JPS60140788A - Method of forming circuit by pad printing - Google Patents
Method of forming circuit by pad printingInfo
- Publication number
- JPS60140788A JPS60140788A JP25031883A JP25031883A JPS60140788A JP S60140788 A JPS60140788 A JP S60140788A JP 25031883 A JP25031883 A JP 25031883A JP 25031883 A JP25031883 A JP 25031883A JP S60140788 A JPS60140788 A JP S60140788A
- Authority
- JP
- Japan
- Prior art keywords
- paste
- circuit pattern
- printing
- substrate
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 31
- 238000007649 pad printing Methods 0.000 title claims description 4
- 238000007639 printing Methods 0.000 claims description 13
- 238000001035 drying Methods 0.000 claims description 5
- 238000010304 firing Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 description 18
- 239000004020 conductor Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 2
- 108010010803 Gelatin Proteins 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 229940079593 drug Drugs 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920000159 gelatin Polymers 0.000 description 1
- 239000008273 gelatin Substances 0.000 description 1
- 235000019322 gelatine Nutrition 0.000 description 1
- 235000011852 gelatine desserts Nutrition 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明は、パッド印刷による回路形成方法に関するもの
である。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of forming a circuit by pad printing.
基板上に回路パターンを形成する手段として従来、スク
リーン印刷法によるものが知られている。A screen printing method is conventionally known as a means for forming a circuit pattern on a substrate.
このスクリーン印刷法では、平面に対する印刷しかでき
ないので、凹凸面などの不規則な曲面を有する基板への
印刷は不可能である。従って、基板の端面に対する回路
パターンの印刷を行なう場合には、第1図に示す如く、
先ず基板1の一つの平面2上に回路パターン3を印刷し
、乾燥した後、第2図に示す如く別途端面のみに回路パ
ターン4を印刷し乾燥するという複数回もの印刷工程等
を繰返す必要があった。Since this screen printing method can only print on flat surfaces, it is impossible to print on substrates having irregularly curved surfaces such as uneven surfaces. Therefore, when printing a circuit pattern on the end surface of a board, as shown in FIG.
First, the circuit pattern 3 is printed on one plane 2 of the substrate 1, and after drying, the circuit pattern 4 is separately printed only on the edge surface and dried, as shown in FIG. 2. It is necessary to repeat the printing process several times. there were.
このような煩雑な工程を廃して凹凸面や端面等について
も一度の工程で印刷する技術として特開昭57−259
5号並びに特公昭55−16388号公報に掲載された
技術がある。しかし、これらの技術では回路パターン印
刷層を保持するフィルム(転写紙)が必要であり、又、
この回路パターンはスクリーン印刷によってフィルム(
転写紙)上に印刷されるのが通例であるので、回路パタ
ーンの厚さをパターンの任意部位にて異らせるには厚く
印刷する個所を別途、製版条件、印刷条件を変えて多重
印刷しなければならず煩雑である。Japanese Patent Laid-Open No. 57-259 was developed as a technology to eliminate such complicated processes and print on uneven surfaces and edges in one process.
There are techniques published in No. 5 and Japanese Patent Publication No. 55-16388. However, these techniques require a film (transfer paper) to hold the printed circuit pattern layer, and
This circuit pattern is printed on a film (
Generally, the circuit pattern is printed on transfer paper (transfer paper), so in order to vary the thickness of the circuit pattern in any part of the pattern, the parts to be thickly printed must be printed separately by changing the plate-making and printing conditions and multiple printing. It is necessary and complicated.
ちなみに、回路パターンの厚さをパターンの任意部位で
異らせることが容易にできれば、抵抗素子の印刷ではそ
の抵抗値を変えられる点、導体素子の印刷では半田付は
部分を厚くしたいという要求を満足できる点で有益であ
る。By the way, if it is possible to easily vary the thickness of a circuit pattern at any part of the pattern, the resistance value can be changed when printing resistive elements, and the demand for thicker soldering parts when printing conductive elements can be met. It is beneficial in that it is satisfying.
従って、本発明の目的は、簡単な工程で凹凸面及び端面
に対して回路パターンの印刷ができ、且つ、パターンの
厚さを任意の部位で異ならせることのできる、パッド印
刷による回路形成方法を提供することにある。Therefore, an object of the present invention is to provide a circuit forming method using pad printing, which allows circuit patterns to be printed on uneven surfaces and end surfaces in a simple process, and in which the thickness of the pattern can be varied at any desired location. It is about providing.
本発明の構成を、以下、一実施例について説明する。The configuration of the present invention will be described below with reference to one embodiment.
本発明に係る基板の回路パターンは、以下に説明する各
工程により実施される。The circuit pattern of the substrate according to the present invention is implemented through each process described below.
1 回路パターン刻成工程(第3図参照)製版10に、
所望の回路パタ□−ンに対応した回路パターン11が刻
成される。本例では説明の便宜」二単純な十字形の溝を
以て回路パターンとしているが実際には複雑な回路構成
とすることもでき・′る。ここで、最終的に出来上る回
路パターンについて部分的に厚さを変える必要がある場
合には、この回路パターン11の深さを所望の部位にて
所望の厚さに設定しておけばよい。1 Circuit pattern engraving step (see Figure 3) Plate making 10,
A circuit pattern 11 corresponding to a desired circuit pattern is carved. In this example, for the sake of explanation, the circuit pattern is made up of simple cross-shaped grooves, but in reality, a complex circuit configuration can be used. Here, if it is necessary to partially change the thickness of the finally completed circuit pattern, the depth of the circuit pattern 11 may be set to a desired thickness at a desired portion.
2、刷シ込み工程(第4図参照)
前工程により製作された製版10の表面に、ペースト1
2を刺着した弾性材からなるへら13若しくは刷毛を摺
動させて回路パターン11にペースト12を刷り込む。2. Imprinting process (see Figure 4) Paste 1 is applied to the surface of the plate 10 produced in the previous process.
The paste 12 is imprinted onto the circuit pattern 11 by sliding a spatula 13 or a brush made of an elastic material with a paste 2 stuck thereon.
ペースト12は、製作する回路パターンの機能に応じ、
導体、抵抗体、レジスト等の特性を有するものが適宜選
択して用いられる。The paste 12 is prepared according to the function of the circuit pattern to be manufactured.
A material having characteristics such as a conductor, a resistor, and a resist is appropriately selected and used.
3、移転付着工程(第5図、第6図参照)前工程により
、ペースト】2が刷り込壕れた部位に弾性パッド14の
先端部+4aを押しあてる。3. Transfer adhesion process (see Figures 5 and 6) Press the tip +4a of the elastic pad 14 against the area where the paste [2] has been imprinted in the previous process.
この先端部14αは丸味をおひだ凸状をなしており、ペ
ースト12が充填された回路パターン11の大きさより
も十分広い面を有している。This tip portion 14α has a rounded and convex shape, and has a surface that is sufficiently wider than the size of the circuit pattern 11 filled with the paste 12.
弾性バンドとしては、例えばシリコン樹脂、ゼラチン等
が用いられる。その他、弾性を有するもので、且つ、劇
薬品性のある利料ならば必ずし2も上記材料に限定され
ない。As the elastic band, for example, silicone resin, gelatin, etc. are used. In addition, the material is not necessarily limited to the above materials as long as it has elasticity and has strong drug properties.
こうして押しあてることにより、先端部14aにはペー
スト]2が付着される。而して、これを製版10上より
引き上げれば、第6図に示す如く、先端部14a、J:
に回路パターンの形態をなしたペースト12′が移転・
付着−してくる。By pressing in this manner, the paste] 2 is adhered to the tip portion 14a. Then, when this is pulled up from above the plate making 10, as shown in FIG. 6, the tip portion 14a, J:
The paste 12' in the form of a circuit pattern is transferred to
Attach - come.
4 印刷工程(第7図・第8図参照)
表面にアルミナ、はうろう等の被覆が形成された第7図
に示す如き直方体の基板15に前記工程に係る弾性パッ
ド14の先端部14aを押圧する。4 Printing process (see Figures 7 and 8) The tip 14a of the elastic pad 14 according to the above process is attached to a rectangular parallelepiped substrate 15 as shown in Figure 7, whose surface is coated with alumina, wax, etc. Press.
この場合、弾性パッド14が弾性的に変形するので、ペ
ースト12′は基板15の端面部]、5aまで該弾性パ
ッドと共に移動する。従って、第8図に示す如く端面ま
でにわたるペースト12の移転・付着が、−回の抑圧で
実現される。この場合、所望の回路パターンの厚みが部
分的に異なるものであれば、そのように形成されたペー
ストが基板15上に付着されることになる。又、直方体
の基板でなく、凹凸面を有する他の任意の形状の基板で
あっても弾性パッドの作用によシその凹凸面に従ってペ
ーストハ付着される。In this case, since the elastic pad 14 is elastically deformed, the paste 12' moves together with the elastic pad to the end surface 5a of the substrate 15. Therefore, as shown in FIG. 8, transfer and adhesion of the paste 12 to the end face is realized by suppressing - times. In this case, if the thickness of the desired circuit pattern is partially different, the paste thus formed will be deposited on the substrate 15. Further, even if the substrate is not a rectangular parallelepiped but has an arbitrary shape having an uneven surface, the paste is adhered to the substrate according to the uneven surface by the action of the elastic pad.
こうして基板15上に付着されたペースト12は基板1
5と共に乾燥工程及び焼成工程を経て、固型化され回路
基板として完成される。The paste 12 thus deposited on the substrate 15
5, it is solidified and completed as a circuit board through a drying process and a firing process.
第9図に、符号16を以て上記の如き工程を経て完成さ
れたセル基板を示す、。図中符号17は回路パターンと
導通された端子部を示す。この回路基板16の上半部に
は、端面部にかけてオーバーコート18が形成されてい
るが、このようなオーバーコート18の形成についても
、本発明に準じた方法が適用され得ることは勿論である
。In FIG. 9, reference numeral 16 indicates a cell substrate completed through the above steps. Reference numeral 17 in the figure indicates a terminal portion electrically connected to the circuit pattern. An overcoat 18 is formed on the upper half of the circuit board 16 over the end face, and it goes without saying that the method according to the present invention can also be applied to the formation of such an overcoat 18. .
上記セル基板]6は第10図に示すベース基板19上に
置かれ、接続導体20を以て配線用の導体21と接続さ
れる。The cell substrate] 6 is placed on a base substrate 19 shown in FIG. 10, and is connected to a wiring conductor 21 through a connecting conductor 20.
このように、本発明では、弾性パッドに付着された回路
パターン状のペーストを基板に押し当てて印刷する方法
を採用しているので、3次元のパターニングが可能であ
る。さらに、版の溝の深さを変えたり、ペーストの粘度
を変えたりし、或いは複数回、印刷を重ねる等して多層
化も可能であシ、印刷膜厚の制御を容易に行なうことも
できる。As described above, the present invention employs a method of printing by pressing a circuit pattern-shaped paste attached to an elastic pad onto a substrate, so three-dimensional patterning is possible. Furthermore, it is possible to create multiple layers by changing the depth of the grooves on the plate, changing the viscosity of the paste, or repeating printing multiple times, making it easy to control the printing film thickness. .
その他、弾性バンドが柔らかなため、先に形成した回路
パターンが乾いていれば、スクリーン印刷との組合せも
可能である。Additionally, since the elastic band is soft, it can also be combined with screen printing as long as the previously formed circuit pattern is dry.
前記実施例の如き、弾性パッドを用いた方法では、プリ
ント基板回路の他、曲面を含む基板のエンチングパター
ンの形成も可能である。In the method using an elastic pad as in the embodiment described above, it is possible to form an etched pattern on a board including a curved surface as well as a printed circuit board.
同、エツチングパターンを形成する場合には、基板とし
て、絶縁体の表面に導体層が被覆されているものを用い
る。そして、ペーストとしてレジストを用い、弾性パッ
ドによりレジストからなるペーストを以て回路パターン
を上記基板に印刷する。次に乾燥工程を経てからエツチ
ング処理により、レジストが付着している部分以外の導
体部分を除去し、レジスト部分のみ残す。さらにこのレ
ジストを除去すれば所望の回路パターンを形成された基
板を得る。Similarly, when forming an etching pattern, the substrate is an insulator whose surface is coated with a conductor layer. Then, using a resist as a paste, a circuit pattern is printed on the substrate using the resist paste using an elastic pad. Next, after a drying process, an etching process is performed to remove the conductor parts other than the parts to which the resist is attached, leaving only the resist parts. Further, by removing this resist, a substrate on which a desired circuit pattern is formed is obtained.
第1図、第2図は従来技術によシ回路形成された基板の
斜視図、第3図は製版の斜視図、第4図は刷り込み工程
を説明した製版及びへらの斜視図、第5図、第6図は移
転・付着工程を説明した製版及び弾性パッドの斜視図、
第7図は印刷前の基板の斜視図、第8図は印刷後の基板
の斜視図、第9図はセル基板の斜視図、第10図はベー
ス基板上に組付けられたセル基板の斜視図である。
】0 ・製版、12,12・・ペースト、14 弾性バ
ンド、15一基板。
沁4 K1 and 2 are perspective views of a board on which a circuit is formed according to the prior art, FIG. 3 is a perspective view of a plate making process, FIG. 4 is a perspective view of a plate making process and a spatula explaining the imprinting process, and FIG. Figure 6 is a perspective view of the plate making and elastic pads explaining the transfer and adhesion process;
Fig. 7 is a perspective view of the board before printing, Fig. 8 is a perspective view of the board after printing, Fig. 9 is a perspective view of the cell board, and Fig. 10 is a perspective view of the cell board assembled on the base board. It is a diagram. ]0 ・Plate making, 12, 12... Paste, 14 Elastic band, 15 - Substrate. 4K
Claims (1)
込み工程と、この刷り込まれたペーストに弾性バンドを
押圧して上記ペーストを弾性バンドに移転付着させる移
転・付着工程と、上記ペーストが付着した弾性パッドを
基板に押圧して基板にペーストを印刷する印刷工程と、
上記印刷されたペーストを乾燥・焼成する乾燥・焼成工
程を有するパッド印刷による回路形成方法。an imprinting process in which paste is imprinted on a plate with a circuit pattern engraved thereon; a transfer/adhesion process in which an elastic band is pressed against the imprinted paste to transfer and adhere the paste to the elastic band; and an elastic pad to which the paste is adhered. A printing process in which the paste is printed on the board by pressing it onto the board,
A method for forming a circuit by pad printing, which includes a drying and firing step of drying and firing the printed paste.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP25031883A JPS60140788A (en) | 1983-12-27 | 1983-12-27 | Method of forming circuit by pad printing |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP25031883A JPS60140788A (en) | 1983-12-27 | 1983-12-27 | Method of forming circuit by pad printing |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS60140788A true JPS60140788A (en) | 1985-07-25 |
Family
ID=17206120
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP25031883A Pending JPS60140788A (en) | 1983-12-27 | 1983-12-27 | Method of forming circuit by pad printing |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60140788A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02244795A (en) * | 1989-03-17 | 1990-09-28 | Nippon Cement Co Ltd | Manufacture of ceramic multilayer substrate |
JPH03153308A (en) * | 1989-11-10 | 1991-07-01 | Sekisui Chem Co Ltd | Manufacture of ceramic complex |
JPH0730231A (en) * | 1992-11-05 | 1995-01-31 | Isao Ishizuki | Method for forming electronic wiring circuit by intaglio transfer printing |
-
1983
- 1983-12-27 JP JP25031883A patent/JPS60140788A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02244795A (en) * | 1989-03-17 | 1990-09-28 | Nippon Cement Co Ltd | Manufacture of ceramic multilayer substrate |
JPH03153308A (en) * | 1989-11-10 | 1991-07-01 | Sekisui Chem Co Ltd | Manufacture of ceramic complex |
JPH0730231A (en) * | 1992-11-05 | 1995-01-31 | Isao Ishizuki | Method for forming electronic wiring circuit by intaglio transfer printing |
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