JPS6076098U - Conductive tray for storing semiconductor integrated circuit devices - Google Patents
Conductive tray for storing semiconductor integrated circuit devicesInfo
- Publication number
- JPS6076098U JPS6076098U JP16905883U JP16905883U JPS6076098U JP S6076098 U JPS6076098 U JP S6076098U JP 16905883 U JP16905883 U JP 16905883U JP 16905883 U JP16905883 U JP 16905883U JP S6076098 U JPS6076098 U JP S6076098U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- semiconductor integrated
- circuit devices
- conductive tray
- storing semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Packaging Frangible Articles (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は、Icを収納する従来の導電性トレーの平面図
であり、第2図は、その断面図、第3図は、本考案の実
施例の平面図、第4図A及びBは、その断面図である。
符号1・・・導電性トレー、2・・・底面、3・・・収
納′壁、4・・・収納壁側面、5・・・突起物、6・・
・金属リード、7・・・半導体集積回路装置(Ic)。FIG. 1 is a plan view of a conventional conductive tray for storing ICs, FIG. 2 is a sectional view thereof, FIG. 3 is a plan view of an embodiment of the present invention, and FIGS. 4A and B are , is a sectional view thereof. Code 1...Conductive tray, 2...Bottom surface, 3...Storage wall, 4...Storage wall side surface, 5...Protrusion, 6...
- Metal lead, 7... semiconductor integrated circuit device (Ic).
Claims (1)
トレーにおいて、該トレー1の底面2に突起物5を設け
、しかも該突起物5の高さが、半導体集積回路装置7よ
り配設する金属リード6と前記半導体集積回路装置7の
底部との空間部高さより低いことを特徴とする半導体集
積回路装置収納用導電性トレー。In a conductive tray for storing a flat type semiconductor integrated circuit device, a protrusion 5 is provided on the bottom surface 2 of the tray 1, and the height of the protrusion 5 is higher than that of the metal lead 6 disposed from the semiconductor integrated circuit device 7. A conductive tray for storing a semiconductor integrated circuit device, characterized in that the height of the space is lower than that of the bottom of the semiconductor integrated circuit device 7.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16905883U JPS6076098U (en) | 1983-10-31 | 1983-10-31 | Conductive tray for storing semiconductor integrated circuit devices |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16905883U JPS6076098U (en) | 1983-10-31 | 1983-10-31 | Conductive tray for storing semiconductor integrated circuit devices |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6076098U true JPS6076098U (en) | 1985-05-28 |
JPH0333670Y2 JPH0333670Y2 (en) | 1991-07-17 |
Family
ID=30369428
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16905883U Granted JPS6076098U (en) | 1983-10-31 | 1983-10-31 | Conductive tray for storing semiconductor integrated circuit devices |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6076098U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6099881A (en) * | 1983-11-07 | 1985-06-03 | 松下電器産業株式会社 | Carrier for flat type ic package |
JPH0251237A (en) * | 1988-08-12 | 1990-02-21 | Yamamoto Hoso Shoji:Kk | Aging method for ic chip and ic chip |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55181398U (en) * | 1979-06-15 | 1980-12-26 | ||
JPS5636150U (en) * | 1979-08-30 | 1981-04-07 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5495627A (en) * | 1978-01-12 | 1979-07-28 | Sanyo Kokusaku Pulp Co | Mixing agent for mortarrconcrete and method of making same |
-
1983
- 1983-10-31 JP JP16905883U patent/JPS6076098U/en active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55181398U (en) * | 1979-06-15 | 1980-12-26 | ||
JPS5636150U (en) * | 1979-08-30 | 1981-04-07 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6099881A (en) * | 1983-11-07 | 1985-06-03 | 松下電器産業株式会社 | Carrier for flat type ic package |
JPH0251237A (en) * | 1988-08-12 | 1990-02-21 | Yamamoto Hoso Shoji:Kk | Aging method for ic chip and ic chip |
Also Published As
Publication number | Publication date |
---|---|
JPH0333670Y2 (en) | 1991-07-17 |
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