JPH036982U - - Google Patents
Info
- Publication number
- JPH036982U JPH036982U JP6438190U JP6438190U JPH036982U JP H036982 U JPH036982 U JP H036982U JP 6438190 U JP6438190 U JP 6438190U JP 6438190 U JP6438190 U JP 6438190U JP H036982 U JPH036982 U JP H036982U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- elastic modulus
- mold material
- longitudinal elastic
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 claims description 9
- 239000012778 molding material Substances 0.000 claims 4
Landscapes
- Credit Cards Or The Like (AREA)
Description
第１図は従来例の断面図、第２図は本考案の実
施例の断面図である。
１…リード基板、２…ＩＣチツプ、３…配線、
４…モールド材、５…外部接触端子、６…第１モ
ールド材、７…第２モールド材、８…リード、９
…ボトム、１０…ボデー。
FIG. 1 is a sectional view of a conventional example, and FIG. 2 is a sectional view of an embodiment of the present invention. 1... Lead board, 2... IC chip, 3... Wiring,
4... Mold material, 5... External contact terminal, 6... First mold material, 7... Second mold material, 8... Lead, 9
...Bottom, 10...Body.
Claims (1)
ード基板１に備え、該ＩＣチツプ２のすぐ外側を
第１モールド材６でモールドし、さらにその外側
を第２モールド材７でおおつたＩＣチツプモール
ド成形品において、前記第１モールド材６と第２
モールド材７との材料の縦弾性係数Ｅ１，Ｅ２を
Ｅ１＜Ｅ２とし、かつカード本体の縦弾性係数Ｅ
Ｂとの関係ではＥ１＜ＥＢ＜Ｅ２であることを特
徴とするカード用ＩＣチツプモールド成形品。 (2) 前記第１モールド材６の縦弾性係数Ｅ１が
、カード本体の縦弾性係数ＥＢとの関係をＥ１＜
１１０ＥＢとしたものである実用新案登録請求の
範囲第１項記載のＩＣチツプモールド成形品。 (3) 前記第２モールド材７が、前記第１モール
ド材６におけるボデー１０側の周側部を厚く、か
つボトム９側の平面部を薄く形成したものである
実用新案登録請求の範囲のＩＣチツプモールド成
形品。[Claims for Utility Model Registration] (1) An IC chip 2 to be embedded in the card body is provided on a lead board 1, the immediate outside of the IC chip 2 is molded with a first molding material 6, and the outside thereof is molded with a second molding material. In the IC chip molded product covered with the mold material 7, the first mold material 6 and the second mold material
Let the longitudinal elastic modulus E 1 and E 2 of the material with the mold material 7 be E 1 <E 2 , and the longitudinal elastic modulus E of the card body
An IC chip molded product for a card, characterized in that in relation to B, E 1 <EB < E 2 . (2) The relationship between the longitudinal elastic modulus E 1 of the first mold material 6 and the longitudinal elastic modulus EB of the card body is E 1 <
110EB. The IC chip molded product according to claim 1 of the utility model registration claim. (3) The IC according to the utility model registration claims, wherein the second molding material 7 is formed by forming the circumferential side portion of the first molding material 6 on the body 10 side to be thick and the flat surface portion on the bottom 9 side to be thin. Chip molded products.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6438190U JPH0320144Y2 (en) | 1990-06-20 | 1990-06-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6438190U JPH0320144Y2 (en) | 1990-06-20 | 1990-06-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH036982U true JPH036982U (en) | 1991-01-23 |
| JPH0320144Y2 JPH0320144Y2 (en) | 1991-04-30 |
Family
ID=31595278
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6438190U Expired JPH0320144Y2 (en) | 1990-06-20 | 1990-06-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0320144Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55126303U (en) * | 1979-02-27 | 1980-09-06 |
-
1990
- 1990-06-20 JP JP6438190U patent/JPH0320144Y2/ja not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55126303U (en) * | 1979-02-27 | 1980-09-06 | ||
| JPS592162Y2 (en) * | 1979-02-27 | 1984-01-21 | 株式会社新潟鐵工所 | Vehicle guidance device for branching roads in guideway system |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0320144Y2 (en) | 1991-04-30 |
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