JPS58148946U

JPS58148946U - bending mold

Info

Publication number: JPS58148946U
Application number: JP4574882U
Authority: JP
Inventors: 秀次森
Original assignee: 富士通株式会社
Priority date: 1982-03-31
Filing date: 1982-03-31
Publication date: 1983-10-06
Also published as: JPS6334283Y2

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Brief explanation of drawings]

第１図ａとｂは半導体ＩＣの平面図と側面図、第２図は
第１図の半導体ＩＣのリードを曲げるために用いられる
従来の曲げ型の概略断面図、第３図は第２図の曲げ型の
ローラ組立体の斜視図、第４−図は本考案にかかる曲げ
型に用いられを段差入子の断面図、第５図は第４図のｖ
−ｖ’線に沿って見た第４図の装置の底面図である。１・・・・・・プラスチックモールド、２・・・・・・
半導体チップ、３・・・・・・リード、１０・・・・・
・ばね、１１・・・・・・曲げグイ、１２・・・・・・
ノックアウト、１３・・・・・・クランパ、１４・・・
・・・上型、１５・・・・・・ローラホルダ、１６Ａ・
・・・・・上方ローラ、１６Ｂ・・・・・・下方曲げロ
ーラ、１７Ａ・・・・・・上方ローラ１６Ａのローラシ
ャフト、１７Ｂ・・・・・・下方曲げローラ１６Ｂのロ
ーラシャフト、１８・・・・・・段差入子設置部分、１
９・・・・・・段差入子、２０・・・・・・スペーサ、
２１・・・・・・ナベコ、２２・・・・・・サラコ、２
３・・・・・・エゼ”フタ、Ｒ・・・・・・ローラ組立
体。補正　昭５８−　３．１５図面の簡単な説明を次のように補正する。明細書第９頁第３行を以下の様に補正する。Figures 1a and b are a plan view and a side view of a semiconductor IC, Figure 2 is a schematic cross-sectional view of a conventional bending die used to bend the leads of the semiconductor IC shown in Figure 1, and Figure 3 is a diagram of a semiconductor IC shown in Figure 2. FIG. 4 is a sectional view of the step insert used in the bending die according to the present invention, and FIG. 5 is a perspective view of the roller assembly of the bending die according to the present invention.
5 is a bottom view of the device of FIG. 4 taken along line -v'; FIG. 1...Plastic mold, 2...
Semiconductor chip, 3...Lead, 10...
・Spring, 11...Bending guide, 12...
Knockout, 13... Clamper, 14...
... Upper mold, 15 ... Roller holder, 16A.
...Upper roller, 16B...Downward bending roller, 17A...Roller shaft of upper roller 16A, 17B...Roller shaft of downward bending roller 16B, 18. ...Step insert installation part, 1
9...Step insert, 20...Spacer,
21... Nabeko, 22... Sarako, 2
3...Eze" lid, R...Roller assembly. Amendment 1980-3.15 The brief description of the drawing is amended as follows. Specification, page 9, line 3 Correct as follows.

Claims

[Scope of utility model registration request]

In a bending die used to bend a plurality of leads extending outward from a mold of a semiconductor integrated circuit package, a step is formed by a large character in the passage area of the upper roller of a roller assembly consisting of an upper roller and a lower bending roller that contacts the leads. and a replaceable spacer is disposed under the insert, and the downward bending of the roller assembly tilted by the insert is such that a jig contacts the lead and bends it. Characteristic bending type.