JP2804669B2 - Solid-state imaging device and method of manufacturing the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a resin mold type CC.
The present invention relates to a solid-state imaging device such as a D image sensor and a method for manufacturing the same.

[0002]

2. Description of the Related Art Conventionally, a ceramic package used for a solid-state imaging device such as a CCD image sensor is one of the factors that increase the manufacturing cost of the solid-state imaging device due to the complicated assembly process and the high cost of the ceramic package itself. Has become. Therefore, as a method of reducing the manufacturing cost of the solid-state imaging device, it has been considered to form a package with a light-transmitting resin. Molding the sensor chip with a translucent resin to form a solid-state imaging device simplifies the assembly process compared to using a ceramic package, and the material itself is inexpensive. It can be significantly reduced.

FIG. 6 is a cross-sectional view of a solid-state imaging device in which a package is formed of a translucent resin. A sensor chip 1 in which a plurality of photoelectric conversion elements are arranged in a matrix is mounted on an island portion 2 a of a lead frame 2, and a lead frame 2 is attached to an input / output pad of the sensor chip 1.
Is connected via a wire such as a gold wire.
Then, the sensor chip 1 is molded together with the island portion 2a by the translucent resin package 3. The resin package 3 is provided with a positioning hole 4 (a cutout in some cases) when the solid-state imaging device is mounted on the substrate. Further, since the resin package 3 has low hardness and is easily scratched as compared with glass or the like, a glass plate 5 for surface protection is mounted on the surface of the resin package 3 facing the light receiving surface of the sensor chip 1. .

In a solid-state image pickup device using such a resin package 3, a complicated assembly process such as a solid-state image pickup device using a ceramic package is not required, and the material of the package itself is inexpensive as compared with ceramic. Is reduced, but there is a problem of shading for preventing unnecessary light from shining on the light receiving surface of the sensor chip 1. That is, in the solid-state imaging device molded by the transparent resin package 3, light entering from the side surface or the back surface of the resin package 3 is reflected by the lead frame 2, a wire connecting the lead frame 2 and the sensor chip 1, and the like. In order to hit the light receiving surface of the chip 1, it is necessary to shield the side and the back of the resin package 3 from light. In view of this, the present applicant has proposed a solid-state imaging device in which unnecessary light is prevented from entering from the side and back surfaces of the package in Japanese Patent Application No. 3-249706.

FIGS. 7 to 9 are cross-sectional views for explaining a method of manufacturing a solid-state imaging device in which light is prevented from entering from the side and back surfaces of the package. The lead frame 2 includes an island portion 2a on which the sensor chip 1 is mounted, a lead portion 2b arranged around the island portion 2a, and a lead portion 2b.
, The sensor chip 1 is mounted on the island portion 2a, the input / output pads of the sensor chip 1 and the ends of the lead portions 2b are connected by wires, and the lead portion 2b is connected to the island portion 2a. Folded vertically. Concave portion 1 of mold 10 forming resin package 3
1 has an opening 1 for accommodating a glass plate 5 serving as a protection plate.
2 is provided, and the glass plate 5 is arranged so as to be supported by a step around the opening 12. Also, recess 1
1 is provided with a protruding portion 13 corresponding to the through hole 4 of the resin package 3 and fixing the island portion 2a of the lead frame 2. The lead frame 2 is recessed so that the island portion 2a is fitted into the protruding portion 13. 11 is stored.

Subsequently, as shown in FIG. 8, a space between the light receiving surface of the sensor chip 1 in the recess 11 and the glass plate 5 is filled with a thermosetting translucent resin 21. This translucent resin 21
Is injected without excess or shortage so as not to form a gap between the sensor chip 1 and the glass plate 5 and to protrude from the glass plate 5 in a large amount. Then, only the surface of the translucent resin 21 is hardened by a short-time heat treatment.

Next, as shown in FIG. 9, the inside of the concave portion 11 is filled with a non-light-transmitting resin 22 so as to cover the semi-cured light-transmitting resin 21. This non-translucent resin 22 is
Since the peripheral portions of the sensor chip 1 and the glass plate 5 are in contact with the translucent resin 21, the same material as the translucent resin 21 is used in consideration of adhesion to the translucent resin 21 and mutual shrinkage. With a black dye. Then, the non-light-transmitting resin 22 is heat-treated together with the light-transmitting resin 21 to be completely cured, thereby forming the resin package 20. After the resin package 20 is formed, the resin package is taken out of the mold 10 and the outer frame 2 of the lead frame 2 is formed.
By cutting c, the solid-state imaging device is completed.

According to the above-described manufacturing method, a step of injecting the translucent resin 21 as shown in FIG. A solid-state imaging device can be obtained.

[0009]

However, according to the above-described manufacturing method, the amount of resin to be injected in the step of injecting the translucent resin 21 into the gap between the sensor chip 1 and the glass plate 5 can be controlled. It is difficult, and furthermore, the setting of the conditions for the heat treatment for once curing the translucent resin 21 becomes severe, so that the production yield is not stabilized, and as a result, the yield is reduced, and the production cost is sufficiently reduced. Can not do.

Accordingly, an object of the present invention is to stabilize the production yield by facilitating operations in each step.

[0011]

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and a first feature of the present invention is a semiconductor in which a plurality of photoelectric conversion elements are arranged in a matrix. A lead frame comprising a chip, an island portion on which the semiconductor chip is mounted, and a lead portion bent substantially perpendicularly to the island portion and electrically connected to input / output pads of the semiconductor chip;
A thermosetting resin that forms a package by sealing the semiconductor chip together with the island portion, wherein the thermosetting resin is a surface of the lead frame on which the semiconductor chip is mounted. The first frame has a light-transmitting first resin that covers the side of the lead frame, and a non-light-transmitting second resin that covers the rear surface of the lead frame.

A second feature is that a semiconductor chip having a plurality of photoelectric conversion elements arranged in a matrix is mounted on an island portion of a lead frame, and the lead portion of the lead frame is attached to the semiconductor chip. A step of bending the semiconductor chip substantially vertically, and accommodating the lead frame on which the semiconductor chip is mounted in a concave portion forming a package, and at least a gap between the bottom surface of the concave portion and the semiconductor chip is made of a first thermosetting resin having a light-transmitting property. And filling the remaining recesses with a non-light-transmitting second thermosetting resin and heating the first and second thermosetting resins together with the first thermosetting resin. Curing and sealing the semiconductor chip together with the island portion of the lead frame.

[0013]

According to the present invention, the back surface side of the island portion of the lead frame on which the semiconductor chip is mounted is made of the non-light-transmitting second surface.
The light-receiving surface of the semiconductor chip is not irradiated with unnecessary light incident from the back side of the package, and the amount of the first heat-curable resin is too small or too small. Even in the case where the second heat-curable resin does not pass through to the light-receiving surface side of the semiconductor chip even when the semiconductor chip is generated, the control of the injection amount of the resin and the conditions of the heat treatment in the manufacturing process are eased. Is done.

[0014]

FIG. 1 is a plan view of a solid-state imaging device according to the present invention.
FIG. 2 is a cross-sectional view taken along the line XY. In these drawings, the sensor chip 1 and the lead frame 2 are the same as those in FIG. 6, and the same portions are denoted by the same reference numerals. A feature of the present invention is that the package 30 is formed of a light-transmitting resin 31 and a non-light-transmitting resin 32, and the side corresponding to the light receiving surface of the sensor chip 1 is covered with the light-transmitting resin 31. Then, the back surface side of the sensor chip 1 is covered with a non-translucent resin 22. That is, the translucent resin 31 and the non-translucent resin 32 are combined with the island portion 2 a of the lead frame 2.
The package 30 is formed so as to meet the boundary, and unnecessary light mainly entering from the back side of the package 30 is shielded. Further, the light transmitting resin 3 of the resin package 30 is used.
A glass plate 5 for protecting the resin is mounted on the surface of the portion 0 in the same manner as in FIG. 6, and a positioning hole 33 (in some cases, a notch is formed) when the solid-state imaging device is mounted on the substrate. Is provided. This hole 33 is formed from the resin 31 side of the package 30 to the middle of the resin 32.
Through this hole 33, unnecessary light is prevented from leaking from the back surface side of the package 30.

Accordingly, a part of the island portion 2a and the lead portion 2b of the lead frame 2 is covered with the non-translucent resin 22 from the periphery of the light receiving surface of the sensor chip 1, and the light from the back side of the resin package 30 is formed. At the same time, the reflection of light on the lead frame 2 is prevented. In a solid-state imaging device employing such a package 30,
Light enters from the side of the package 30. Usually, when a solid-state imaging device is used in the device, FIG.
As shown in (1), since the light receiving surface of the sensor chip 1 is covered with a lens mount 41 for mounting an optical lens 40 for forming an image of a subject, unnecessary light is irradiated on the side surface of the package 30. There is no practical problem.

FIGS. 4 and 5 are cross-sectional views showing a method for manufacturing a solid-state image sensor according to the present invention. The lead frame 2 is housed in the concave portion 11 of the mold 10 after the sensor chip 1 is mounted on the island portion 2a and the lead portion 2b is bent perpendicularly to the sensor chip 1. This mold 10
6 is the same as FIG. 6 except that the glass plate 5 is disposed in an opening 12 provided on the bottom surface of the recess 11. Lead frame 2 having sensor chip 1 mounted in recess 11 of mold 10
Is the same as the conventional process shown in FIG.

Then, as shown in FIG. 4, a thermosetting translucent resin 31 is filled between the lead frame 2 and the bottom surface of the mold 10. This translucent resin 21 is injected in an amount sufficient to cover the sensor chip 1 sufficiently. At this time, the island portion 2a on which the sensor chip 1 is mounted
Is set closer to the bottom surface of the mold 10 than the tip of the lead 2b, so that the lead 2b is not covered.
It is easy to cover only the sensor chip 1. Then, only the surface portion of the translucent resin 31 is cured by a short-time heat treatment.

Next, as shown in FIG. 5, the remaining concave portion 11 is filled with a non-light-transmitting resin 32 so as to cover the semi-cured light-transmitting resin 31 and the lead portion 2b. Since the non-translucent resin 32 covers the lead portion 2b exposed from the resin 31, reflection of light on the lead 2b and the like is prevented. Further, since the resin 32 is in close contact with the resin 31 in the gap between the lead portions 2b, the resin 31
In consideration of the adhesiveness to each other and the shrinkage ratio of each other,
Is obtained by coloring the same material as described above with a black dye.
Thereafter, the resin package 30 is formed by heat-treating the non-translucent resin 32 together with the translucent resin 31 to completely cure the resin package 30, and after curing, the resin package 30 is joined to the mold 10 together with the lead frame 2. And cut the outer frame 2c of the lead frame 2.

According to the manufacturing method as described above, in the step of injecting the resin 31 as shown in FIG. 4, even if the amount of the resin 31 is excessive or insufficient, a defect hardly occurs.
The production yield is stable.

[0020]

According to the present invention, it is possible to stabilize the production yield when the sensor chip is molded with the resin package, so that the production cost of the solid-state imaging device is significantly reduced together with the cost reduction of the package itself. be able to.

[Brief description of the drawings]

FIG. 1 is a plan view of a solid-state imaging device of the present invention.

FIG. 2 is a cross-sectional view of the solid-state imaging device of the present invention.

FIG. 3 is a cross-sectional view illustrating a method for mounting the solid-state imaging device of the present invention.

FIG. 4 is a cross-sectional view illustrating a first step of the method for manufacturing a solid-state imaging device according to the present invention.

FIG. 5 is a sectional view illustrating a second step in the method for manufacturing a solid-state imaging device according to the present invention.

FIG. 6 is a cross-sectional view of a conventional solid-state imaging device.

FIG. 7 is a cross-sectional view illustrating a first step of a conventional method of manufacturing a solid-state imaging device.

FIG. 8 is a cross-sectional view illustrating a second step of the conventional method of manufacturing a solid-state imaging device.

FIG. 9 is a cross-sectional view illustrating a third step of the conventional method of manufacturing a solid-state imaging device.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 sensor chip 2 lead frame 2 a island portion 2 b lead portion 3, 21, 31 translucent resin 5 glass plate 10 mold 11 concave portion 12 opening 20, 30 resin package 22, 32 non-translucent resin 33 positioning hole 40 Optical lens 41 Lens mount

Claims (4)

(57) [Claims] 1. A semiconductor chip having a plurality of photoelectric conversion elements arranged in a matrix, an island portion on which the semiconductor chip is mounted, and an input / output of the semiconductor chip bent substantially perpendicular to the island portion. A solid-state imaging device comprising: a lead frame including a lead portion electrically connected to a pad; and a thermosetting resin sealing the semiconductor chip together with the island portion to form a package. A transparent resin that covers the front side of the lead frame on which the semiconductor chip is mounted; a non-transparent second resin that covers the back side of the lead frame; And specified
Corresponds to the position of the above lead frame island
The positioning hole or notch that is set
A solid-state imaging device formed from a surface side to an intermediate part of the second resin . 2. The solid-state imaging device according to claim 1, wherein a lead portion of the lead frame is covered with the second resin. 3. A plurality of photoelectric conversion elements are arranged in a matrix.
Row of semiconductor chips on lead frame island
And attach the lead of the lead frame to the semiconductor
Bending process almost perpendicular to the chip and package
The above-mentioned recess having the above-mentioned semiconductor chip mounted in a concave portion having a shape.
And the semiconductor frame at least
Fill gap with body chip with translucent first thermosetting resin
And a second heat-hardening non-translucent inside of the remaining concave portion.
And then heat with the first thermosetting resin
Hardening the first and second thermosetting resins by using
Seals the chip with the lead frame island
A method for manufacturing a solid-state imaging device . 4. The first thermosetting resin filled in the recess.
The curable resin was heated to cure at least the resin surface
Thereafter, the second thermosetting resin is filled in the recess.
4. The method for manufacturing a solid-state imaging device according to claim 3, wherein
Law.