JPH0215739U - - Google Patents
Info
- Publication number
- JPH0215739U JPH0215739U JP9442488U JP9442488U JPH0215739U JP H0215739 U JPH0215739 U JP H0215739U JP 9442488 U JP9442488 U JP 9442488U JP 9442488 U JP9442488 U JP 9442488U JP H0215739 U JPH0215739 U JP H0215739U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- lead frame
- semiconductor chip
- sealing resin
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 description 3
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の一実施例を示す断面図、第２
図ａ，ｂ，ｃは第１図の製造工程例を示す断面図
、第３図は従来例を示す断面図、第４図は他の従
来例を示す断面図、第５図は第３図の製造工程例
を示す断面図である。
１ａ……第２封止樹脂、１ｂ……第１封止樹脂
、２ａ……外部電極用リードフレーム、２ｂ……
半導体チツプ固定用リードフレーム、３……半導
体チツプ。
Fig. 1 is a sectional view showing one embodiment of the present invention;
Figures a, b, and c are cross-sectional views showing an example of the manufacturing process in Figure 1, Figure 3 is a cross-sectional view showing a conventional example, Figure 4 is a cross-sectional view showing another conventional example, and Figure 5 is a cross-sectional view showing the example of the manufacturing process in Figure 3. FIG. 3 is a cross-sectional view showing an example of the manufacturing process. 1a...Second sealing resin, 1b...First sealing resin, 2a...Lead frame for external electrode, 2b...
Lead frame for fixing a semiconductor chip, 3...semiconductor chip.
Claims (1)
封止パツケージ構造を持つ半導体装置において、
前記半導体チツプを固定するリードフレームの端
部を第１封止樹脂外の第２封止樹脂に埋設してな
ることを特徴とする樹脂封止型半導体装置。 In semiconductor devices with a resin-sealed package structure in which a semiconductor chip is fixed to a lead frame,
A resin-sealed semiconductor device characterized in that an end portion of a lead frame for fixing the semiconductor chip is embedded in a second sealing resin outside the first sealing resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9442488U JPH0215739U (en) | 1988-07-15 | 1988-07-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9442488U JPH0215739U (en) | 1988-07-15 | 1988-07-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0215739U true JPH0215739U (en) | 1990-01-31 |
Family
ID=31318947
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9442488U Pending JPH0215739U (en) | 1988-07-15 | 1988-07-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0215739U (en) |
-
1988
- 1988-07-15 JP JP9442488U patent/JPH0215739U/ja active Pending