacity portion in the at least one side in incident surface and emitting face, a part of shading portion that covers that to be bare, mode with the periphery of surrounding shading portion forms the marginal part at the transparency carrier, a part of second printing opacity portion that sees through that to be bare.
Description
Technical field
The utility model relates to a kind of optical element; be the optical element be configured in before solid-state imager, before the packaging being particularly installed on storage solid-state imager, solid-state imager protected and is used as the cover plate of light inlet window, the optical element such as near infrared cut-off filters for the visibility correction of solid-state imager.
Background technology
In recent years, the camera assembly built with solid-state imagers such as CCD, CMOS is used to mobile phone, portable information terminal device etc.Such camera assembly possesses the pottery system of storage solid-state imager, resinous bucket shape packaging and is attached to the circumference of packaging and the cover plate sealed solid-state imager by ultraviolet-curing adhesive.(such as patent documentation 1)
In addition, generally speaking, because solid-state imager has spectral sensitivity near ultraviolet ray region near infrared range, so possess the near infrared part of blocking-up incident light and carry out the camera assembly of the near infrared cut-off filters revised also for actual by the mode of the visibility close to people.In order to reduce the size of camera assembly entirety, also proposed the near infrared cut-off filters (such as, patent documentation 2) of the formation having near infrared cut-off filters and cover plate concurrently.
The near infrared cut-off filters recorded in patent documentation 2 has: the transparent base (such as infrared absorbing glass) of tabular, the ultraviolet infrared light reflecting film be made up of dielectric multilayer-film being formed in the one side (plane of incidence towards the light incidence of solid-state imager) of transparent base, the antireflection film of another side (exit facet towards the light outgoing of solid-state imager) being formed in transparent base.
In addition, if the opticses such as such near infrared cut-off filters are configured in (namely towards in the light path of the light of solid-state imager) before solid-state imager, the light then reflected in the side of near infrared cut-off filters etc. incides the imaging surface of solid-state imager, cause the problem occurring flare, ghost image etc. thus, so in the near infrared cut-off filters recorded in patent documentation 2, propose the light shield layer forming frame-shaped on ultraviolet infrared light reflecting film further, block the countermeasure of the light path of the light of the reason becoming ghost image etc.
Prior art document
Patent documentation
Patent documentation 1: Japanese Unexamined Patent Publication 2012-113045 publication
Patent documentation 2: Japanese Unexamined Patent Publication 2013-068688 publication
When the near infrared cut-off filters recorded in patent documentation 2 is installed in before packaging, circumference on the another side (namely, exit facet) of near infrared cut-off filters and coated UV line curing adhesive between the circumference of packaging, carry out the contraposition of near infrared cut-off filters and packaging, then irradiation ultraviolet radiation, makes ultraviolet-curing adhesive solidify.
But, in the near infrared cut-off filters recorded in patent documentation 2, because be formed with the light shield layer of frame-shaped at the circumference of the one side side (namely, plane of incidence side) of near infrared cut-off filters, even if so from direction (namely, the optical axis direction of the solid-state imager) irradiating ultraviolet light towards solid-state imager, ultraviolet light also can be blocked layer and cover, cause ultraviolet light not arrive ultraviolet-curing adhesive, there is the problem of failing ultraviolet-curing adhesive fully to solidify.In order to address this is that, also consider from direction (namely, from the side the packed) irradiating ultraviolet light vertical with the optical axis of solid-state imager, but in this situation, the ultraviolet lamp of irradiating ultraviolet light must be configured in the mode of surrounding of surrounding packaging, produce production equipment and to maximize such problem.In addition, even if use large-scale ultraviolet lamp, when carrying out UV-irradiation from the direction vertical with the optical axis of solid-state imager, because ultraviolet-curing adhesive solidifies lentamente inside the lateral of packaging, easily occur solidifying uneven such problem so yet exist.
Utility model content
Problem to be solved in the utility model
For overcoming above-mentioned defect, the purpose of this utility model is to provide a kind of optical element, described optical element has the light shield layer of the light path of the light that positively can block the reason forming ghost image etc., and positively can be engaged on the packaging by the irradiation of the ultraviolet light of the optical axis direction of solid-state imager.
The utility model is for solving the means of problem
To achieve these goals, optical element of the present utility model is the optical element used in the camera head built with solid-state imager, comprise: tow sides possess the transparency carrier of the exit facet towards the incidence of the light incidence of solid-state imager and light transmission towards solid-state imager outgoing, be formed in the central portion of transparency carrier, by a part for light through the first transmittance section, in at least one side in the plane of incidence and exit facet, with the light shielding part that a part for light is covered that the mode of surrounding the periphery of the first transmittance section with becoming frame-shaped is formed, and be formed in the mode of the periphery surrounding light shielding part transparency carrier edge by a part for light through the second transmittance section.
According to such formation, when in packaging optical element being installed on solid-state imager, if from the optical axis direction irradiating ultraviolet light of solid-state imager, then because this UV light permeability second transmittance section, so the ultraviolet-curing adhesive solidification be coated between packaging and the second transmittance section positively can be made, optical element positively can be bonded in the packaging of solid-state imager.In addition, the light path of the light of the reason forming ghost image etc. can be blocked by light shielding part.
In addition, optical element is mounted in the cover plate before the bucket shape packaging of receiving solid-state imager, cover plate mounted on the packaging time, can be formed by the mode of light shielding part by the extended line of the inwall of packaging.In addition, in this case, preferred cover plate is configured in exit facet side by being coated into the ultraviolet-curing adhesive that at least covers the second transmittance section and being installed on packaging.
In addition, transparency carrier has the shape of rectangular plate-like, the length of the first direction of transparency carrier is defined as H, when the length of the second direction vertical with this first direction is defined as L, light shielding part is preferably formed in the inner side with the rectangular area of the size of 0.8H × 0.8L centered by the central shaft at the center by transparency carrier.
In addition, light shielding part can be formed by the film of metal or resin.According to such formation, the high light shielding part of light-proofness easily can be formed.
In addition, preferably the area of the sensitive surface of the area ratio solid-state imager of the first transmittance section is large.
In addition, transparency carrier is preferably the near-infrared ray absorption glass of the light of the wavelength in absorption near infrared ray region.In addition, in this case, preferred near-infrared ray absorption glass is made up of the fluorophosphate system glass containing Cu2+ or the phosphate-based glass containing Cu2+.According to such formation, because near infrared ray can be removed from the light inciding solid-state imager, so revise close to the mode of the visibility of people by the spectral sensitivity of solid-state imager.
In addition, optical element can have the functional membrane at least covering the first transmittance section further.In addition, in this case, preferred function film is the optical thin film possessing antireflection, cut off infrared ray, cut off more than at least 1 function in ultraviolet.
The beneficial effects of the utility model:
As mentioned above, according to the utility model, achieve a kind of optical element, described optical element has the light shield layer of the light path of the light that positively can block the reason forming ghost image etc., and positively can be engaged on the packaging by the irradiation of the ultraviolet light of the optical axis direction of solid-state imager.
Accompanying drawing explanation
Fig. 1 is the key diagram of the formation of cover plate involved by embodiment of the present utility model.
Fig. 2 illustrates the longitudinal section having carried the formation of the solid-state image pickup device of the cover plate involved by embodiment of the present utility model.
Fig. 3 is the process flow diagram of the manufacture method of the cover plate represented involved by embodiment of the present utility model.
Fig. 4 is the key diagram of the formation of the variation of cover plate involved by embodiment of the present utility model.
Number in figure:
1 solid-state image pickup device
100,100A cover plate
101 glass baseplates
The 101a plane of incidence
101b exit facet
102,102A photomask
200 solid-state imagers
300 packagings
301 peristomes
302 edges
303 inwalls
Embodiment
Referring to accompanying drawing, embodiment of the present utility model is described in detail.Should illustrate, in figure, identical or corresponding part with identical symbol, not repeat specification.
Embodiment 1: optical element structure
Fig. 1 is the key diagram of the formation of cover plate 100 involved by embodiment of the present utility model, and Fig. 1 (a) is the planimetric map of cover plate 100, and Fig. 1 (b) is longitudinal section.In addition, Fig. 2 is the longitudinal section of the formation of the solid-state image pickup device 1 that the peristome 301 (part that the inwall 303 of packaged 300 surrounds) of the packaging 300 that solid-state imager 200 is described is sealed by the cover plate 100 of present embodiment.Before the packaging 300 that the cover plate 100 of present embodiment is mounted in storage solid-state imager 200 (i.e. peristome 301) (Fig. 2), solid-state imager 200 is protected, and as the optical element of light inlet window.
As shown in Figure 1, the cover plate 100 of present embodiment presents the outward appearance of rectangular plate-like, is to be made up of glass baseplate 101 (transparency carrier) and the photomask 102 be formed on glass baseplate 101.In addition, the one side (surface on the upside of in Fig. 1 (b)) of glass baseplate 101 is when cover plate 100 is installed in packaging 300, become towards the plane of incidence 101a of the light incidence of solid-state imager 200, the another side (surface on the downside of in Fig. 1 (b)) of glass baseplate 101 becomes the exit facet 101b of the light outgoing inciding plane of incidence 101a.Should illustrate, the size of cover plate 100 suitably sets according to the size of the packaging 300 of installation cover plate 100, is set to 6mm (transverse direction) × 5mm (longitudinal direction) in the present embodiment.
The glass baseplate 101 of present embodiment is the infrared absorbing glass (the fluorophosphate system glass containing Cu2+ or the phosphate-based glass containing Cu2+) containing Cu2+.Generally speaking, fluorophosphate system glass has excellent against weather, by adding Cu2+ in glass, and can at the simultaneously stability near infrared ray of the high permeability of maintenance visible domain.So, if glass baseplate 101 is configured in the light path of the incident light inciding solid-state imager 200, then work as a kind of low-pass filter, revise close to the mode of the visibility of people by the spectral sensitivity of solid-state imager 200.Should illustrate, the fluorophosphate system glass used in the glass baseplate 101 of present embodiment can use known glass to form, but is particularly preferably the composition containing Li+, alkaline-earth metal ion (such as Ca2+, Ba2+ etc.), rare earth element ion (Y3+, La3+ etc.).In addition, the thickness of the glass baseplate 101 of present embodiment is not particularly limited, and from the viewpoint of realizing small, light, is preferably the scope of 0.1 ~ 1.5mm.
Photomask 102 is films of the Cr of evaporation on glass baseplate 101 (chromium), has the function of the unnecessary light removing covering a part for the light inciding plane of incidence 101a, will become the reason of ghost image etc.Photomask 102, when overlooking cover plate 100, has the rectangular box-like shape of Rack (such as, 1mm width), forms light shielding part S.In addition, in the inner side (namely, the central portion of cover plate 100) of light shielding part S, be formed with the light transmission that makes to incide plane of incidence 101a the first transmittance section T1 to the rectangular shape of exit facet 101b, in the outside edge, periphery of cover plate 100 (namely) of light shielding part S, be formed with the light transmission that makes to incide plane of incidence 101a the second transmittance section T2 to the frame-shaped of exit facet 101b.
As shown in Figure 2, cover plate 100 is installed in the mode of the peristome 301 clogging the bucket shape packaging 300 of the solid-state imagers 200 such as storage CCD (Charge-CoupledDevice), CMOS (ComplementaryMetalOxideSemiconductor), is fixed by ultraviolet-curing adhesive X.
When cover plate 100 is installed in packaging 300, first, at the edge 302 coated UV line curing adhesive X of the packaging 300 of mounting cover plate 100.Then, cover plate 100 is placed in the edge 302 of packaging 300, contraposition is carried out to both, then from plane of incidence 101a side (Fig. 2 upside) irradiating ultraviolet light of cover plate 100, ultraviolet-curing adhesive X is solidified, cover plate 100 is fixed on packaging 300.
As shown in Figure 2, in present embodiment, when cover plate 100 is placed in packaging 300, the inwall 303 of packaging 300 is positioned at below the vertical direction of photomask 102.Namely, in other words, pass through the mode of photomask 102 by the extended line P of the inwall 303 of packaging 300, photomask 102 is configured to the region (namely, the region of the top of peristome 301) being cross over inner side from the region (namely, the region of the top of edge 302) more more outward than extended line P.Then, if from the plane of incidence 101a side of cover plate 100 and optical axis direction (above-below direction Fig. 2) irradiating ultraviolet light abreast of solid-state imager 200, then because ultraviolet light arrives ultraviolet-curing adhesive X, so ultraviolet-curing adhesive X solidifies by the second transmittance section T2.
Thus, in the cover plate 100 of present embodiment, be configured to: by forming the second transmittance section T2 of UV light permeability in the outside of photomask 102 (namely, light shielding part S), the ultraviolet-curing adhesive X of the downside being positioned at the second transmittance section T2 can be made positively to solidify, cover plate 100 positively can be fixed on packaging 300.Should illustrate, in the present embodiment, because a part for photomask 102 is in the region of the top of edge 302, so ultraviolet light does not directly arrive the ultraviolet-curing adhesive X be positioned at immediately below photomask 102, but, because there is irregular reference, so the ultraviolet-curing adhesive X be positioned at immediately below photomask 102 also solidifies lentamente on the surface of ultraviolet-curing adhesive X and edge 302 in the part inciding the ultraviolet light of ultraviolet-curing adhesive X through the second transmittance section T2.
If cover plate 100 is arranged in packaging 300, then cover plate 100 is configured in the light path of the light inciding solid-state imager 200, but, as mentioned above, because be formed with light shielding part S (namely, photomask 102) in cover plate 100, the light having only transmitted the first transmittance section T1 is imported into solid-state imager 200, so to the incident unnecessary light of solid-state imager 200, can not can not there is ghost image, flare.Should illustrate, the size of the first transmittance section T1 and light shielding part S suitably determines according to optical element, the size of solid-state imager 200 and the size of cover plate 100 such as lens in the outside being configured in solid-state image pickup device 1, but forms by the mode that the area of the sensitive surface of the area ratio solid-state imager 200 of at least the first transmittance section T1 is large.
In addition, the size of the second transmittance section T2 is suitably determined according to the thickness of the edge 302 of packaging 300, but, as long as the UV light permeability of the light quantity that ultraviolet-curing adhesive X can be made fully to solidify, also can be determined based on the size of glass baseplate 101.Such as, as shown in Fig. 1 (a), with the length of the longitudinal direction of glass baseplate 101 (first direction) be H, the length of transverse direction (second direction vertical with first direction) be L when, the width that can be formed as the longitudinal direction of the second transmittance section T2 is 10% (0.1H) of H, horizontal width is 10% (0.1L) of L.In this case, photomask 102 is formed on the inner side with the rectangular area of the size of 0.8H × 0.8L centered by the central shaft C at the center by glass baseplate 101.
Embodiment 2: the manufacture method of cover plate
Next, the manufacture method of the cover plate 100 of present embodiment is described.Fig. 3 is the flow process of the manufacture method of the cover plate 100 represented involved by present embodiment.Fig. 3 (a) is the process flow diagram of the manufacturing process representing cover plate 100, Fig. 3 (b) is the enlarged plan view of the cover plate 100 corresponding to each manufacturing process, and Fig. 3 (c) is the enlarged section of the cover plate 100 corresponding to each manufacturing process.Should illustrate, in order to easy understand, in Fig. 3 (b), apply deep or light to a part for constituent element, in Fig. 3 (c), a part for constituent element is shown emphatically.
(1) glass substrate is shaping
In the molding procedure of glass substrate, prepare to form by the glass possessing desired optical characteristics the glass plate formed, the mode roughly the same with net shape (namely, the shape of cover plate 100) by physical dimension is cut off by known cutting-off method.Cutting-off method have by diamond cutter carve establish cutting line after the method that fractures, carried out the method cut off by cutter sweep.Should illustrate, the glass plate used in this operation can use the glass plate being processed into the thickness of slab size close to net shape by the rough lapping of grinding etc.After glass plate is cut-off, implements cleaning, obtain glass baseplate 101.
(2) formation of Cr film
Next, in the formation process of Cr film, be formed on glass baseplate 101 by sputtering method, vacuum deposition method etc. the substrate of photomask 102, the Cr film of about 0.1 μm of thickness.
(3) resist coating baking
Be coated with at resist. in roasting procedure, at the surface of Cr film coating photoresist, the baking stipulated time.As long as photoresist dissolubility under the effect of the light of ultraviolet wavelength region or infrared wavelength region changes, material is not particularly limited.In addition, as the coating process of photoresist, well-known spin-coating method, dip coating etc. can be suitable for.
(4) resist development is exposed
In exposure resist development operation, first, across the photomask of photomask 102 patterning is irradiated light to photoresist.Then, use the developer solution corresponding to photoresist, by photoresist developing, form the resist of the pattern corresponding to photomask 102.
(5) patterning
In patterning operation, be immersed in Cr remover, the Cr film of the part not forming Resist patterns is etched, formed the pattern of photomask 102 by Cr film.
(6) resist is peeled off
In resist stripping process, be immersed in the corrosion inhibitor strippers such as ethanol, resist is peeled off.Thus, glass baseplate 101 forms photomask 102.
As mentioned above, cover plate 100 according to the present embodiment, the ultraviolet light irradiated from the optical axis direction of solid-state imager 200 is irradiated to ultraviolet curing adhesive X by the second transmittance section T2, can positively join cover plate 100 to packaging 300 thus.And then, by the photomask 102 formed in the inner side of the second transmittance section T2, the light path of the light of the reason forming ghost image etc. positively can be blocked.
Be more than the explanation of embodiment of the present utility model, but the utility model is not limited to the formation of above-mentioned embodiment, can various distortion be carried out in the scope of its technical conceive.Such as, in the present embodiment, glass baseplate 101 is the infrared absorbing glasses (the fluorophosphate system glass containing Cu2+ or the phosphate-based glass containing Cu2+) containing Cu2+, also can select in visible wavelength region is transparent material, such as, can use pyrex, crystal, vibrin, polyolefin resin, acryl resin etc.
In addition, in the present embodiment, be illustrated for the product forming photomask 102 in the plane of incidence 101a side of glass baseplate 101, but photomask 102 also can be formed in exit facet 101b side, can also be formed in the two sides of plane of incidence 101a and exit facet 101b.
In addition, in the cover plate 100 of present embodiment, be illustrated for the product only forming photomask 102, but be not limited to such formation, also can form the optical thin film of more than at least a kind function had in antireflection film, infrared ray barrier film, ultraviolet blocking film in the mode covering the first through portion T1.In addition, the optical thin film of more than at least a kind function had in antireflection film, infrared ray barrier film, ultraviolet blocking film also can be formed in the face (namely, exit facet 101b) of photomask 102 side not forming cover plate 100.Such functional membrane is after above-mentioned resist stripping process, is formed by such as sputtering method, vacuum vapour deposition.
In addition, in the present embodiment, be that the Cr film formed by sputtering method, vacuum vapour deposition etc. is illustrated to photomask 102, but do not limit such formation.As photomask 102, except Cr, the metal materials such as Ta (tantalum), Mo (molybdenum), Ni (nickel), Ti (titanium), Cu (copper), Al (aluminium) can be used, be dispersed with the resin material of the black pigments such as carbon or, the stacked resin material with the multi-color coloring layer of photopermeability.Should illustrate, when using resin material, also can form photomask 102 by known screen printing etc.
In addition, in present embodiment, in order to cover plate 100 and packaging 300 are bonded, employ ultraviolet-curing adhesive X, but, as long as at the Photocurable pressure-sensitive adhesive solidified under the effect of the light of incidence by the second transmittance section T2, be not to be defined in the ultraviolet-curing adhesive X solidified by ultraviolet light.
In addition, be illustrated with the situation being formed with the rectangular box-like photomask 102 shown in Fig. 1 (a) on the cover plate 100 of present embodiment, but be not limited to such formation.Such as, also can as the cover plate 100A involved by the modified embodiment of the present embodiment shown in Fig. 4, the corner R forming profile is circular photomask 102A.
Should illustrate, what will be understood that embodiment of disclosure is citing a little, and non-limiting.Scope of the present utility model is not by above-mentioned explanation but is provided by claims, is intended to comprise and the whole changes in claims equivalents and scope.
Claims (10)
1. an optical element, it is the optical element used in the camera head built with solid-state imager, it is characterized in that, comprise: tow sides possess the transparency carrier of the exit facet towards the plane of incidence of the light incidence of described solid-state imager and described light transmission towards described solid-state imager outgoing, be formed in described transparency carrier central portion and by a part for described light through the first transmittance section, in at least one side in the described plane of incidence and described exit facet, the light shielding part that a part for described light is covered that the mode of surrounding the periphery of described first transmittance section with frame-shaped is formed, and be formed in the mode of the periphery surrounding described light shielding part described transparency carrier edge by a part for described light through the second transmittance section.
2. optical element according to claim 1, it is characterized in that, described optical element is mounted in the cover plate before the packaging of receiving described solid-state imager, when described cover plate is installed in described packaging, the extended line of the inwall of described packaging is by described light shielding part.
3. optical element according to claim 2, is characterized in that, described cover plate at least covers described second transmittance section ultraviolet-curing adhesive in described exit facet side be installed on described packaging by being coated into.
4. the optical element according to any one in claims 1 to 3, it is characterized in that, described transparency carrier has the shape of rectangular plate-like, and be defined as H in the length of the first direction by described transparency carrier, when the length of the second direction vertical with described first direction is defined as L, described light shielding part is formed in the inner side with the rectangular area of the size of 0.8H × 0.8L centered by the central shaft at the center by described transparency carrier.
5. the optical element according to any one in claims 1 to 3, is characterized in that, described light shielding part is formed by the film of metal or resin.
6. the optical element according to any one in claims 1 to 3, is characterized in that, described in the area ratio of described first transmittance section, the area of the sensitive surface of solid-state imager is large.
7. the optical element according to any one in claims 1 to 3, is characterized in that, described transparency carrier is the near-infrared ray absorption glass of the light of the wavelength in absorption near infrared ray region.
8. the optical element according to any one in claims 1 to 3, is characterized in that, described near-infrared ray absorption glass is containing Cu
2+fluorophosphate system glass or containing Cu
2+phosphate-based glass.
9. the optical element according to any one in claims 1 to 3, is characterized in that, described optical element has the functional membrane at least covering described first transmittance section further.
10. optical element according to claim 9, is characterized in that, described functional membrane is the optical thin film possessing antireflection, cut off infrared ray, cut off at least 1 function in ultraviolet.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014118300 | 2014-06-09 | ||
| JP2014-118300 | 2014-06-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205003313U true CN205003313U (en) | 2016-01-27 |
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|---|---|---|---|
| CN201510296364.3A Pending CN105278017A (en) | 2014-06-09 | 2015-06-03 | Light-emitting element |
| CN201520372925.9U Active CN205003313U (en) | 2014-06-09 | 2015-06-03 | Optical element |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510296364.3A Pending CN105278017A (en) | 2014-06-09 | 2015-06-03 | Light-emitting element |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2016015479A (en) |
| KR (1) | KR20150141145A (en) |
| CN (2) | CN105278017A (en) |
| TW (1) | TW201546500A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105278017A (en) * | 2014-06-09 | 2016-01-27 | 豪雅冠得股份有限公司 | Light-emitting element |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018200980A (en) | 2017-05-29 | 2018-12-20 | ソニーセミコンダクタソリューションズ株式会社 | Imaging apparatus, solid-state imaging device, and electronic equipment |
| KR102448682B1 (en) | 2017-09-25 | 2022-09-29 | 삼성전자주식회사 | Fingerprint recongnition package and manufacturing method thereof |
| CN111524921A (en) * | 2019-02-03 | 2020-08-11 | 同泰电子科技股份有限公司 | Complementary metal oxide semiconductor photosensitive assembly, protective glass module and manufacturing method |
| KR102344806B1 (en) * | 2019-12-27 | 2021-12-29 | 주식회사 센소허브 | Image Sensor Package using Printed Circuit Board and Manufacturing Process thereof |
| JP2022187526A (en) * | 2021-06-08 | 2022-12-20 | ソニーセミコンダクタソリューションズ株式会社 | Image sensor package and electronic equipment |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3034370B2 (en) * | 1991-12-26 | 2000-04-17 | 株式会社東芝 | Solid-state imaging device and manufacturing method thereof |
| JPH0566993U (en) * | 1992-02-15 | 1993-09-03 | 日本電気株式会社 | CCD image sensor |
| JPH0888339A (en) * | 1994-09-16 | 1996-04-02 | Fuji Film Micro Device Kk | Solid-state image sensing device |
| JP2001345391A (en) * | 2000-03-28 | 2001-12-14 | Canon Inc | Electronic component and its manufacturing method |
| US7192897B2 (en) * | 2002-07-05 | 2007-03-20 | Hoya Corporation | Near-infrared light-absorbing glass, near-infrared light-absorbing element, near-infrared light-absorbing filter, and method of manufacturing near-infrared light-absorbing formed glass article, and copper-containing glass |
| JP2011132077A (en) * | 2009-12-25 | 2011-07-07 | Hoya Corp | Near-infrared light absorbing glass, near-infrared light absorbing filter, and imaging device |
| JP5741347B2 (en) * | 2011-09-21 | 2015-07-01 | 旭硝子株式会社 | Optical filter and imaging apparatus using the same |
| WO2013061990A1 (en) * | 2011-10-24 | 2013-05-02 | 旭硝子株式会社 | Optical filter, method for producing same, and image capturing device |
| JP5849719B2 (en) * | 2012-01-23 | 2016-02-03 | 旭硝子株式会社 | Light absorber and imaging device using the same |
| CN104823086B (en) * | 2012-11-30 | 2017-08-15 | 旭硝子株式会社 | Near infrared ray cut-off filter |
| CN105278017A (en) * | 2014-06-09 | 2016-01-27 | 豪雅冠得股份有限公司 | Light-emitting element |
-
2015
- 2015-06-03 CN CN201510296364.3A patent/CN105278017A/en active Pending
- 2015-06-03 CN CN201520372925.9U patent/CN205003313U/en active Active
- 2015-06-03 TW TW104117939A patent/TW201546500A/en unknown
- 2015-06-05 JP JP2015114608A patent/JP2016015479A/en not_active Withdrawn
- 2015-06-05 KR KR1020150079723A patent/KR20150141145A/en not_active Application Discontinuation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105278017A (en) * | 2014-06-09 | 2016-01-27 | 豪雅冠得股份有限公司 | Light-emitting element |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105278017A (en) | 2016-01-27 |
| JP2016015479A (en) | 2016-01-28 |
| KR20150141145A (en) | 2015-12-17 |
| TW201546500A (en) | 2015-12-16 |
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