JPS59193092A - Method of machining end face electrode of board - Google Patents

Method of machining end face electrode of board

Info

Publication number
JPS59193092A
JPS59193092A JP6734483A JP6734483A JPS59193092A JP S59193092 A JPS59193092 A JP S59193092A JP 6734483 A JP6734483 A JP 6734483A JP 6734483 A JP6734483 A JP 6734483A JP S59193092 A JPS59193092 A JP S59193092A
Authority
JP
Japan
Prior art keywords
groove
substrate
ink
plate
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6734483A
Other languages
Japanese (ja)
Inventor
有末 一夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP6734483A priority Critical patent/JPS59193092A/en
Publication of JPS59193092A publication Critical patent/JPS59193092A/en
Pending legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 産業上の利用分野 本発明はアルミナ、セラミック等の基板材料を用いてハ
イブリッドIC等の電子回路を構成する場合、回路基板
を形成する際にその基板端面に導電性インクよりなる電
極端子を形成するだめの基板の端面電極加工方法に関す
るものである。
DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention is applicable to the case where an electronic circuit such as a hybrid IC is constructed using a substrate material such as alumina or ceramic. The present invention relates to a method of processing end face electrodes of a substrate for forming electrode terminals.

従来例の構成とその問題点 一般に、・・イブリッドIC等の電子回路組立体ば、I
C部品と他の電子部品の積み重ねにより構成され、基板
材料としてアルミナ、セラミック等が用いられる。そし
て、上記回路基板は第1図および第2図に示すようにそ
の端部および表央゛(4面部の端部に電極端子2か形成
される。このように基板端部に導電性インクよシなる電
極!IW子2を形成した回路基板1を構成1゛る場合、
回路基板1の表裏面に他の回路(図示せず)を構成し、
それを接続する為に寸法人だけ表裏面に電極端子2をつ
ける必要がある。この為に第3図に示す方法を用いるこ
とにより端部と表裏面に同時に電極+7!fA子2をつ
けることが可能である。ずなわぢ、固定された基板1に
溝4にインク5を満した版3を押しつける。この時、版
3は第3図口の様に変形して基板1の端面同様に」二下
面にも圧接されることによシ、インク5は基板側に転写
され、版3が元の位置にもどるとインク5は基板1側に
残り、上下[nlに必要な寸法Aも確保できる。この時
の板側を見てみると第3図ハに図示する様に基板に転写
された分だけインク6はなくなる。この場合、用いられ
る印刷用版3は開口端に向けて拡開した溝4が複数本設
けられており、シリコン系ゴムなどの弾性相で構成され
ている。
Conventional configurations and their problems In general, electronic circuit assemblies such as hybrid ICs,
It is constructed by stacking C parts and other electronic parts, and alumina, ceramic, etc. are used as the substrate material. Then, as shown in FIGS. 1 and 2, the circuit board has electrode terminals 2 formed at its ends and the center of the front surface (the ends of the four sides). Different electrodes! When the circuit board 1 on which the IW element 2 is formed has a configuration 1,
Configuring other circuits (not shown) on the front and back surfaces of the circuit board 1,
In order to connect it, it is necessary to attach electrode terminals 2 to the front and back surfaces. For this purpose, by using the method shown in Figure 3, electrodes can be applied simultaneously to the ends and the front and back surfaces. It is possible to attach fA child 2. Zunawaji presses the plate 3 whose grooves 4 are filled with ink 5 on the fixed substrate 1. At this time, the plate 3 is deformed as shown in Figure 3 and is pressed against the bottom surface of the substrate 1 as well as the end surface of the substrate 1, so that the ink 5 is transferred to the substrate side and the plate 3 returns to its original position. When the ink 5 returns to the original position, the ink 5 remains on the substrate 1 side, and the dimension A necessary for the upper and lower [nl] can be secured. Looking at the board side at this time, as shown in FIG. 3C, the amount of ink 6 that has been transferred to the substrate is gone. In this case, the printing plate 3 used is provided with a plurality of grooves 4 that widen toward the open end, and is made of an elastic phase such as silicone rubber.

しかしなから、上述した電極加工方法では長い溝4に満
したインク5を弾性板3に対して基板1の端面を押しつ
けることにより転写する方法であるため、基板1に対し
版3を押しつける強さ、あるいは押しつける長さ、版3
の硬度によパ寸法人の誤差か大きくなると共にその寸法
をコントロールするのがむずかしいという問題があった
However, in the electrode processing method described above, the ink 5 filled in the long grooves 4 is transferred by pressing the end surface of the substrate 1 against the elastic plate 3, so the force with which the plate 3 is pressed against the substrate 1 is limited. , or pressing length, version 3
Due to the hardness of the material, there is a problem in that the error in the dimensions becomes large and it is difficult to control the dimensions.

発明の目的 本発明は、基板の表裏平面部の端部に安定した所定の寸
法で電極端子を構成すること力3できる基板の端面電極
加工方法を提供することを目的とする0 発明の構成 本発明は、上記の目的を達成するため、底面から開口端
に向って拡開した溝を設けると共に前記溝内に当該溝を
複数に分割するためのしまりを設けてなる弾性板に基板
の端面を前記溝と交叉する様にして押しつけることによ
りi)?J記溝内に充填した導電性インクを前記基板の
端面および表裏平面部の端部に亘って付着させるように
したものである。すなわち、前記溝に、この溝に直交す
る様にしきシを設けることにより、導電性インクの基板
の表裏平面部への付着量を制限することができ、その表
裏平面部の端部に形成される電イタ端子を安定に得るこ
とができる。
OBJECTS OF THE INVENTION It is an object of the present invention to provide a method for processing end-face electrodes of a substrate, which allows electrode terminals to be formed with stable predetermined dimensions on the edges of the front and back flat parts of the substrate. In order to achieve the above-mentioned object, the invention covers the end surface of a substrate on an elastic plate having a groove that widens from the bottom surface toward the open end and a stopper for dividing the groove into a plurality of parts. By pressing so as to intersect with the groove, i)? The conductive ink filled in the J-marked groove is made to adhere to the end face of the substrate and the ends of the front and back flat parts. That is, by providing a crease in the groove so as to be perpendicular to the groove, it is possible to limit the amount of conductive ink that adheres to the front and back flat parts of the substrate, and the conductive ink is formed at the ends of the front and back flat parts. Electric terminals can be stably obtained.

実施例の説明 第4図は本発明の一実施例を示しており、図中11はア
ルミナ、セラミック等の基板、12は弾性板、13はそ
の弾1住版12に設けた溝、14ばその溝13に満した
導電性インク、15は上記溝13を分割するしきりであ
り、このしきり15によって上記溝13は複数の小さい
小室に分断されている。
DESCRIPTION OF EMBODIMENTS FIG. 4 shows an embodiment of the present invention, in which 11 is a substrate made of alumina, ceramic, etc., 12 is an elastic plate, 13 is a groove provided in the bullet 1 housing plate 12, and 14 is a groove provided in the bullet plate 12. The conductive ink 15 filling the groove 13 is a partition that divides the groove 13, and the partition 15 divides the groove 13 into a plurality of small chambers.

次に、この印刷用の弾性板について第6図、第6図を用
いて説明をする。図中、12は版で、一般にタンポ印刷
等で用いられているシリコン系のゴムを用いる。このゴ
ムの表面にインクか入り込む溝13を必要数だけ形成す
る。この時の溝の寸法は深さDが0・2〜0.7闘位で
あれば、溝の底面と上面部の寸法差C−B=o、1〜0
.2mm位あればよい。これは基板に版が押しつけられ
た時に溝が変形し、寸法Cが若干小さくなり、インクが
溝13から出にくくなるのを防止するためである。
Next, this elastic plate for printing will be explained using FIGS. In the figure, reference numeral 12 denotes a printing plate, which is made of silicone rubber that is generally used in pad printing and the like. A necessary number of grooves 13 into which ink enters are formed on the surface of this rubber. At this time, if the depth D is 0.2 to 0.7, the dimension difference between the bottom and top of the groove C-B = o, 1 to 0.
.. Approximately 2 mm is sufficient. This is to prevent the grooves from being deformed when the plate is pressed against the substrate, causing the dimension C to become slightly smaller and making it difficult for ink to come out of the grooves 13.

ここに、示す数値は溝のピッチ1〜1.5mm、溝幅0
.6〜1馴、インクの乾燥後の膜厚20〜40μ、イン
ク粘度30万センチポイズの場合の一例である。従って
インクの成分、寸法がかわれば、形状寸法は若干変えね
ばならない。そして、弾性板12の溝13に設けるしき
り16は基板11の表裏平面部の端部に形成される電極
端子の必要とする寸法になるように設定される。
The numerical values shown here are groove pitch 1 to 1.5 mm, groove width 0.
.. This is an example of a case where the ink has a dry ink thickness of 6 to 1 cm, a film thickness of 20 to 40 μm after drying, and an ink viscosity of 300,000 centipoise. Therefore, if the components and dimensions of the ink change, the shape and dimensions must be changed slightly. The partitions 16 provided in the grooves 13 of the elastic plate 12 are set to have the dimensions required by the electrode terminals formed at the ends of the front and back flat parts of the substrate 11.

このように構成された弾性板12を用いて基板11の端
面に導電性インクよりなる電極端子を形成する場合、捷
ず、弾性板12の溝13つまりしきり16で区切りられ
る凹部に導電性インク14を充填し、固足された基板1
1に溝13にイ/りを満した版12を押しつける。この
時板12は第4図口の様に変形して基板11の端面同様
に上下面にも圧接されることにより、インクは基板側に
転写され、版12が元の位置にもどるとインクは基板側
に残り、上下面に必四なり]′θモAも4m′保できる
。この時の板側を見てみると第4図・・に図示する様に
基板に転写された分だけインクはなくなる。
When forming an electrode terminal made of conductive ink on the end surface of the substrate 11 using the elastic plate 12 configured in this way, the conductive ink 14 is placed in the groove 13 of the elastic plate 12, that is, in the recessed part separated by the partition 16. Substrate 1 filled with and fixed
1, press the plate 12 which fills the groove 13 with the groove 13. At this time, the plate 12 deforms as shown in Figure 4 and is pressed against the upper and lower surfaces as well as the end surfaces of the substrate 11, so that the ink is transferred to the substrate side, and when the plate 12 returns to its original position, the ink is transferred. It remains on the board side, and must be on the top and bottom surfaces]'θ mo A can also be maintained at 4 m'. Looking at the board side at this time, as shown in Figure 4, the amount of ink that has been transferred to the board is gone.

つまり、し捷り15で区切られた凹部のインクのみが基
板側に転写されてなくなる。連続して印刷をする場合は
、版12を上下いずれかの方向へじ下り16のピッチの
寸法だけずらしてゆけば可能である。さらにインクを自
動的に供給し、連続で印刷をする様な場合は版12を円
形につクリ、その周囲にしきりつきの溝をきって回転さ
せながらインクの補充を行なうことも可能である。
In other words, only the ink in the recesses separated by the separation 15 is transferred to the substrate and disappears. Continuous printing can be done by shifting the plate 12 in either the up or down direction by the pitch of the downward movement 16. Furthermore, when ink is automatically supplied and printing is to be carried out continuously, it is also possible to replenish the ink while making the plate 12 circular, cutting a groove around it and rotating it.

したがって、この方法によると、電極端子のへ寸法は安
定すると共に、版を上下いずれかに移動させるか又は回
転させることにより連続して電極端子をつけることがで
きる。
Therefore, according to this method, the dimensions of the electrode terminals are stabilized, and electrode terminals can be attached continuously by moving the plate up or down or rotating it.

発明の効果 以上のように本発明によれば、印刷用の弾性版の溝をし
きりにて区切ったため、そのしきりにより区切りられた
底部へ充填される導電性インクの渣が一定であることか
ら、弾性板を基板に押しつける長さ、弾性板の硬度に多
少のバラツキがあっても電極端子のA寸法の安定化を図
ることができる。
Effects of the Invention As described above, according to the present invention, since the grooves of the elastic plate for printing are partitioned by partitions, the residue of the conductive ink filled into the bottom section separated by the partitions is constant, so that the elastic plate is Even if there is some variation in the length of pressing the plate against the substrate and the hardness of the elastic plate, the A dimension of the electrode terminal can be stabilized.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来の回路基板の平面図、第2図はその正面図
、第3図は同基板の電極加工方法の説明図、第4図は本
発明の電極加工方法の工程説明図、第6図は同方法に用
いる弾性板の平面図、第6図はその正面図である。 11・・・・・基板、12・・・・・・弾性板、13・
・・・・・溝、14・・・・・導電性インク、15・・
・・・・しきり。 代理人の氏名 弁理士 中 尾 敏 男 ほか1名第1
図 第2図 第 第3図 435−
FIG. 1 is a plan view of a conventional circuit board, FIG. 2 is a front view thereof, FIG. 3 is an explanatory diagram of an electrode processing method for the same board, and FIG. 4 is a process explanatory diagram of an electrode processing method of the present invention. FIG. 6 is a plan view of an elastic plate used in the same method, and FIG. 6 is a front view thereof. 11...Substrate, 12...Elastic plate, 13.
...Groove, 14...Conductive ink, 15...
・・・ Shikiri. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure 2 Figure 3 435-

Claims (1)

【特許請求の範囲】[Claims] 底面から開[I端に向って拡開した溝を設けると共に前
記溝内に自校溝を複数妃分割するためのしきりを設けて
なる弾性板に基板の端部を前記溝と交叉する様にして押
しつけることにより前記溝内に充填した導電性インクを
前記基板の端部および表裏平面部の端部に亘って刺着さ
せることを特徴とする基板の端面電極加工方法。
An elastic plate is provided with a groove that opens from the bottom surface and expands toward the I end, and a partition is provided in the groove to divide the self-calibration groove into a plurality of grooves, so that the end of the substrate crosses the groove. A method for processing an end face electrode of a substrate, characterized in that the conductive ink filled in the groove is stuck to the edge of the substrate and the edges of the front and back flat parts by pressing the groove.
JP6734483A 1983-04-15 1983-04-15 Method of machining end face electrode of board Pending JPS59193092A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6734483A JPS59193092A (en) 1983-04-15 1983-04-15 Method of machining end face electrode of board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6734483A JPS59193092A (en) 1983-04-15 1983-04-15 Method of machining end face electrode of board

Publications (1)

Publication Number Publication Date
JPS59193092A true JPS59193092A (en) 1984-11-01

Family

ID=13342306

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6734483A Pending JPS59193092A (en) 1983-04-15 1983-04-15 Method of machining end face electrode of board

Country Status (1)

Country Link
JP (1) JPS59193092A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03225990A (en) * 1990-01-31 1991-10-04 Hitachi Ltd Method and apparatus for manufacture of wiring board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03225990A (en) * 1990-01-31 1991-10-04 Hitachi Ltd Method and apparatus for manufacture of wiring board

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