JPS6018937A - Electronic part - Google Patents

Abstract

PURPOSE:To prevent the disappearance of a mark and the mutual adhesion of electronic parts by forming a partially indented section to the back of a package. CONSTITUTION:A microminiature electronic part 3 is formed in structure in which leads 2 are projected on both sides of a package 1 consisting of a resin. A mark 7 is displayed on the surface of the package 1. The back of the package 1 is formed in an arcuate recessed surface 8, and formed in structure having an indented region 9 in which a central section along the longitudinal direction of the lower surface of the package 1 is made deepest. Consequently, when the part 3 is received so as to be laminated in a magazine 4, spaces 10 are formed among the packages 1. Accordingly, the mark 7 is not rubbed even by a laminating, and a mark disappearance phenomenon is not generated. Even when there is oil adhering on the surfaces of the packages 1, both packages 1 do not adhere firmly due to the existence of the oil.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a technology that is effective when applied to electronic components that are handled in a sequentially laminated state during manufacturing or shipping.

[Background technology]

With the miniaturization of electronic components, electronic components with ultra-small packages called mini-mold transistors were developed, as described on pages 91-96 of Electronic Materials (March 1972 issue).

As shown in FIG. 1, the commercially available mini-mold transistor has a package 1 formed by resin molding, for example, 2.8 ynyn (vertical) * 1 (horizontal).
．． It is small with a height of 1.1 mm and has one lead on one side of the cage 1. 2 glues on the other side
It has a structure that makes it stand out.

Actually, this mini-mold transistor is automatically mounted by an automatic machine as described in the above-mentioned document.

By the way, the applicant has developed the following technology for shipping microelectronic components called mini-mold transistors and the like.

That is, the microelectronic parts/articles 3 are stacked in an elongated magazine 4, as shown in FIG. In addition, stoppers 5 and 6 are inserted into both ends of the magazine 40 to prevent the magazine 4 of the microelectronic components 3 from falling off. In this way, the ultra-small electronic components 3 are stored in a large number of magazines 4.
When used, the magazine 4 is also pushed out by pushing out after removing the stopper 5.6.

However, with such technology, the individual microelectronic components 3 in a stacked state do not separate from each other, but instead stick together, for example, two or three pieces, making it difficult to feed them individually to the automatic mounting machine. I can't do it anymore.

Alternatively, the inventor has found that there is a problem in that the mark 7 written on the surface of the package becomes thin or disappears due to contact between the packages.

As a result of studying the above-mentioned problems, we found that the reason why microelectronic components stick to each other is that oil that adheres during resin molding during package formation is interposed between packages of microelectronic components, and that this oil causes them to stick to each other. I learned that this is because the ultra-small electronic components that come into contact with each other are small and light, making it difficult for them to be mutually protected.

[Purpose of the invention]

The purpose of the present invention is to prevent electronic components from sticking to each other even if they are managed in a stacked state.

Another object of the present invention is to provide an electronic component having a structure in which marks do not disappear.

The above and other objects and novel features of the present invention are as follows:
It will become clear from the description of this specification and the accompanying drawings.

[Summary of the invention]

A brief overview of typical inventions disclosed in this application is as follows.

That is, one aspect of the present invention is that the package has a structure having a partially recessed portion on the back surface.

When electronic components are stacked, gaps should be formed between the overlapping packages to prevent markings from disappearing and to prevent the stacked packages from sticking together due to foreign substances such as oil.
prevention.

[Embodiment 1] FIG. 3 is a conceptual perspective view showing a state in which microelectronic components according to an embodiment of the present invention are housed in a magazine.

As shown in the figure, the microelectronic full-sized product 3 has one board 2. It has a structure in which two leads 2 protrude from the other side. Further, the leads 2 have a stepped shape for so-called surface mounting, which is mounted on a printed circuit board or the like during mounting.

Further, a mark 7, for example, a mark WQ indicating the grade, is displayed on the surface of the package 10.

Furthermore, the back surface of this package 1 has four arcuate surfaces 8, and has a structure having a recessed region 9 that is deepest at the central portion along the longitudinal direction of the lower surface of the package 1.

Therefore, as shown in FIG. 3, when the microelectronic components 3 are stacked in the magazine 4, the packages 10 have a flat surface and a depressed region 9 on the back surface between the overlapping packages 1. Therefore, a void 10 is formed. As a result, the mark 7 is not rubbed by the lamination.

The mark disappearing phenomenon unlike the conventional method does not occur. Also.

A gap 10 is formed between the packages 1 of each microelectronic component 3 in a stacked state, and each package 1 contacts with two lines, so even if there is oil attached to the surface of the package 10 during packaging, .

This oil prevents both packages 1 from strongly adhering, and when the magazine 4 takes out the microelectronic component 3,
It is possible to prevent the three microelectronic components from sticking together as in the conventional case.

[Embodiment 2] FIG. 4 is a perspective view of a microelectronic component according to another embodiment of the present invention.

This microelectronic component 3 has a structure in which one lead 2 protrudes from one side of the package 1 and two leads 2 from the other side protrude from the other side, as in the previous embodiment, and has a mark 7 on the surface of the package 10. Although it is.

The back surface of the package 1 has an arc-shaped convex surface 11 that is most protruding at the center portion along the longitudinal direction, and a depressed region 9 is formed outside the center portion.

Even if this microelectronic component 3 is placed in a stacked state as in the previous embodiment, the overlapping package 1 will only be partially formed, so after the stacked state is released.

This eliminates the possibility of microelectronic components sticking to each other or causing marks to disappear due to foreign substances such as fine particles. Note that the mark 7 may be written on the package surface facing the free area 9.

This is desirable because marks will not disappear due to rubbing (
(See Figure 4).

[Embodiment 3] FIG. 5 is a perspective view showing a microelectronic component according to another embodiment of the present invention. The figure shows a state in which the microelectronic component is inverted.

This microelectronic component 3 has conical protrusions 12 at four locations on the flat back surface of the package 1, that is, the top surface shown in the figure.
is provided, and the periphery thereof is a depressed area 9. Therefore, when the microelectronic components 3 are sequentially stacked, one package 1 overlaps the other package 1 via the protrusions 12, and a gap is created in most of the area between the two packages. Similarly, it is possible to prevent the phenomenon of pecking between microelectronic components due to adhesion of foreign substances and the phenomenon of erasure of marks written on the package 1.The other components of the microelectronic component 3 have the structure of the first embodiment. Therefore, its explanation will be omitted.

[Embodiment 4] FIG. 6 is a perspective view showing a microelectronic component according to another embodiment of the present invention. The figure shows a state in which the microelectronic component is inverted.

This microelectronic component 3 is placed on the flat back surface of the package 1.
It has a recessed area 9 with a width of 1.5 cm, and rectangular protrusions 13 at the four corners.

Therefore, when such microelectronic components 3 are managed in a stacked manner, the packages 1 of the stacked microelectronic components only partially contact each other via the protrusions 1 and 3. Therefore, even if foreign matter such as oil adheres to the package surface, the adhesion force of the foreign matter is small, and the phenomenon of sticking of the microelectronic components to each other can be avoided after the stacking control is released. Furthermore, since the package portion does not come into direct contact with the mark 7 during stacking of microelectronic components, it is possible to prevent the mark from disappearing due to rubbing.

〔effect〕

(11) According to the present invention, since a partially recessed area is provided on the back side of an electronic component package, even if electronic components are stacked and handled, the recessed area will not be affected by the mark written on the package. Since they face each other, the mark will not be rubbed by the package part, and the effect of preventing the mark from disappearing can be achieved.

(21 As described in the above fil, packages in a stacked state only partially contact each other, and the contact area is extremely small. Therefore, even if foreign substances such as oil are attached to the package surface, , the adhesive effect of oil between packages is small, and electronic components no longer stick together after the stacking state is released. Therefore, for example, when supplying electronic components stored in a magazine in a stacked state to an electronic component mounting machine, etc. Since the electronic components taken out from the magazine do not stick to each other, individualized electronic components can be supplied, and effects such as improving the operating rate of the mounting machine can be obtained.

Although the invention made by the present inventor has been specifically explained above based on Examples, the present invention is not limited to the above Examples, and various changes may be made without departing from the gist thereof.
It's not even a 5 because it's J-Noh. That is, the shape of the recessed area on the back surface of the package can be freely selected by changing the cavity bottom structure of the resin mold.

Therefore, the shape 1 position of the recessed area is determined in accordance with the shape of the electronic component package and the mark position.

[Application field]

In the above description, the invention made by the present inventor was mainly applied to microelectronic component technology, which is the background field of application, but the present invention is not limited thereto, for example.

The present invention can also be applied to semiconductor devices (electronic components) larger than those in the above embodiments. Further, even if the electronic parts are large enough to avoid being poked by foreign substances such as oil, it is possible to prevent marks from disappearing by applying the present invention.

[Brief explanation of drawings]

FIG. 1 is a perspective view of a conventional microelectronic component. The wcz diagram is a cross-sectional view showing how micro electronic components are housed in a magazine developed by one applicant. FIG. 3 is a conceptual perspective view showing a state in which microelectronic components according to an embodiment of the present invention are housed in a magazine. FIG. 4 is a perspective view of another embodiment. FIG. 5 is a perspective view of another embodiment in an inverted state. FIG. 6 is a perspective view of another embodiment in an inverted state. 1... Package, 2... Lead, 3... Micro electronic component, 4... Magazine, 5.6... Stopper,
7... Mark, 8... Concave surface, 9... Concave area,
10...Void. 11... convex surface, 12... protrusion, 13... protrusion.

Claims (1)

[Claims] 1. An electronic component having a structure in which a plurality of leads protrude from the periphery of a package, the back surface of the package having a partially recessed area.