JPH05251855A - Method for manufacturing printed-circuit board - Google Patents
Method for manufacturing printed-circuit boardInfo
- Publication number
- JPH05251855A JPH05251855A JP4652092A JP4652092A JPH05251855A JP H05251855 A JPH05251855 A JP H05251855A JP 4652092 A JP4652092 A JP 4652092A JP 4652092 A JP4652092 A JP 4652092A JP H05251855 A JPH05251855 A JP H05251855A
- Authority
- JP
- Japan
- Prior art keywords
- solder resist
- marking ink
- oil
- printed
- water repellency
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は印刷配線板の製造方法に
関し、特にソルダレジスト及びマーキングの形成工程を
含む印刷配線板の製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a printed wiring board, and more particularly to a method for manufacturing a printed wiring board including a step of forming a solder resist and a marking.
【０００２】[0002]
【従来の技術】従来、印刷配線板のソルダレジスト及び
マーキングの形成は、まず、図４（ａ）に示すように、
絶縁基板１上に部品実装用パッド２を含む回路を形成す
る。2. Description of the Related Art Conventionally, as shown in FIG. 4 (a), a solder resist and a marking of a printed wiring board have been formed.
A circuit including the component mounting pad 2 is formed on the insulating substrate 1.
【０００３】次に、図４（ｂ）に示すように、所定の箇
所に液状ソルダレジスト７を形成する。Next, as shown in FIG. 4B, a liquid solder resist 7 is formed at a predetermined position.
【０００４】次に、図４（ｃ）に示すように、マーキン
グを所定の箇所に形成する。Next, as shown in FIG. 4 (c), markings are formed at predetermined locations.
【０００５】一般に、ソルダレジスト，マーキングの形
成方法は、それぞれ熱硬化性のインキを用いたスクリー
ン印刷法とＵＶ硬化性のインキを用いたホト印刷法とが
ある。Generally, methods of forming a solder resist and a marking include a screen printing method using a thermosetting ink and a photo printing method using a UV curable ink.
【０００６】[0006]
【発明が解決しようとする課題】従来の、特に、部品実
装用パッドを有する印刷配線板においては、以下のよう
な問題点があった。The conventional printed wiring board having a component mounting pad, in particular, has the following problems.
【０００７】一般に、印刷配線板には実装する部品の名
称，搭載場所を表示する為にマーキングインキが印刷さ
れている。しかし、このマーキングインキは、ソルダレ
ジストを形成した後ソルダレジスト上に印刷される為、
その膜厚は、ソルダレジストの膜厚も加えると、絶縁基
板表面から４０〜６０μｍ、パターンの密集した領域に
おいては、７０〜８０μｍにも達する。Generally, a marking ink is printed on the printed wiring board in order to display the name of the component to be mounted and the mounting location. However, this marking ink is printed on the solder resist after forming the solder resist,
When the thickness of the solder resist is also added, the film thickness reaches 40 to 60 μm from the surface of the insulating substrate, and reaches 70 to 80 μm in the region where the pattern is dense.
【０００８】この膜厚は、部品実装用パッドにチップ部
品を搭載する際、チップ部品の下腹部とマーキングイン
キとの接触を起こし、その結果、正しい実装形態が得ら
れずチップ部品と部品実装用パッドとの接続信頼性を失
う原因となるという欠点があった。This film thickness causes contact between the lower abdomen of the chip component and the marking ink when the chip component is mounted on the component mounting pad, and as a result, the correct mounting form cannot be obtained and the chip component and component mounting There is a drawback that it causes a loss of connection reliability with the pad.
【０００９】本発明の目的は、チップ部品とマーキング
インキとの接触がなく、接続信頼性の高い印刷配線板の
製造方法を提供することにある。An object of the present invention is to provide a method for producing a printed wiring board which has high contact reliability without contact between the chip component and the marking ink.
【００１０】[0010]
【課題を解決するための手段】本発明の印刷配線板の製
造方法は、絶縁基板上に部品実装用パッドを含む回路を
形成する工程と、該回路が形成された前記絶縁基板上に
撥油性及び撥水性に富むマーキングインキを所定の箇所
に印刷する工程と、液状ソルダレジストを従来の工法に
て所定の箇所に形成する工程とを含んで構成される。A method of manufacturing a printed wiring board according to the present invention comprises a step of forming a circuit including a component mounting pad on an insulating substrate, and an oil-repellent property on the insulating substrate on which the circuit is formed. And a step of printing a marking ink having high water repellency at a predetermined location, and a step of forming a liquid solder resist at the predetermined location by a conventional method.
【００１１】[0011]
【作用】マーキングインキに撥油性及び撥水性を持たせ
る事により、次工程で印刷するソルダレジストは、少な
くともマーキングインキ上に付着することなく施され
る。Function By imparting oil repellency and water repellency to the marking ink, the solder resist to be printed in the next step is applied at least without adhering to the marking ink.
【００１２】マーキングインキに撥油撥水性をもたせる
には、例えばフッ素系のポリマ，オリゴマー又はシリコ
ンオイルを添加する。In order to impart oil and water repellency to the marking ink, for example, a fluorine-based polymer, oligomer or silicone oil is added.
【００１３】[0013]
【実施例】次に、本発明の実施例について図面を参照し
て説明する。Embodiments of the present invention will now be described with reference to the drawings.
【００１４】図１（ａ）〜（ｄ）は本発明の第１の実施
例を説明する工程順に示した断面図である。1 (a) to 1 (d) are sectional views showing the first embodiment of the present invention in the order of steps.
【００１５】第１の実施例は、液状の熱硬化型ソルダレ
ジストを使用した場合の例である。The first embodiment is an example in which a liquid thermosetting solder resist is used.
【００１６】まず、図１（ａ）に示すように、絶縁基板
１の所定の箇所に部品実装用パッド２を形成する。First, as shown in FIG. 1A, a component mounting pad 2 is formed on a predetermined portion of an insulating substrate 1.
【００１７】次に、図１（ｂ）に示すように、撥油撥水
性マーキングインキ３を公知の工法で所定の箇所に印刷
し、硬化する。Next, as shown in FIG. 1 (b), the oil-repellent and water-repellent marking ink 3 is printed on a predetermined portion by a known method and cured.
【００１８】次に、図１（ｃ）に示すように、液状熱硬
化型ソルダレジスト４を絶縁基板１の片面にスクリーン
印刷法によりパターニングし、熱硬化する工程を経て所
定のソルダレジストパターンを得る。Next, as shown in FIG. 1C, a liquid thermosetting solder resist 4 is patterned on one surface of the insulating substrate 1 by a screen printing method, and a predetermined solder resist pattern is obtained through a step of thermosetting. ..
【００１９】次に、図１（ｄ）に示すように、図１
（ａ）〜（ｃ）の工程を絶縁基板１の反対面に対しても
繰り返し行なうことにより、第１の実施例の製造方法に
よる印刷配線板を得る。Next, as shown in FIG.
By repeating the steps (a) to (c) for the opposite surface of the insulating substrate 1, a printed wiring board by the manufacturing method of the first embodiment is obtained.
【００２０】図２（ａ）〜図３（ｂ）は本発明の第２の
実施例の製造方法を説明する工程順に示した断面図であ
る。第２の実施例は、液状ホトソルダレジストを使用し
た場合の例である。2 (a) to 3 (b) are cross-sectional views showing the manufacturing process of the second embodiment of the present invention in the order of steps. The second embodiment is an example of using a liquid photo solder resist.
【００２１】まず、図２（ａ）に示すように、絶縁基板
１の所定の箇所に部品実装用パッド２を形成する。First, as shown in FIG. 2A, the component mounting pad 2 is formed at a predetermined location on the insulating substrate 1.
【００２２】次に、撥油撥水性マーキングインキ３を公
知の工法で所定の箇所に印刷し、硬化する。Next, the oil-repellent and water-repellent marking ink 3 is printed on a predetermined portion by a known method and cured.
【００２３】次に、図２（ｃ）に示すように、液状ホト
ソルダレジスト５を絶縁基板１の片面にべた印刷し、指
触乾燥する。Next, as shown in FIG. 2C, a liquid photo solder resist 5 is solid-printed on one surface of the insulating substrate 1 and dried by touch with a finger.
【００２４】次に、図２（ｄ）に示すように、絶縁基板
１の反対面に対しても図２（ｃ）と同様に液状ホトソル
ダレジスト５をべた印刷し指触乾燥する。Next, as shown in FIG. 2D, the liquid photo solder resist 5 is solidly printed on the opposite surface of the insulating substrate 1 as in FIG.
【００２５】次に、図３（ａ）に示すように、マイラー
フィルム６を介して両面同時露光する。Next, as shown in FIG. 3A, both sides are simultaneously exposed through the mylar film 6.
【００２６】次に、図３（ｂ）に示すように、現像する
工程を経て所定のソルダレジストパターンを形成し、熱
硬化を行なうことにより、第２の実施例の製造方法によ
る印刷配線板を得る。第２の実施例では、液状ソルダレ
ジストを種類を問わず適用出来る。Next, as shown in FIG. 3 (b), a predetermined solder resist pattern is formed through a developing process, and heat curing is performed to obtain a printed wiring board by the manufacturing method of the second embodiment. obtain. In the second embodiment, the liquid solder resist can be applied regardless of the type.
【００２７】[0027]
【発明の効果】以上説明したように本発明は、印刷配線
板の製造方法におけるソルダレジスト及びマーキングイ
ンキの形成工程において、予め、撥油撥水性に富むマー
キングインキを印刷した後に液状ソルダレジストを印刷
する事で、液状ソルダレジストがマーキングインキ上に
付着することなく印刷出来、液状ソルダレジストとマー
キングインキは均一な一層構造として凹凸なく絶縁基板
上に形成されるので、部品実装用パッドにチップ部品を
実装する際のチップ部品下腹部とマーキングインキとの
接触を防ぐことが出来、チップ部品と部品実装用パッド
との接続信頼性の劣化を皆無に出来るという効果を有す
る。As described above, according to the present invention, in the step of forming the solder resist and the marking ink in the method for manufacturing a printed wiring board, the marking ink having a high oil and water repellency is printed in advance and then the liquid solder resist is printed. By doing so, the liquid solder resist can be printed without adhering to the marking ink, and since the liquid solder resist and the marking ink are formed on the insulating substrate as a uniform single layer structure without unevenness, chip parts can be mounted on the component mounting pad. It is possible to prevent contact between the lower abdomen of the chip component and the marking ink when mounting, and it is possible to eliminate deterioration in connection reliability between the chip component and the component mounting pad.
【図１】本発明の第１の実施例を説明する工程順に示し
た断面図である。FIG. 1 is a cross-sectional view showing a process sequence of a first embodiment of the present invention.
【図２】本発明の第２の実施例を説明する工程順に示し
た断面図である。2A to 2D are cross-sectional views showing a process sequence for explaining a second embodiment of the present invention.
【図３】本発明の第２の実施例を説明する工程順に示し
た断面図である。3A to 3D are cross-sectional views showing a second embodiment of the present invention in the order of steps.
【図４】従来の印刷配線板の製造方法の一例を説明する
工程順に示した断面図である。4A to 4D are cross-sectional views showing an example of a conventional method for manufacturing a printed wiring board in the order of steps for explaining the method.
１ 絶縁基板 ２ 部品実装用パッド ３ 撥油撥水性マーキングインキ ４ 液状熱硬化型ソルダレジスト ５ 液状ホトソルダレジスト ６ マイラーフィルム ７ 液状ソルダレジスト ８ マーキングインキ 1 Insulating substrate 2 Component mounting pad 3 Oil-repellent and water-repellent marking ink 4 Liquid thermosetting solder resist 5 Liquid photo solder resist 6 Mylar film 7 Liquid solder resist 8 Marking ink
Claims (1)
路を形成する工程と、該回路が形成された前記絶縁基板
上に撥油性及び撥水性に富むマーキングインキを所定の
箇所に印刷する工程と、液状ソルダレジストを従来の工
法にて所定の箇所に形成する工程とを含む事を特徴とす
る印刷配線板の製造方法。1. A step of forming a circuit including a component mounting pad on an insulating substrate, and a step of printing a marking ink rich in oil repellency and water repellency on a predetermined location on the insulating substrate on which the circuit is formed. And a step of forming a liquid solder resist at a predetermined place by a conventional method, a method of manufacturing a printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4652092A JPH05251855A (en) | 1992-03-04 | 1992-03-04 | Method for manufacturing printed-circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4652092A JPH05251855A (en) | 1992-03-04 | 1992-03-04 | Method for manufacturing printed-circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05251855A true JPH05251855A (en) | 1993-09-28 |
Family
ID=12749556
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4652092A Withdrawn JPH05251855A (en) | 1992-03-04 | 1992-03-04 | Method for manufacturing printed-circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05251855A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06338677A (en) * | 1993-05-31 | 1994-12-06 | Nec Corp | Manufacture of printed wiring board |
| JPWO2005027601A1 (en) * | 2003-09-11 | 2006-11-24 | 太陽インキ製造株式会社 | Insulating pattern and method for forming the same |
| CN104883818A (en) * | 2014-02-28 | 2015-09-02 | 深圳崇达多层线路板有限公司 | Printed circuit board contraposition method |
-
1992
- 1992-03-04 JP JP4652092A patent/JPH05251855A/en not_active Withdrawn
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06338677A (en) * | 1993-05-31 | 1994-12-06 | Nec Corp | Manufacture of printed wiring board |
| JPWO2005027601A1 (en) * | 2003-09-11 | 2006-11-24 | 太陽インキ製造株式会社 | Insulating pattern and method for forming the same |
| JP4563939B2 (en) * | 2003-09-11 | 2010-10-20 | 太陽インキ製造株式会社 | Insulation pattern forming method |
| CN104883818A (en) * | 2014-02-28 | 2015-09-02 | 深圳崇达多层线路板有限公司 | Printed circuit board contraposition method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19990518 |