JPS5933896A - Method of forming conductor passage on substrate - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for forming conductor tracks in hybrid integrated circuits and printed wiring boards.

Conventionally, the following three methods have been mainly used to form conductor paths for hybrid integrated circuits (hereinafter referred to as HICs) and printed wiring boards.

The first method, which is mainly used for thin film HIC, is to construct a conductor film by vacuum evaporation, and then selectively etch the conductor film using photocopying technology to form conductor paths. .

The second method is. This is a method used for thick film HIC, in which thick film ink for conductors is screen printed on a substrate and baked to form conductor paths.

Furthermore, the third method is a method used for printed wiring boards, and involves etching and removing unnecessary copper foil from a copper-clad laminate and using the remaining copper as a conductor path. be.

Such various methods include vapor deposition, screen printing,
Due to the manufacturing process such as etching, the manufacturing process is spread over several steps, the manufacturing lead time is long, and the need for an exposure mask or screen for screen printing in the photo-etching process makes it difficult to create new conductor patterns. There were drawbacks such as the difficulty of immediately responding to design changes.

The present invention has been made in view of the conventional circumstances, and therefore, an object of the present invention is to transfer and form surface conductor paths on a substrate, without using photocopying technology, etching technology, etc. The object of the present invention is to provide a new method that makes it possible to eliminate the above-mentioned drawbacks.

In order to achieve the above object, the method for forming a conductor path on a substrate according to the present invention is such that when forming a conductor path on a substrate, a conductive paste composed of minute conductor particles and a binder is formed into minute capsules. A microcapsule-encapsulated conductive paste made into a viscous state by kneading the capsules and another binder is applied to one side of the transfer plate, and a substrate is placed on the coated side via a mesh screen, and the transfer The microcapsules are destroyed on the MU mesh screen by pressing and tracing the conductor path pattern from one side of the plate on which the paste is not applied, and the conductive paste inside the capsule is removed through the mesh screen. The method is characterized in that a conductor path pattern is formed by transferring the conductor path pattern onto the substrate.

According to the present invention, since an exposure mask, a screen printing screen, etc. are not required, conductor paths can be easily formed on a substrate.

Next, a preferred embodiment of the present invention will be specifically explained with reference to the drawings.

FIG. 1 is a diagram showing the structure of a microcapsular conductive paste according to the present invention. That is, the microcapsule-encapsulated conductive paste used in the present invention includes microconductor particles 11 and binder 1.
A conductive paste composed of 2 and 3 is encapsulated in microcapsules 13, and the capsules 13 and a second different binder 14 are kneaded to form a viscous state.

FIG. 2 is a perspective view showing an outline of a pressure transfer type pattern plotter for explaining an embodiment of the present invention. In FIG. 2, reference number 21 is a pressure head, n is a tip needle portion, 23 is a transfer plate, 24 is a base film, 25 is a mesh screen film, 26 is a substrate, and 27 is a pressure head drive control device. show.

In FIG. 2, a transfer plate 23 is set under a pressure head 21 that is relatively movable in the X and Y directions. The transfer plate 23 includes two parts: a base film 24 for applying the micro-encapsulated conductive paste and a mesh screen film 25 for avoiding direct contact between the conductive paste and the substrate 26, configured as shown in FIG. Consists of layers. A substrate 26 is positioned below the transfer plate 23 with a slight gap from the transfer plate mesh screen film 25.

In this state, the pressure head 21 is lowered under the control of the pressure head drive control bag @27, and the needle portion 2 at the tip of the head
By applying pressure to the transfer plate 23 at step 2, the capsule 13 shown in FIG. Further, by moving the pressure head 21 according to the conductor path pattern, a predetermined conductor path pattern is formed on the substrate 26.

Although the configuration and operation of the present invention have been described above with reference to one preferred embodiment, this is merely an example, and it goes without saying that the present invention is not limited only to the embodiment described here. .

As explained above, the present invention is capable of shortening manufacturing lead time, responding to small-volume production of a wide variety of products, and is suitable for substrates where settings are frequently changed, such as in the production of prototypes, by directly pressurizing and transferring a pattern to generate conductor paths on a substrate. It has an adaptable effect.

[Brief explanation of the drawing]

FIG. 1 is a configuration diagram of a microcapsular conductive paste according to the present invention, and FIG. 2 is a perspective view showing an outline of a pressure transfer type pattern plotter for explaining an embodiment of the present invention. 11. , micro conductor particles, 1258. binder, 13. ,
, microcapsule, 14. , , binder, 21. ,,pressure head, 22. ,, tip needle portion, 23. ,,transfer plate,
24. , , base membrane, 25. , , mesh screen membrane, 2600. Substrate, 27. ,, Pressure head drive control device patent applicant Nippon Tanuki Co., Ltd.

Claims (1)

[Claims] When forming conductor paths on a substrate, a conductive paste composed of minute conductor particles and a binder is encapsulated in microscopic capsules, and the capsules and another binder are kneaded to form a viscous paste. A conductive paste encapsulated in microcapsules is applied to one side of the transfer plate, and a substrate for forming a conductive path is placed on the coated side via a mesh screen, and a conductive path is formed on the other side of the transfer plate on which the paste is not applied. The microcapsules are destroyed on the mesh screen by tracing the pattern under pressure, and the conductive paste inside the capsules is transferred onto the substrate via the IIJ mesh screen to form a conductor path pattern. A method for forming conductor paths on a substrate, characterized by: