JPS61112601U - - Google Patents
Info
- Publication number
- JPS61112601U JPS61112601U JP19841584U JP19841584U JPS61112601U JP S61112601 U JPS61112601 U JP S61112601U JP 19841584 U JP19841584 U JP 19841584U JP 19841584 U JP19841584 U JP 19841584U JP S61112601 U JPS61112601 U JP S61112601U
- Authority
- JP
- Japan
- Prior art keywords
- circuit structure
- circuit component
- folded
- thin substrate
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005452 bending Methods 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 3
- 230000002950 deficient Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Non-Adjustable Resistors (AREA)
- Coils Or Transformers For Communication (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Description
第1図〜第4図は本考案の実施例を示すもので
あり、第1図は折曲げ回路部品を示す斜視図、第
2図は他の実施例による折曲げ回路部品を示す斜
視図、第3図は第1図に示す回路構成体の展開図
、第4図は折曲げ工程の途中を示す回路部品の斜
視図、第5図は従来の折曲げ回路部品を示す斜視
図、第6図は折曲げ不良となつた回路部品を示す
斜視図である。
1……薄状基板、2a,2b……回路構成体、
3,3a……切欠き、A,B……折曲げ線。
1 to 4 show embodiments of the present invention, FIG. 1 is a perspective view showing a folded circuit component, FIG. 2 is a perspective view showing a folded circuit component according to another embodiment, 3 is a developed view of the circuit component shown in FIG. 1, FIG. 4 is a perspective view of the circuit component in the middle of the bending process, FIG. 5 is a perspective view of the conventional folded circuit component, and FIG. 6 is a perspective view of the circuit component shown in FIG. The figure is a perspective view showing a circuit component that has become defective in bending. 1...Thin substrate, 2a, 2b...Circuit structure,
3, 3a...notch, A, B...bending line.
Claims (1)
れており、且つ薄状基板が回路構成体とともに折
曲げられて成る折曲げ回路部品において、前記回
路構成体の折曲げ位置には切欠きが形成されてい
ることを特徴とする折曲げ回路部品。 In a folded circuit component in which a circuit structure is patterned on the surface of a thin substrate and the thin substrate is bent together with the circuit structure, a notch is formed at the bending position of the circuit structure. A folded circuit component characterized by:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19841584U JPS61112601U (en) | 1984-12-27 | 1984-12-27 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19841584U JPS61112601U (en) | 1984-12-27 | 1984-12-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61112601U true JPS61112601U (en) | 1986-07-16 |
Family
ID=30757389
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19841584U Pending JPS61112601U (en) | 1984-12-27 | 1984-12-27 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61112601U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5011445B1 (en) * | 2011-06-22 | 2012-08-29 | パナソニック株式会社 | Mounting board and light emitting module |
-
1984
- 1984-12-27 JP JP19841584U patent/JPS61112601U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5011445B1 (en) * | 2011-06-22 | 2012-08-29 | パナソニック株式会社 | Mounting board and light emitting module |
WO2012176491A1 (en) * | 2011-06-22 | 2012-12-27 | パナソニック株式会社 | Mounting board and light-emitting module |
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