JPS61168646U - - Google Patents
Info
- Publication number
- JPS61168646U JPS61168646U JP5210085U JP5210085U JPS61168646U JP S61168646 U JPS61168646 U JP S61168646U JP 5210085 U JP5210085 U JP 5210085U JP 5210085 U JP5210085 U JP 5210085U JP S61168646 U JPS61168646 U JP S61168646U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- roller
- bending die
- lead
- bent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005452 bending Methods 0.000 claims description 8
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第1図は本考案の実施例を示すローラベンデイ
ングダイ装置の構成図、第2図は従来のローラベ
ンデイングダイ装置の構成図、第3図a,bは電
子部品とリードを示す平面図と側面図、第4図は
リードが「く」の字形に屈曲した従来の電子部品
の側面図である。
1…ストリツパプレート、2…曲げダイ、3…
電子部品、5…曲げローラ、6…リード、8…段
部。
Fig. 1 is a block diagram of a roller bending die device showing an embodiment of the present invention, Fig. 2 is a block diagram of a conventional roller bending die device, and Figs. 3 a and b are plan views showing electronic components and leads. FIG. 4 is a side view of a conventional electronic component in which the leads are bent in a dogleg shape. 1... Stripper plate, 2... Bending die, 3...
Electronic component, 5...Bending roller, 6...Lead, 8...Step part.
Claims (1)
ダイ装置において、電子部品リードが曲げローラ
移動により屈成される曲げダイ面にリードの屈成
時のスプリングバツクを防止するために該リード
を逆反り状態に曲げる段部を設けたことを特徴と
する電子部品リードのローラベンデイングダイ装
置。 In a DIP type electronic component lead roller bending die device, the electronic component lead is bent into a reverse warp state on the bending die surface formed by the movement of the bending roller to prevent spring back when the lead is bent. A roller bending die device for electronic component leads characterized by having a stepped portion.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985052100U JPH0447964Y2 (en) | 1985-04-10 | 1985-04-10 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985052100U JPH0447964Y2 (en) | 1985-04-10 | 1985-04-10 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61168646U true JPS61168646U (en) | 1986-10-20 |
JPH0447964Y2 JPH0447964Y2 (en) | 1992-11-12 |
Family
ID=30571744
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1985052100U Expired JPH0447964Y2 (en) | 1985-04-10 | 1985-04-10 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0447964Y2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09102569A (en) * | 1996-07-29 | 1997-04-15 | Hitachi Ltd | Method for bending lead of semiconductor |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58148946U (en) * | 1982-03-31 | 1983-10-06 | 富士通株式会社 | bending mold |
-
1985
- 1985-04-10 JP JP1985052100U patent/JPH0447964Y2/ja not_active Expired
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58148946U (en) * | 1982-03-31 | 1983-10-06 | 富士通株式会社 | bending mold |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09102569A (en) * | 1996-07-29 | 1997-04-15 | Hitachi Ltd | Method for bending lead of semiconductor |
Also Published As
Publication number | Publication date |
---|---|
JPH0447964Y2 (en) | 1992-11-12 |
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