JPS6197848U - - Google Patents
Info
- Publication number
- JPS6197848U JPS6197848U JP18302584U JP18302584U JPS6197848U JP S6197848 U JPS6197848 U JP S6197848U JP 18302584 U JP18302584 U JP 18302584U JP 18302584 U JP18302584 U JP 18302584U JP S6197848 U JPS6197848 U JP S6197848U
- Authority
- JP
- Japan
- Prior art keywords
- component
- main part
- coated
- semiconductor device
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 description 6
Description
第１図は本考案を適用した樹脂封止型半導体装
置の一実施例の斜視図、第２図は第１図の半導体
装置の高温保管時の部分側面図、第３図は本考案
を適用した樹脂封止型半導体装置の他の実施例の
高温保管時の部分側面図、第４図は従来の樹脂封
止型半導体装置の斜視図、第５図は第４図の半導
体装置の高温保管時の部分側面図、第６図と第７
図は第４図の半導体装置に転写捺印用凹部を設け
た半導体装置の各斜視図、第８図は第７図の半導
体装置の高温保管時の部分側面図である。
２…リード、４ａ，４ｂ，４ｃ，４ｄ，４ｅ…
微小突起。
Figure 1 is a perspective view of an embodiment of a resin-encapsulated semiconductor device to which the present invention is applied, Figure 2 is a partial side view of the semiconductor device in Figure 1 during high temperature storage, and Figure 3 is to which the present invention is applied. FIG. 4 is a perspective view of a conventional resin-sealed semiconductor device, and FIG. 5 is a partial side view of another embodiment of the resin-sealed semiconductor device shown in FIG. 4 during high-temperature storage. Partial side view of time, Figures 6 and 7
The figures are perspective views of the semiconductor device of FIG. 4 provided with a recess for transfer marking, and FIG. 8 is a partial side view of the semiconductor device of FIG. 7 during high temperature storage. 2...Lead, 4a, 4b, 4c, 4d, 4e...
microprotrusions.
Claims (1)
部品本体を含む主要部を樹脂材にて外装被覆した
ものにおいて、前記外装被覆面の周縁部に少なく
とも一つの微小突起を形成したことを特徴とする
電子部品。 Electrically connects the component body and multiple leads,
1. An electronic component in which a main part including a main part of the component is coated with a resin material, wherein at least one microprotrusion is formed on a peripheral edge of the coated surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18302584U JPS6197848U (en) | 1984-11-30 | 1984-11-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18302584U JPS6197848U (en) | 1984-11-30 | 1984-11-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6197848U true JPS6197848U (en) | 1986-06-23 |
Family
ID=30740546
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18302584U Pending JPS6197848U (en) | 1984-11-30 | 1984-11-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6197848U (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54124680A (en) * | 1978-03-20 | 1979-09-27 | Nec Corp | Semiconductor device |
| JPS59213149A (en) * | 1983-05-19 | 1984-12-03 | Toshiba Corp | Semiconductor device |
| JPS59228738A (en) * | 1983-06-10 | 1984-12-22 | Matsushita Electronics Corp | Semiconductor device |
| JPS6018937A (en) * | 1983-07-13 | 1985-01-31 | Hitachi Ltd | Electronic part |
| JPS6117746B2 (en) * | 1975-10-31 | 1986-05-09 | Hitachi Ltd | |
| JPS6122350B2 (en) * | 1978-03-24 | 1986-05-31 | Nippon Electric Co |
-
1984
- 1984-11-30 JP JP18302584U patent/JPS6197848U/ja active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6117746B2 (en) * | 1975-10-31 | 1986-05-09 | Hitachi Ltd | |
| JPS54124680A (en) * | 1978-03-20 | 1979-09-27 | Nec Corp | Semiconductor device |
| JPS6122350B2 (en) * | 1978-03-24 | 1986-05-31 | Nippon Electric Co | |
| JPS59213149A (en) * | 1983-05-19 | 1984-12-03 | Toshiba Corp | Semiconductor device |
| JPS59228738A (en) * | 1983-06-10 | 1984-12-22 | Matsushita Electronics Corp | Semiconductor device |
| JPS6018937A (en) * | 1983-07-13 | 1985-01-31 | Hitachi Ltd | Electronic part |