JPH0252354U - - Google Patents
Info
- Publication number
- JPH0252354U JPH0252354U JP13017388U JP13017388U JPH0252354U JP H0252354 U JPH0252354 U JP H0252354U JP 13017388 U JP13017388 U JP 13017388U JP 13017388 U JP13017388 U JP 13017388U JP H0252354 U JPH0252354 U JP H0252354U
- Authority
- JP
- Japan
- Prior art keywords
- external lead
- bending mold
- lead bending
- pad
- resin body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005452 bending Methods 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000007373 indentation Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
Landscapes
- Bending Of Plates, Rods, And Pipes (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案による一実施例を示すＩＣ外部
リード曲げ成形金型の部分断面図、第２図は従来
の一例を示すＩＣ外部リード曲げ成形金型の部分
断面図である。
１……パツド、２……ポンチ、３……樹脂体、
３ａ……外部リード、４……ダイ、５……角部の
窪み、６……出張り部、７，８……窪み、９……
成形面。
FIG. 1 is a partial cross-sectional view of an IC external lead bending mold showing an embodiment of the present invention, and FIG. 2 is a partial cross-sectional view of an IC external lead bending mold showing a conventional example. 1... Padded, 2... Punch, 3... Resin body,
3a...External lead, 4...Die, 5...Corner depression, 6...Protrusion, 7, 8...Indentation, 9...
Molding surface.
Claims (1)
ードの根元を挾み保持するパツド及びダイと、前
記外部リードの前記パツドより露出した部分を折
り曲げこの折り曲げられた先端部を前記ダイに押
し付けこの先端部の面が前記樹脂体の取り付け面
と平行あるいは所定の角度をもちでかつ出張る面
に形成するポンチとを有するＩＣ外部リード曲げ
成形金型において、前記ダイの突出する出張り部
の段部の角部に窪みを設けたことを特徴とするＩ
Ｃ外部リード曲げ成形金型。 A pad and a die sandwich and hold the bases of a plurality of external leads protruding from the side surface of the resin body of the IC, and a part of the external lead exposed from the pad is bent and the bent tip is pressed against the die. In the IC external lead bending mold, the IC external lead bending mold has a punch formed on a protruding surface that is parallel to or at a predetermined angle with the mounting surface of the resin body; I characterized by having a depression in the corner of the
C External lead bending mold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13017388U JPH0252354U (en) | 1988-10-03 | 1988-10-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13017388U JPH0252354U (en) | 1988-10-03 | 1988-10-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0252354U true JPH0252354U (en) | 1990-04-16 |
Family
ID=31385106
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13017388U Pending JPH0252354U (en) | 1988-10-03 | 1988-10-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0252354U (en) |
-
1988
- 1988-10-03 JP JP13017388U patent/JPH0252354U/ja active Pending
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