JPH03102894A - Structure of through hole and manufacture thereof - Google Patents
Structure of through hole and manufacture thereofInfo
- Publication number
- JPH03102894A JPH03102894A JP23937089A JP23937089A JPH03102894A JP H03102894 A JPH03102894 A JP H03102894A JP 23937089 A JP23937089 A JP 23937089A JP 23937089 A JP23937089 A JP 23937089A JP H03102894 A JPH03102894 A JP H03102894A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- conductive paint
- circuit pattern
- board
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 18
- 238000007639 printing Methods 0.000 claims abstract 2
- 239000003973 paint Substances 0.000 claims description 63
- 239000000758 substrate Substances 0.000 claims description 44
- 238000000034 method Methods 0.000 claims description 6
- 239000010409 thin film Substances 0.000 claims description 4
- 238000004080 punching Methods 0.000 claims 1
- 238000007650 screen-printing Methods 0.000 abstract description 6
- 239000011248 coating agent Substances 0.000 abstract 5
- 238000000576 coating method Methods 0.000 abstract 5
- 238000010586 diagram Methods 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- 230000001154 acute effect Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000010408 film Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、基板の両面に設けた回路パターンを接続する
スルーホールの構造及びその製造方法に関するものであ
る。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a structure of a through hole for connecting circuit patterns provided on both sides of a substrate and a method of manufacturing the same.
従来、基板の両面に設けた回路パターンを容易に接続す
る方法としてスルーホールの技術が開発され、実用化さ
れている。Conventionally, through-hole technology has been developed and put into practical use as a method for easily connecting circuit patterns provided on both sides of a board.
第9図はこの種従来のスルーホールの構造を示す側断面
図である。FIG. 9 is a side sectional view showing the structure of a conventional through hole of this kind.
同図に示すように従来のスルーホールは、基板1000
両面に回路パターン101,103を形成するとともに
、貫通穴107を形成し、該貫通穴107内部に銀ペー
ストからなる導体塗料1o5を充填し、この導体塗料1
05によって上下の回路パターン101,103を導通
する構造となっている。As shown in the figure, the conventional through hole
Circuit patterns 101 and 103 are formed on both sides, and a through hole 107 is formed, and a conductive paint 1o5 made of silver paste is filled inside the through hole 107.
05, the upper and lower circuit patterns 101 and 103 are electrically connected.
ところでこの種の従来のスルーホールには、第10図(
第9図に示すA部分の拡大図)に示すように、貫通穴1
07の端部のエッジ部100aと外部との間に、導体塗
料105が構成する層が介在している。By the way, this type of conventional through-hole is shown in Fig. 10 (
As shown in the enlarged view of part A shown in Fig. 9), the through hole 1
A layer made of conductive paint 105 is interposed between the edge portion 100a at the end of 07 and the outside.
しかしながらこの層は1層のみであるため、強度が弱く
、熱や圧力等で導体塗料105にクラック105a等が
生じ易い。このため、スルーホール部分の抵抗値が増大
したり導電不良が生じたりする問題点があった。However, since this layer is only one layer, its strength is low, and cracks 105a are likely to occur in the conductive paint 105 due to heat, pressure, etc. For this reason, there are problems in that the resistance value of the through-hole portion increases and poor conductivity occurs.
特に、この基板100を可撓性のある薄い合成樹脂フイ
ルム(フレキシブル基板)で構成した場合は、この基板
100が容易に撓むため、このクラツク105aは非常
に生じ易くなる。Particularly, when the substrate 100 is made of a flexible thin synthetic resin film (flexible substrate), the substrate 100 is easily bent, so that the crack 105a is very likely to occur.
本発明は上述の点に鑑みてなされたものであり\たとえ
基板をフレキシブル基板で構成したとしても、スルーホ
ール部分で抵抗値の増大や導電不良が生じにくいスルー
ホールの構造及びその製造方法を提供することにある。The present invention has been made in view of the above-mentioned points, and provides a through-hole structure and a method for manufacturing the same, in which an increase in resistance value and poor conductivity are unlikely to occur in the through-hole portion even if the board is made of a flexible board. It's about doing.
上記問題点を解決するため本発明はスルーホールの構造
を、基板に設けた貫通穴の内部に、該貫通穴の両端部の
エッジ部分を越える位置まで導電塗料を充填し、基板の
両面に露出した導電塗料の上からそれぞれその全表面を
覆うように、回路パターンを印刷して構或した。In order to solve the above-mentioned problems, the present invention has a through-hole structure in which conductive paint is filled inside a through-hole provided in a substrate to a position exceeding the edge portions at both ends of the through-hole, and is exposed on both sides of the substrate. A circuit pattern was printed on the conductive paint so as to cover the entire surface of the conductive paint.
また本発明はスルーホールの構造を、基板に設けた貫通
穴と、基板の少なくとも一方の面上であって貫通穴の周
囲を囲むように形成された導電薄膜からなるパットとを
具備し、前記基板の貫通穴の内部に、貫通穴の両端部の
エッジ部分を越える位置まで導電塗料を充填し、基板の
両面に露出した前記導電塗料の上からそれぞれその全表
面を覆うように、回路パターンを印刷して構成した。Further, the present invention provides a through hole structure including a through hole provided in a substrate and a pad made of a conductive thin film formed on at least one surface of the substrate so as to surround the through hole. Fill the inside of the through hole of the board with conductive paint to a position beyond the edges of both ends of the through hole, and apply a circuit pattern over the conductive paint exposed on both sides of the board so as to cover the entire surface of each. Printed and configured.
また本発明は上記スルーホールの製造方法を、可撓性を
有するフレキシブル基板の少なくともいずれか一方の面
上に導電薄膜からなるパットを形成し、該パットの上か
らポンチを突入して貫通穴を形成し、該貫通穴の内部に
該貫通穴の両端部のエッジ部分を越える位置まで導電塗
料を充填し、さらに基板の両面に露出した導電塗料の上
からそれぞれその全表面を覆うように回路パターンを印
刷して構成した。Further, the present invention provides the method for manufacturing a through hole by forming a pad made of a conductive thin film on at least one surface of a flexible substrate, and inserting a punch from above the pad to form a through hole. The inside of the through-hole is filled with conductive paint to a position beyond the edges of both ends of the through-hole, and a circuit pattern is formed on the conductive paint exposed on both sides of the board so as to cover the entire surface of the conductive paint. was printed and configured.
また本発明はスルーホールの構造を基板の少なくとも一
方の面に形成した回路パターンの所定部分に貫通穴を形
成し、該貫通穴の内部に、該貫通穴の両端部のエッジ部
分を越える位置まで導電塗料を充填するとともに、前記
回路パターンを形成した面の反対側の面側に露出した導
電塗料の上からその全表面を覆うように、回路パターン
を印刷して構成した。The present invention also provides a through-hole structure in which a through-hole is formed in a predetermined portion of a circuit pattern formed on at least one surface of a substrate, and the inside of the through-hole extends beyond the edge portions of both ends of the through-hole. A conductive paint was filled and a circuit pattern was printed so as to cover the entire surface of the conductive paint exposed on the side opposite to the side on which the circuit pattern was formed.
また本発明は上記スルーホールの製造方法を、可撓性を
有するフレキシブル基板の少なくともいずれか一方の面
上に回路パターンを形成し、該回路パターンの所定部分
の上からポンチを突入して貫通穴を形成し、該貫通穴の
内部に該貫通穴の両端部のエッジ部分を越える位置まで
導電塗料を充填し、さらに前記回路パターンを形成した
面の反対側の面側に露出した導電塗料の上からその全表
面を覆うように、回路パターンを印刷して構成した。Further, the present invention provides the method for manufacturing a through hole by forming a circuit pattern on at least one surface of a flexible substrate, and inserting a punch from above a predetermined portion of the circuit pattern to form a through hole. , fill the inside of the through hole with conductive paint to a position beyond the edges of both ends of the through hole, and fill the conductive paint exposed on the surface opposite to the surface on which the circuit pattern is formed. A circuit pattern was printed to cover the entire surface.
上記の如く構成することにより、フレキシブル基板に形
成した貫通穴のエッジ部分と外部との間に2層の導電材
料が介在することとなるので、該部分の強化が図れ、ク
ランク等が生じにくくなる。By configuring as described above, two layers of conductive material are interposed between the edge portion of the through hole formed in the flexible substrate and the outside, so this portion can be strengthened and cranks etc. are less likely to occur. .
また貫通穴の少なくとも一方の面側の周囲にパットまた
は回路パターンを予め設けた場合は、パット等側の貫通
穴の周囲のエッジ部分上に盛られる導電塗料の量が少な
くても、導電塗料がこのパット等に接続されることによ
って全体としてパット側の導電塗料の層は厚くなり、ク
ラツク等は入りにくい。In addition, if a pad or circuit pattern is provided in advance around at least one side of the through hole, even if the amount of conductive paint applied to the edge around the through hole on the pad side is small, the conductive paint will By being connected to this pad, etc., the layer of conductive paint on the pad side becomes thicker as a whole, making it difficult for cracks to enter.
またフレキシブル基板の一方の面に設けたパット又は回
路パターンの上側からポンチを突入して貫通穴を形成す
るように構成した場合は、突入した側の貫通穴周囲のエ
ッジ部分がなだらかに傾斜した傾斜面となるので、この
部分上に盛られた導電塗料内にクランク等は生じにくい
。In addition, if the configuration is such that a through hole is formed by inserting a punch from above the pad or circuit pattern provided on one side of the flexible board, the edge portion around the through hole on the side where the punch is inserted will have a gentle slope. Since it is a flat surface, it is difficult for cranks to form in the conductive paint applied on this part.
以下、本発明の実施例を図面に基づいて詳細に説明する
。Embodiments of the present invention will be described in detail below with reference to the drawings.
第1図は第1の発明の一実施例にかかるスルーホールの
構造を示す側断面図である。FIG. 1 is a side sectional view showing the structure of a through hole according to an embodiment of the first invention.
同図に示すようにこのスルーホールは、フレキシブル基
板1に設けた貫通穴2の内部に、導電塗料3を充填し、
該導電塗料3の上からそれぞれその全表面を覆うように
、回路パターン4,5を印刷して構成されている。As shown in the figure, this through hole is made by filling the inside of a through hole 2 provided in a flexible substrate 1 with a conductive paint 3.
Circuit patterns 4 and 5 are printed on the conductive paint 3 so as to cover the entire surface thereof.
ここでフレキシブル基板1は可撓性を有する例えばポリ
エステルフィルムで構成されている。Here, the flexible substrate 1 is made of a flexible polyester film, for example.
導電塗料3は銀ペースト等の材料で構成されている。こ
の導電塗料3は貫通穴2の内部に充填され、さらにフレ
キシブル基板1の両表面上に至るまで、即ち貫通穴2の
両端部のエッジ部分1a,1aを越える位置まで、盛ら
れている。The conductive paint 3 is made of a material such as silver paste. This conductive paint 3 is filled inside the through hole 2 and is further applied to both surfaces of the flexible substrate 1, that is, to a position beyond the edge portions 1a, 1a at both ends of the through hole 2.
回路パターン4,5は例えば銀ペーストで構戒され、そ
れぞれ基板1の両面に露出した導電塗料3の上から導電
塗料3の全表面を覆うように、スクリーン印刷されてい
る。The circuit patterns 4 and 5 are made of silver paste, for example, and are screen printed on the conductive paint 3 exposed on both sides of the substrate 1 so as to cover the entire surface of the conductive paint 3.
第2図はこのスルーホールを製造するための製造方法を
示す図である。FIG. 2 is a diagram showing a manufacturing method for manufacturing this through hole.
同図(a),(b)に示すように、まずフレキシブル基
板1の所定部分に貫通穴2を形成する。As shown in FIGS. 2A and 2B, a through hole 2 is first formed in a predetermined portion of a flexible substrate 1. As shown in FIGS.
ここでこの実施例にあってはフレキシブル基板1の厚み
は100μm1貫通穴2の直径はφ0.4mmとした。In this embodiment, the thickness of the flexible substrate 1 was 100 μm, and the diameter of the through hole 2 was φ0.4 mm.
次に同図(c)に示すように、この貫通穴2内に導電塗
料3をスクリーン印刷にて充填する。Next, as shown in FIG. 2C, the through hole 2 is filled with conductive paint 3 by screen printing.
そしてこのフレキシブル基板1の両面にそれぞれ回路パ
ターン4,5をスクリーン印刷によって形成するが、こ
のとき合わせて該回路パターン4,5の一部によって導
電塗料3の全表面を覆うようにする。Then, circuit patterns 4 and 5 are formed on both sides of the flexible substrate 1 by screen printing, and at this time, the entire surface of the conductive paint 3 is covered by a portion of the circuit patterns 4 and 5.
これによってこのスルーホールが完成する。This completes this through hole.
ここで第3図は第1図に示すB部分の拡大図である。Here, FIG. 3 is an enlarged view of portion B shown in FIG. 1.
同図に示すように、本発明にかかるスルーホールによれ
ば、フレキシブル基板1のエッジ部分1aと外部との間
に、導電塗料3が成す層と導体パターン4(又は5)が
成す層の2つの層が設けられているので、この部分が強
化されることとなる。As shown in the figure, according to the through hole according to the present invention, two layers are formed between the edge portion 1a of the flexible substrate 1 and the outside: a layer formed by the conductive paint 3 and a layer formed by the conductive pattern 4 (or 5). Since two layers are provided, this part will be strengthened.
このためたとえフレキシブル基板1が撓んでも、この部
分にクランク等は生じにくい。Therefore, even if the flexible substrate 1 is bent, a crank or the like is unlikely to occur in this portion.
次に第4図は第2の発明の一実施例にかかるスルーホー
ルの構造を示す側断面図である。Next, FIG. 4 is a side sectional view showing the structure of a through hole according to an embodiment of the second invention.
なお上記第1図に示すと同一の部材には同一の符号を付
してその詳細な説明は省略する。Note that the same members as shown in FIG. 1 are given the same reference numerals and detailed explanation thereof will be omitted.
同図に示すようにこのスルーホールの場合は、フレキシ
ブル基板1に貫通穴2を設け、またフレキシブル基板1
の一方の面上に辻導電材料からなるパット6を形成し、
さらに貫通穴2の内部に、導電塗料3を充填し、該導電
塗料3の上からそれぞれその全表面を覆うように、回路
パターン4,5を印刷して構成されている。As shown in the figure, in the case of this through hole, a through hole 2 is provided in the flexible substrate 1, and a through hole 2 is provided in the flexible substrate 1.
A pad 6 made of Tsuji conductive material is formed on one surface of the
Further, the inside of the through hole 2 is filled with a conductive paint 3, and circuit patterns 4 and 5 are printed on the conductive paint 3 so as to cover the entire surface of the conductive paint 3, respectively.
ここでパット6はフレキシブル基板1の一方の面上であ
って貫通穴2の周囲を囲むように形成されている。この
パット6ほ銀ペースト等の導電塗料で構成される。Here, pad 6 is formed on one surface of flexible substrate 1 so as to surround through hole 2 . This pad 6 is made of conductive paint such as silver paste.
なおここで導電塗料3は貫通穴2のエッジ部分1aを越
えてこのパット6に接続する位置まで充填されている。Here, the conductive paint 3 is filled beyond the edge portion 1a of the through hole 2 to the position where it connects to this pad 6.
第5図はこのスルーホールを製造するための製造方法を
示す図である。FIG. 5 is a diagram showing a manufacturing method for manufacturing this through hole.
同IE(a)に示すように、まずフレキシブル基板1の
所定部分にパット6を形成する。このパット6は例えば
銀ペーストを円形にスクリーン印刷して焼或して構成さ
れている。As shown in IE (a), pads 6 are first formed on predetermined portions of the flexible substrate 1. This pad 6 is constructed by, for example, screen-printing and firing silver paste into a circular shape.
次に同図(b)に示すように、フレキシブル基板1のパ
ット6を形戒した面側からボンチ50を突入させて、こ
のフレキシブル基板1に貫通穴2を形成する。Next, as shown in FIG. 2B, a punch 50 is inserted from the side of the flexible substrate 1 on which the pad 6 is formed to form a through hole 2 in the flexible substrate 1.
第6図はこのフレキシブル基板1にボンチ50を突入さ
せたときの第5図(b)のC部分を拡大して示す図であ
る。FIG. 6 is an enlarged view of portion C in FIG. 5(b) when the punch 50 is inserted into the flexible substrate 1.
同図(a)に示すように、パット6側からポンチ50を
突入させると、パット6の貫通穴2側の端部6a及びフ
レキシブル基板1のエッジ部分1aはポンチ50に引き
ずり込まれて貫通穴2の内部に若干入り込もうとする。As shown in FIG. 5A, when the punch 50 is inserted from the side of the pad 6, the end 6a of the pad 6 on the through hole 2 side and the edge portion 1a of the flexible substrate 1 are dragged by the punch 50 and inserted into the through hole. Trying to get into the inside of 2.
そして同図(b)に示すように、ポンチ50を引き抜け
ば、パット6の端部6a及びエッジ部分1aは引き抜き
方向に復帰しようとするが、完全には復帰しない。この
結果、最終的にはパット6の貫通穴2に面する内周側端
部6a及びエッジ部分1aは鋭角とならず、若干貫通穴
2の内部側になだらかに傾斜した傾斜面となる。As shown in FIG. 2B, when the punch 50 is pulled out, the end 6a and edge portion 1a of the pad 6 try to return in the pulling direction, but do not return completely. As a result, the inner end 6a and the edge portion 1a of the pad 6 facing the through hole 2 do not form an acute angle, but form an inclined surface that is slightly gently inclined toward the inside of the through hole 2.
次に第5図(C)に示すように、ボンチ50を引き抜い
た貫通穴2内部に矢印D方向から導電塗料3を充填する
。Next, as shown in FIG. 5(C), the inside of the through hole 2 from which the punch 50 was pulled out is filled with conductive paint 3 from the direction of arrow D.
そして同図(d)に示すように、このプレキシブル基板
1の両面に、導電塗料3の全表面を覆うように、それぞ
れ回路パターン4,5をスクリーン印刷する。As shown in FIG. 1D, circuit patterns 4 and 5 are screen printed on both sides of the flexible substrate 1 so as to cover the entire surface of the conductive paint 3, respectively.
これによってこのスルーホールが完成する。This completes this through hole.
ところで同図(C)に示すように、矢印D方向から導電
塗料3を充填した場合、充填した側のエッジ部分1a上
に盛られる導電塗料3に比べて、充填するのと反対側の
エッジ部分1a上に盛られる導電塗料3はその盛られる
量が少なめとなる。By the way, when the conductive paint 3 is filled from the direction of arrow D, as shown in FIG. The amount of conductive paint 3 applied on 1a is rather small.
しかしながら本発明のように、予めこの部分にパット6
を設けておけば、導電塗料3がこのノ<・ント6に接続
されることとなるので、全体としてこのエッジ部分1a
上に盛られる導電塗料3の層は厚くなり、このためクラ
ンク等は入りにくくなる。However, as in the present invention, the pad 6 is placed on this part in advance.
If this is provided, the conductive paint 3 will be connected to this node 6, so this edge portion 1a will be connected as a whole.
The layer of conductive paint 3 applied on top becomes thicker, making it difficult for a crank or the like to enter.
また第6図(b)に示すように、パ・ノト6側からポン
チ50を突入させたので、端部6a及びエッジ部分1a
は内側に向かってなだらかに傾斜した傾斜面となるので
、たとえこの部分に盛られる導電塗料3の量が少なくて
もクラック等は生じにくい.なおこのとき第4図に示す
ように、フレキシブル基板1のパット6を形成しない側
のエッジ部分1aは、若干鋭角に突出することとなるが
、この側に盛られた導電塗料3は、該導′wt塗料3を
充填する側なのでその層が厚く、このためクラック等は
生じにくい。Further, as shown in FIG. 6(b), since the punch 50 is inserted from the side of the punch 6, the end portion 6a and the edge portion 1a
Since this is a slope that slopes gently toward the inside, cracks are unlikely to occur even if the amount of conductive paint 3 applied to this area is small. At this time, as shown in FIG. 4, the edge portion 1a of the flexible substrate 1 on the side where the pad 6 is not formed protrudes at a slightly acute angle, but the conductive paint 3 applied on this side ' Since it is the side to be filled with the wt paint 3, the layer is thick and therefore cracks are less likely to occur.
なおパット6は貫通穴2の両側に設けてもよい。Note that the pads 6 may be provided on both sides of the through hole 2.
次に第7図は第3の発明の一実施例にかかるスルーホー
ルの構造を示す側断面図である。Next, FIG. 7 is a side sectional view showing the structure of a through hole according to an embodiment of the third invention.
なお上記第1図に示すと同一の部材には同一の符号を付
してその詳細な説明は省略する。Note that the same members as shown in FIG. 1 are given the same reference numerals and detailed explanation thereof will be omitted.
同図に示すようにこのスルーホールの場合は、フレキシ
ブル基板1の一方の面に形成した回路パターン5′上に
貫通穴2を形成し、該貫通穴2の内部に導電塗料3を充
填し、さらに回路パターン5′を形成した面の反対側の
面に露出した導電塗料3の上からその全表面を覆うよう
に、回路パターン4を印刷して構成されている。As shown in the figure, in the case of this through hole, a through hole 2 is formed on the circuit pattern 5' formed on one side of the flexible substrate 1, and the inside of the through hole 2 is filled with conductive paint 3. Furthermore, a circuit pattern 4 is printed so as to cover the entire surface of the conductive paint 3 exposed on the surface opposite to the surface on which the circuit pattern 5' is formed.
なおここで導電塗料3は貫通穴2の上下の両エッジ部分
1aを越えて充填されている。そして回路パターン5′
に導電塗料3は接続している。Here, the conductive paint 3 is filled over both the upper and lower edge portions 1a of the through hole 2. And circuit pattern 5'
The conductive paint 3 is connected to.
第8図はこのスルーホールの製造方法を示す図である。FIG. 8 is a diagram showing a method of manufacturing this through hole.
同図(a)に示すように、まずフレキシブル基板1の一
方の面上に所望の回路パターン5′をスクリーン印刷に
よって形成する。As shown in FIG. 5A, first, a desired circuit pattern 5' is formed on one surface of the flexible substrate 1 by screen printing.
次に同図(b)に示すように、フレキシブル基板1の回
路パターン5′を形成した面側からポンチ50を突入さ
せて、このフレキシブル基板1に貫通穴2を形成する。Next, as shown in FIG. 2B, a punch 50 is inserted into the flexible substrate 1 from the side on which the circuit pattern 5' is formed to form a through hole 2 in the flexible substrate 1.
このようにポンチ50を突入すれば、前記第6図に示す
と同様に、突入側の貫通穴2の周囲の回路パターン5′
の端部とエッジ部分1aは鋭角とならず、若干貫通穴2
の内部側になだらかに傾斜した傾斜面となる。If the punch 50 is inserted in this way, the circuit pattern 5' around the through hole 2 on the entry side will be removed as shown in FIG.
The end and edge portion 1a are not at an acute angle, and there is a slight through hole 2.
It is a slope that slopes gently towards the inside of the area.
次に第8図(C)に示すように、ポンチ50を引き抜い
た貫通穴2内部に矢印E方向から導電塗料3を充填する
。Next, as shown in FIG. 8(C), the inside of the through hole 2 from which the punch 50 was pulled out is filled with the conductive paint 3 from the direction of the arrow E.
そして次に同図(d)に示すように、このフレキシブル
基板1の回路パターン5′を形成した面の反対側の面上
に露出した導電塗料3の全表面を覆うように、回路パタ
ーン4をスクリーン印刷する。Next, as shown in FIG. 4(d), a circuit pattern 4 is applied so as to cover the entire surface of the conductive paint 3 exposed on the surface of the flexible substrate 1 opposite to the surface on which the circuit pattern 5' is formed. Screen print.
これによってこのスルーホールが完成する。This completes this through hole.
このように構成しても、第7図に示すスルーホールの上
側部分は2層構造となっているため、クランク等は生じ
にくい。またスルーホールの下側部分のエッジ部分1a
及び回路パターン5′の端部5a’は、上記第2の発明
の場合と同様に、なだらかに傾斜した傾斜面となるので
、この部分にもクランク等は生じにくい。Even with this configuration, since the upper portion of the through hole shown in FIG. 7 has a two-layer structure, cranks and the like are unlikely to occur. Also, the edge part 1a of the lower part of the through hole
Since the end portion 5a' of the circuit pattern 5' is a gently sloped surface as in the case of the second invention, cranks and the like are unlikely to occur in this portion as well.
なお上記各発明は、フレキシブル基板のみでなく、可撓
性を有しない硬質の基板に適用してもよい。Note that the above inventions may be applied not only to flexible substrates but also to rigid substrates that do not have flexibility.
以上詳細に説明したように、本発明に係るスルーホール
の構造及びその製造方法によれば、フレキシブル基板に
形成した貫通穴のエッジ部分と外部との間に2層の導電
材料が介在することとなるので、該部分の強化が図れ、
クランク等が生じに<<、このため該スルーホール部分
で抵抗値の増大や導電不良が生じにくいという優れた効
果を有する。As explained in detail above, according to the through-hole structure and manufacturing method thereof according to the present invention, two layers of conductive material are interposed between the edge portion of the through-hole formed in the flexible substrate and the outside. Therefore, strengthen that part,
This has an excellent effect in that the through-hole portion is less prone to increase in resistance value and poor conductivity.
また貫通穴の少なくとも一方の面側の周囲に予めパット
を設けた場合は、該パット側の貫通穴の周囲のエッジ部
分上に盛られる導Km料の量が少なくても、導電塗料が
このパットに接続されることによって全体としてパット
側の導電塗料の層は厚くなり、クラック等は入りにくい
という優れた効果を有する。In addition, if a pad is provided in advance around at least one side of the through hole, even if the amount of the conductive Km material applied to the edge portion around the through hole on the pad side is small, the conductive paint will be absorbed by the pad. As a result, the conductive paint layer on the pad side becomes thicker as a whole, which has an excellent effect of being less prone to cracks.
またフレキシブル基板の一方の面に設けたパット又は回
路パターンの上側からポンチ50を突入して貫通穴を形
成した場合は、突入した側の貫通穴周囲のエッジ部分が
なだらかに傾斜した傾斜面となるので、この部分に盛ら
れた導電塗料3内にクラック等は生じにくいという優れ
た効果を有する。In addition, if a through hole is formed by inserting the punch 50 from above the pad or circuit pattern provided on one side of the flexible board, the edge portion around the through hole on the side into which it is inserted becomes a gently sloped surface. Therefore, it has an excellent effect that cracks are less likely to occur in the conductive paint 3 applied to this part.
第1図は第1の発明の一実施例にかかるスルーホールの
構造を示す側断面図、第2図はこのスルーホールを製造
するための製造方法を示す図、第3図は第1図に示すB
部分の拡大図、第4図は第2の発明の一実施例にかかる
スルーホールの構造を示す側断面図、第5図はこのスル
ーホールを製造するための製造吉法を示す図、第6図は
このフレキシブル基板1にポンチ50を突入させたとき
の第5図(b)のC部分を拡大して示す図、第7図は第
3の発明の一実施例にかかるスルーホールの構造を示す
側断面図、第8図はこのスルーホールの製造方法を示す
図、第9図は従来のスルーホールの構造を示す側断面図
、第10図は第9図に示すA部分の拡大図である。
図中、1・・・フレキシブル基板、1a・・・エッジ部
分、2・・・貫通穴、3・・・導電塗料、4,5.5’
・・・回路パターン、6・・・パット、50・・・ポ
ンチ、である。FIG. 1 is a side sectional view showing the structure of a through hole according to an embodiment of the first invention, FIG. 2 is a diagram showing a manufacturing method for manufacturing this through hole, and FIG. 3 is similar to FIG. 1. Show B
4 is a side sectional view showing the structure of a through hole according to an embodiment of the second invention; FIG. 5 is a diagram showing a manufacturing method for manufacturing this through hole; FIG. The figure is an enlarged view of part C in FIG. 5(b) when the punch 50 is inserted into the flexible substrate 1, and FIG. 7 is a diagram showing the structure of a through hole according to an embodiment of the third invention. 8 is a side sectional view showing the method of manufacturing this through hole, FIG. 9 is a side sectional view showing the structure of a conventional through hole, and FIG. 10 is an enlarged view of part A shown in FIG. 9. be. In the figure, 1... Flexible board, 1a... Edge portion, 2... Through hole, 3... Conductive paint, 4, 5.5'
. . . circuit pattern, 6 . . . pad, 50 . . . punch.
Claims (5)
のエッジ部分を越える位置まで導電塗料を充填するとと
もに、 基板の両面に露出した前記導電塗料の上からそれぞれそ
の全表面を覆うように、回路パターンを印刷したことを
特徴とするスルーホールの構造。(1) Fill the inside of the through-hole provided in the board with conductive paint to a position beyond the edge portions at both ends of the through-hole, and also fill the entire surface of the conductive paint from above the conductive paint exposed on both sides of the board. A through-hole structure characterized by a circuit pattern printed over it.
の面上であって前記貫通穴の周囲を囲むように形成され
た導電薄膜からなるパットとを具備し、前記基板の貫通
穴の内部に、該貫通穴の両端部のエッジ部分を越える位
置まで導電塗料を充填するとともに、 基板の両面に露出した前記導電塗料の上からそれぞれそ
の全表面を覆うように、回路パターンを印刷したことを
特徴とするスルーホールの構造。(2) A through hole provided in a substrate, and a pad made of a conductive thin film formed on at least one surface of the substrate so as to surround the through hole; A conductive paint is filled inside the through-hole to a position exceeding the edge portions at both ends, and a circuit pattern is printed on the conductive paint exposed on both sides of the board so as to cover the entire surface thereof. Through-hole structure featuring
ずれか一方の面上に導電薄膜からなるパットを形成し、 該パットの上からポンチを突入して貫通穴を形成し、 該貫通穴の内部に、該貫通穴の両端部のエッジ部分を越
える位置まで導電塗料を充填し、 さらに基板の両面に露出した導電塗料の上からそれぞれ
その全表面を覆うように、回路パターンを印刷したこと
を特徴とするスルーホールの製造方法。(3) A pad made of a conductive thin film is formed on at least one surface of a flexible substrate, a punch is inserted from above the pad to form a through hole, and a through hole is formed inside the through hole. , the through-hole is filled with conductive paint up to a point beyond the edge portions at both ends, and a circuit pattern is printed on top of the conductive paint exposed on both sides of the board so as to cover the entire surface of each. A method for manufacturing through-holes.
ンの所定部分に貫通穴を形成し、該貫通穴の内部に、該
貫通穴の両端部のエッジ部分を越える位置まで導電塗料
を充填するとともに、前記回路パターンを形成した面の
反対側の面側に露出した導電塗料の上からその全表面を
覆うように、回路パターンを印刷したことを特徴とする
スルーホールの構造。(4) Forming a through hole in a predetermined portion of the circuit pattern formed on at least one surface of the board, filling the inside of the through hole with conductive paint to a position beyond the edge portions of both ends of the through hole, and . A through-hole structure, characterized in that a circuit pattern is printed so as to cover the entire surface of the conductive paint exposed on the surface opposite to the surface on which the circuit pattern is formed.
ずれか一方の面上に回路パターンを形成し、該回路パタ
ーンの所定部分の上からポンチを突入して貫通穴を形成
し、 該貫通穴の内部に、該貫通穴の両端部のエッジ部分を越
える位置まで導電塗料を充填し、 さらに前記回路パターンを形成した面の反対側の面側に
露出した導電塗料の上からその全表面を覆うように、回
路パターンを印刷したことを特徴とするスルーホールの
製造方法。(5) Forming a circuit pattern on at least one side of a flexible substrate, punching a punch from above a predetermined portion of the circuit pattern to form a through hole, and forming a through hole inside the through hole. Then, fill the through hole with conductive paint to a point beyond the edge portions at both ends, and further cover the entire surface of the conductive paint exposed on the side opposite to the side on which the circuit pattern is formed. , a method for manufacturing a through hole characterized by printing a circuit pattern.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1239370A JPH069310B2 (en) | 1989-09-14 | 1989-09-14 | Method of manufacturing through hole for flexible substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1239370A JPH069310B2 (en) | 1989-09-14 | 1989-09-14 | Method of manufacturing through hole for flexible substrate |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH03102894A true JPH03102894A (en) | 1991-04-30 |
JPH069310B2 JPH069310B2 (en) | 1994-02-02 |
Family
ID=17043761
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1239370A Expired - Fee Related JPH069310B2 (en) | 1989-09-14 | 1989-09-14 | Method of manufacturing through hole for flexible substrate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH069310B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06104546A (en) * | 1992-09-22 | 1994-04-15 | Alps Electric Co Ltd | Through hole of flexible printed board and formation thereof |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54110464A (en) * | 1978-02-18 | 1979-08-29 | Akai Electric | Method of and apparatus for producing printed circuit board |
JPS55138294A (en) * | 1979-04-11 | 1980-10-28 | Matsushita Electric Ind Co Ltd | Method of forming through hole connector |
JPS5660093A (en) * | 1979-10-19 | 1981-05-23 | Matsushita Electric Ind Co Ltd | Method of manufacturing bothhside printed circuit board |
JPS5891696A (en) * | 1981-11-26 | 1983-05-31 | 松下電器産業株式会社 | Method of producing both-side through hole printed circuit board |
JPS5966192A (en) * | 1982-10-08 | 1984-04-14 | 株式会社棚澤八光社 | Method of producing both-side printed circuit board |
-
1989
- 1989-09-14 JP JP1239370A patent/JPH069310B2/en not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54110464A (en) * | 1978-02-18 | 1979-08-29 | Akai Electric | Method of and apparatus for producing printed circuit board |
JPS55138294A (en) * | 1979-04-11 | 1980-10-28 | Matsushita Electric Ind Co Ltd | Method of forming through hole connector |
JPS5660093A (en) * | 1979-10-19 | 1981-05-23 | Matsushita Electric Ind Co Ltd | Method of manufacturing bothhside printed circuit board |
JPS5891696A (en) * | 1981-11-26 | 1983-05-31 | 松下電器産業株式会社 | Method of producing both-side through hole printed circuit board |
JPS5966192A (en) * | 1982-10-08 | 1984-04-14 | 株式会社棚澤八光社 | Method of producing both-side printed circuit board |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06104546A (en) * | 1992-09-22 | 1994-04-15 | Alps Electric Co Ltd | Through hole of flexible printed board and formation thereof |
Also Published As
Publication number | Publication date |
---|---|
JPH069310B2 (en) | 1994-02-02 |
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LAPS | Cancellation because of no payment of annual fees |