JPH02270389A - Manufacture of printed wiring board provided with shielding layer - Google Patents
Manufacture of printed wiring board provided with shielding layerInfo
- Publication number
- JPH02270389A JPH02270389A JP33719389A JP33719389A JPH02270389A JP H02270389 A JPH02270389 A JP H02270389A JP 33719389 A JP33719389 A JP 33719389A JP 33719389 A JP33719389 A JP 33719389A JP H02270389 A JPH02270389 A JP H02270389A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- layer
- shielding layer
- connection land
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 17
- 238000000034 method Methods 0.000 claims abstract description 16
- 238000007650 screen-printing Methods 0.000 claims abstract description 15
- 238000007789 sealing Methods 0.000 claims abstract description 12
- 229920003002 synthetic resin Polymers 0.000 claims abstract description 7
- 239000000057 synthetic resin Substances 0.000 claims abstract description 7
- 239000000463 material Substances 0.000 claims abstract description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- 229910052799 carbon Inorganic materials 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 229920001187 thermosetting polymer Polymers 0.000 claims description 2
- 239000010410 layer Substances 0.000 abstract description 70
- 229910000679 solder Inorganic materials 0.000 abstract description 6
- 230000015572 biosynthetic process Effects 0.000 abstract description 3
- 238000000016 photochemical curing Methods 0.000 abstract description 2
- 239000011241 protective layer Substances 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明はプリント配線板の製造方法に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to a method for manufacturing a printed wiring board.
従来、プリント配線板に絶縁層を介して電磁波シールド
層を設ける方法は特開昭６２−２１３１９２号に記載さ
れ公知であり、第３図ａに示す如く、絶縁板１の両面に
形成されたプリント配線回路２に絶縁層４を介して電磁
波シールド層５を設けるとともにソルダーレジスト層６
を設けることによりプリント配線板９が構成されている
。Conventionally, a method of providing an electromagnetic shielding layer on a printed wiring board via an insulating layer is described in Japanese Patent Application Laid-Open No. 62-213192 and is known. An electromagnetic shielding layer 5 is provided on the wiring circuit 2 via an insulating layer 4, and a solder resist layer 6 is also provided.
The printed wiring board 9 is constructed by providing the following.
尚、当該プリント配線板９における電磁波シールド層５
はめっきスルーホール８による導通用スルーホール部７
部分、あるいは図示されていないが部品接続ランド等を
除いた部分に形成されている。In addition, the electromagnetic shielding layer 5 in the printed wiring board 9
Through-hole part 7 for conduction by plated through-hole 8
or, although not shown, is formed in a portion excluding component connection lands and the like.
従来のシールド層５を設けたプリント配線板９における
プリント配線回路２とシールド層５の形成部分において
は、特にプリント配線回路２上側に絶縁層４をスクリー
ン印刷にて形成するが、第３図すに示す如（、プリント
配線回路２におけるシールド層５との接続ランド２０上
側には、この接続ランド２０と同径（例えばφ３■）等
の逃げ部４０を設けかかる逃げ部４０を介して、その後
形成されるシールド層５の形成時に、アース回路５ａが
同時に形成される。In the area where the printed wiring circuit 2 and the shield layer 5 are formed in the conventional printed wiring board 9 provided with the shield layer 5, the insulating layer 4 is formed especially on the printed wiring circuit 2 by screen printing. As shown in FIG. When the shield layer 5 is formed, the ground circuit 5a is formed at the same time.
しかるに、前記接続ランド２０上側に形成される逃げ部
４０と絶縁層４間には、プリント配線回路２上側に形成
される絶縁層４の層厚に相当する段差が生じ、通常スク
リーン印刷によって形成されるシールド層５のアース回
路５ａの外周部５ｂの膜厚が他のシールド層５の膜厚と
比較して薄くなり時にはシールドインクがスムーズに逃
げ部４０に流れ込まずカスレが生じたりする等、適切な
アース回路５ａの形成が損なわれる欠点を有するもので
あった。However, between the escape portion 40 formed on the upper side of the connection land 20 and the insulating layer 4, there is a step corresponding to the layer thickness of the insulating layer 4 formed on the upper side of the printed wiring circuit 2, which is normally formed by screen printing. When the thickness of the outer peripheral part 5b of the ground circuit 5a of the shield layer 5 becomes thinner than the thickness of the other shield layers 5, the shield ink may not flow smoothly into the relief part 40, causing scratches, etc. This has the disadvantage that the formation of the ground circuit 5a is impaired.
また、逃げ部４０には必要以上の膜厚のアース回路５ａ
が形成されることにより、（例えばシールド層５の膜厚
が２０ｐｍ前後とすれば通常５０μ−前後の膜厚のアー
ス回路５ａが逃げ部４０に形成される等）当該アース回
路５ａがシールド用のペーストにより形成されるのが通
常で、その結果、塗膜の厚味が増す程、柔軟性がなくな
り、脆弱となる（例えばハンダデイツプ時の熱膨張、収
縮の際に当該アース回路５ａにクランクが発生する等の
原因となる欠点がある）。In addition, the escape portion 40 has a ground circuit 5a having a film thickness greater than necessary.
(For example, if the thickness of the shield layer 5 is about 20 pm, the ground circuit 5a with a thickness of about 50 μm is usually formed in the relief part 40.) It is usually formed from a paste, and as a result, the thicker the coating becomes, the less flexible it becomes and the more brittle it becomes (for example, a crank will occur in the ground circuit 5a during thermal expansion and contraction during soldering). (There are drawbacks that may cause problems such as
因って、本発明はかかる欠点に鑑みて開発されたもので
、この種プリント配線板におけるアース回路の膜厚が他
のシールド層と同等の膜厚にて形成し得るプリント配線
板の製造方法の提供を目的とするものである。Therefore, the present invention has been developed in view of these drawbacks, and provides a method for manufacturing a printed wiring board in which the thickness of the ground circuit in this type of printed wiring board can be the same as that of other shield layers. The purpose is to provide the following.
本発明は、基板の片面または両面にプリント配線回路を
設けるとともに絶縁層を介してシールド層を設けること
により製造するプリント配線板の製造法において、前記
絶縁層を設けるに当り前記シールド層とプリント配線回
路の接続ランドの上側に段階的に接続ランドの外径より
大径の逃げ部を複数回のスクリーン印刷を施しつつ形成
することを特徴とするシー７１／ド層を備えるプリン韮
配線板の製造法である。The present invention provides a method for manufacturing a printed wiring board in which a printed wiring circuit is provided on one or both sides of a board and a shield layer is provided via an insulating layer, in which the shield layer and the printed wiring board are Manufacture of printed wiring board equipped with a seed layer characterized in that a relief portion having a diameter larger than the outer diameter of the connection land is formed stepwise on the upper side of the connection land of the circuit by performing screen printing multiple times. It is the law.
（作 用）
本発明プリント配線板の製造方法によれば、プリント配
線回路とシールド層間の接続ランドの上側に形成された
盃状の逃げ部を介してアース回路を形成することにより
アース回路のカスレや膜厚が他のシールド層より厚くな
り脆弱化するのを防止し、適切なシールド層の形成を可
能ならしめ得る。(Function) According to the method of manufacturing a printed wiring board of the present invention, the ground circuit is formed through the cup-shaped escape part formed above the connection land between the printed wiring circuit and the shield layer, thereby preventing the breakage of the ground circuit. This can prevent the shield layer from becoming thicker and more brittle than other shield layers, making it possible to form an appropriate shield layer.
以下本発明のプリント配線板の実施例を図面とともに説
明する。Embodiments of the printed wiring board of the present invention will be described below with reference to the drawings.
（第１実施例）
第１図は本発明のプリント配線板の製造方法の第１実施
例を示す部分的な拡大断面図である。ｌは絶縁板でめっ
きスルーホール８を介し、両面に所要のパターンから成
るプリント配線回路２を形成する。また、３ａは導通用
スルーホール部７に充填した封止部材で、かかる封止部
材３ａとしてはエポキシ樹脂等の熱硬化型の合成樹脂材
料あるいはアクリルエポキシ樹脂等の光硬化型の合成樹
脂材料から成るものである。これらの合成樹脂材料から
成るペーストをシフリーン印刷等の手段によりプリント
配線板９の各導通用スルーホール部７中に充填した後、
これを硬化することにより形成する。(First Embodiment) FIG. 1 is a partially enlarged sectional view showing a first embodiment of the printed wiring board manufacturing method of the present invention. 1 is an insulating plate, and a printed wiring circuit 2 consisting of a desired pattern is formed on both sides of the insulating plate through plated through holes 8. Further, 3a is a sealing member filled in the conductive through-hole portion 7, and the sealing member 3a is made of a thermosetting synthetic resin material such as epoxy resin or a photocuring synthetic resin material such as acrylic epoxy resin. It is what it is. After filling the paste made of these synthetic resin materials into each conductive through-hole portion 7 of the printed wiring board 9 by means such as sifrin printing,
It is formed by curing this.
さらに、スクリーン印刷等により絶縁層４を形成し、こ
の絶縁層４の上側に電磁波シールド層５を形成した後、
当該電磁波シールド層５の保護層兼ねるソルダーレジス
トＮ６を形成しである。Furthermore, after forming an insulating layer 4 by screen printing or the like, and forming an electromagnetic shielding layer 5 on top of this insulating layer 4,
A solder resist N6 which also serves as a protective layer for the electromagnetic shield layer 5 is formed.
又、前記絶縁層４の層厚は２０〜５０μｍの層厚にて形
成することが望ましく、特に、プリント配線回路２のシ
ールドＮ５とのアース回路５ａとの接続ランド２０上側
には第１図すに示す如く盃状の逃げ部４０を形成する。The insulating layer 4 is desirably formed to have a thickness of 20 to 50 μm. In particular, the insulation layer 4 is preferably formed with a layer thickness of 20 to 50 μm, and in particular, a layer as shown in FIG. A cup-shaped relief portion 40 is formed as shown in FIG.
しかる後に、この盃状の逃げ部４０を介して、接続ラン
ド２０とのアース回路５ａをシールド層５の形成時に同
時に形成する。Thereafter, a grounding circuit 5a to the connection land 20 is formed through the cup-shaped escape portion 40 at the same time as the shield layer 5 is formed.
従って、第１図Ｃに示す如く、盃状の逃げ部４０を介し
てアース回路５ａを形成することにより、アース回路５
ａとシールド層５の層厚を均一化することができる。か
つ接続ランド２０の外周部と内周部の膜厚をも盃状の形
状によって段差をなくし、均一化することができること
から、適切なアース回路５ａの形成を可能ならしめ得る
。Therefore, as shown in FIG. 1C, by forming the ground circuit 5a through the cup-shaped relief part 40,
The layer thicknesses of a and the shield layer 5 can be made uniform. In addition, the cup-shaped shape eliminates a step difference in film thickness at the outer and inner circumferential portions of the connection land 20, making it possible to make them uniform, thereby making it possible to form an appropriate grounding circuit 5a.
さらに、前記盃状の逃げ部４０の形成に当たっては、絶
縁層４の形成時にスクリーン印刷法が主に採用されると
ころで、かかるスクリーン印刷の実施に当たり、−回の
スクリーン印刷により所要の層厚の絶縁層４を形成する
のに換えて、複数回のスクリーン印刷を施し、所要の層
厚の絶縁層４を形成する。Furthermore, in forming the cup-shaped relief part 40, screen printing is mainly adopted when forming the insulating layer 4. Instead of forming the layer 4, screen printing is performed a plurality of times to form the insulating layer 4 with a desired thickness.
そして、特に、接続ランド２０の上側における逃げ部４
０の形成に当たっては、前記複数回のスクリーン印刷に
よる絶縁Ｍ４の形成時に、第１回のスクリーン印刷時に
は接続ランド２０の径と同一径の逃げ部４０のスクリー
ン印刷を施し、以後、順次接続ランド２０の径より大径
化する段階的なスクリーン印刷を施すことにより盃状の
逃げ部４０を適切に形成することができるものである。In particular, the relief portion 4 on the upper side of the connection land 20
0, when the insulation M4 is formed by screen printing a plurality of times, a relief part 40 having the same diameter as the connection land 20 is screen printed during the first screen printing, and thereafter, the connection land 20 is sequentially formed. The cup-shaped relief portion 40 can be appropriately formed by performing stepwise screen printing in which the diameter becomes larger than the diameter of the cup.
例えば、絶縁層４の層厚４５μｍとするとき、１回の印
刷にて１５μ醜の層厚の層を３回形成すればよく、第１
回目の逃げ部４０の径は、例えば接続ランド２０の径が
３１１Ｉ１１であれば、これと同一径とし、第２回目の
逃げ部４０の径を３．１ ｍｍ、第３回目の逃げ部４０
の径を３．２ｍｍとする等の方法により接続ランド２０
の上側に絶縁層４を形成するに当たり、盃状の逃げ部４
０を形成することができる。For example, when the thickness of the insulating layer 4 is 45 μm, it is sufficient to form a layer with a thickness of 15 μm three times in one printing;
For example, if the diameter of the connection land 20 is 311I11, the diameter of the relief part 40 for the second time is the same as this diameter, the diameter of the relief part 40 for the second time is 3.1 mm, and the diameter of the relief part 40 for the third time is 3.1 mm.
The diameter of the connecting land 20 is set to 3.2 mm.
When forming the insulating layer 4 on the upper side of the cup-shaped relief part 4
0 can be formed.
しかして、かかる盃状の逃げ部４０を介して接続ランド
２０とのアース回路５ａを形成した場合には前記逃げ部
４０の外周部から内周部方向になめらかな斜面が形成さ
れているので、この斜面に沿ってシールド層５のスクリ
ーン印刷時のシールド用ペーストが塗着され、かつアー
ス回路５ａとシールド層５の膜厚も均一化される。Therefore, when the ground circuit 5a is formed with the connection land 20 through the cup-shaped relief portion 40, a smooth slope is formed from the outer circumference of the relief portion 40 toward the inner circumference. A shield paste for screen printing of the shield layer 5 is applied along this slope, and the film thicknesses of the ground circuit 5a and the shield layer 5 are also made uniform.
（第２実施例）
第２図は本発明のプリント配線板の第２実施例を示す部
分的な拡大断面図である。(Second Embodiment) FIG. 2 is a partially enlarged sectional view showing a second embodiment of the printed wiring board of the present invention.
しかして、当該実施例は前記第１実施例におけるプリン
ト配線板９の封止部材がカーボン、銀、銅等を含有する
導電性合成材料から成るもので構成したものである。即
ち、導電性を有する封止部材３ｂによりプリント配線板
９０両面間を電気的に導通することができるため、必ず
しも導通用スルーホール部７にめっきを施す必要はない
。Therefore, in this embodiment, the sealing member of the printed wiring board 9 in the first embodiment is made of a conductive synthetic material containing carbon, silver, copper, etc. That is, since electrical conduction can be established between both surfaces of the printed wiring board 90 by the conductive sealing member 3b, it is not necessarily necessary to plate the conductive through-hole portions 7.
尚、その他構成中第１実施例と同一の構成部分は同一番
号を付し、その説明については省略する。It should be noted that other components in the configuration that are the same as those in the first embodiment are given the same numbers, and their explanations will be omitted.
また、前記工程中、絶縁層４、電磁波シールド層５、ソ
ルダーレジスト層６の形成についての各工程は従来公知
の方法によるもので、その具体的な方法についての説明
は省略するとともに、かかる方法に限定されず他の公知
の種々の方法により形成できることはいうまでもない。In addition, in the above steps, each step of forming the insulating layer 4, the electromagnetic shielding layer 5, and the solder resist layer 6 is performed by a conventionally known method, and a detailed explanation of the method will be omitted. Needless to say, the structure is not limited and can be formed by various other known methods.
また前記プリント配線板によれば、導通用スルーホール
部に耐熱、耐候性の封止部材を充填し、かつ絶縁層を介
して電磁波シールド層を形成することにより、導通用ス
ルーホール部上にも電磁波シールド層を形成することが
できるため、導通用スルーホール部においても受動、能
動ノイズである電磁波の影響を防止できる。Further, according to the printed wiring board, by filling the conduction through-hole portion with a heat-resistant and weather-resistant sealing member and forming an electromagnetic wave shielding layer through the insulating layer, the conduction through-hole portion can also be filled with a heat-resistant and weather-resistant sealing member. Since an electromagnetic wave shielding layer can be formed, it is possible to prevent the effects of electromagnetic waves, which are passive and active noises, even in the conduction through-hole portion.
さらに、導通用スルーホール部により電磁波シールド層
から分断されることが無く、有効なシールド層の面積を
大きくすることができるため、掻めて良好な電磁波シー
ルド効果を有するプリント配線板の製造方法を提供する
ことができるものである。Furthermore, the effective area of the shielding layer can be increased without being separated from the electromagnetic shielding layer by the conductive through-hole, which makes it possible to manufacture a printed wiring board that has a good electromagnetic shielding effect. It is something that can be provided.
本発明プリント配線板の製造方法によれば、シールド層
形成時にアース回路の適切な形成とシールド層と同等の
膜厚から成るアース回路の形成を可能ならしめ、高いシ
ールド効果と耐久性に富むプリント配＊ｉを提供するこ
とができる。According to the method for manufacturing a printed wiring board of the present invention, it is possible to appropriately form a ground circuit when forming a shield layer, and to form a ground circuit having a film thickness equivalent to that of the shield layer. Distribution*i can be provided.
第１図ａ、ｂ、ｃは本発明プリント配線板の製造方法の
第１実施例を示す拡大断面図、第２図は本発明プリント
配線板の製造方法の第２実施例を示す拡大断面図、第３
図ａ、ｂは従来のプリント配線板の拡大断面図である。
１・・・絶縁板
２・・・プリント配線回路
３ａ、３ｂ・・・封止部材
４・・・絶縁層
５・・・電磁波シールド層
５ａ・・・アース回路
６・・・ソルダーレジスト層
７・・・導通用スルーホール部
８・・・めっきスルーホール
９・・・プリント配線板
２０・・・接続ランド
４０・・・逃げ部
手続補正書（方式）
％式％
１、事件の表示
平成１年 特許願 第３３７１９３号
λ発明の名称
シールド層を備えるプリント配線板の製造方法３、補正
をする者
事件との関係 特許出願人
住 所 埼玉県入間郡三芳町藤久保１１０６名称 日
本シイエムケイ株式会社
代表者 中 山 登
４、代理人〒１０５
住 所 東京都港区浜松町２丁目２番１５号７、補正
の内容
（１）本願の図面を別紙の通り補正する。
８、添付書類の目録
（１）補正図面 １通以
上
ｌ・・−絶縁板
３ａ・・・封止部材
４・・・絶縁層
５・・・電磁波シールド層
５ａ・・・アース回路
６・・・ソルダーレジスト層
７・・・導通用スルーホール部
訃・・めっきスルーホール
９・・・プリント記動１反
２０・・・接続ランド
４０・・・逃げ部
＠ １ 図（ｂ）
第 １図（ｃ）
第２図
第 ３ 図（ａ）1a, b, and c are enlarged sectional views showing a first embodiment of the method for manufacturing a printed wiring board of the present invention, and FIG. 2 is an enlarged sectional view showing a second embodiment of the method for manufacturing a printed wiring board of the present invention. , 3rd
Figures a and b are enlarged cross-sectional views of conventional printed wiring boards. 1... Insulating plate 2... Printed wiring circuits 3a, 3b... Sealing member 4... Insulating layer 5... Electromagnetic wave shielding layer 5a... Earth circuit 6... Solder resist layer 7...・Through hole for continuity 8 ・Plated through hole 9 ・Printed wiring board 20 ・Connection land 40 ・Escape part procedural amendment (method) % formula % 1. Indication of incident 1999 Patent Application No. 337193 λ Name of Invention Method 3 of Manufacturing Printed Wiring Board with Shielding Layer, Relationship with Amendment Case Patent Applicant Address 1106 Fujikubo, Miyoshi-cho, Iruma-gun, Saitama Name Representative of CMK Japan Co., Ltd. Noboru Nakayama 4, Agent 105 Address 2-2-15-7 Hamamatsucho, Minato-ku, Tokyo Contents of amendment (1) The drawings of the application are amended as shown in the attached sheet. 8. List of attached documents (1) At least one amended drawing
Upper L...Insulating plate 3a...Sealing member 4...Insulating layer 5...Electromagnetic shielding layer 5a...Earth circuit 6...Solder resist layer 7...Through hole for continuity ...Plated through hole 9...Printed marking 1 side 20...Connection land 40...Escape part @ 1 Figure (b) Figure 1 (c) Figure 2 Figure 3 (a)
Claims (4)
るとともに絶縁層を介してシールド層を設けることによ
り製造するプリント配線板の製造法において、 前記絶縁層を設けるに当り前記シールド層とプリント配
線回路の接続ランドの上側に段階的に接続ランドの外径
より大径の逃げ部を複数回のスクリーン印刷を施しつつ
形成することを特徴とするシールド層を備えるプリント
配線板の製造法。(1) In a method for manufacturing a printed wiring board in which a printed wiring circuit is provided on one or both sides of a board and a shield layer is provided via an insulating layer, when providing the insulating layer, the shield layer and the printed wiring circuit are provided. A method for manufacturing a printed wiring board having a shield layer, characterized in that relief portions having a diameter larger than the outer diameter of the connection lands are formed stepwise on the upper side of the connection lands by performing screen printing multiple times.
スルーホール部に耐熱、耐候性の封止部材を充填するこ
とを特徴とする請求項１記載のシールド層を備えるプリ
ント配線板の製造方法。(2) The method for manufacturing a printed wiring board with a shield layer according to claim 1, wherein the printed wiring circuit includes a heat-resistant and weather-resistant sealing member filled in a conductive through-hole portion of the printed wiring circuit.
化型の合成樹脂材料から成ることを特徴とする請求項２
記載のシールド層を備えるプリント配線板の製造方法。(3) Claim 2, wherein the sealing member is made of a thermosetting synthetic resin or a light-curing synthetic resin material.
A method of manufacturing a printed wiring board comprising the shield layer described above.
電性合成樹脂材料から成りプリント配線板の両面間を導
通することを特徴とする請求項２記載のシールド層を備
えるプリント配線板の製造方法。(4) A printed wiring board comprising a shield layer according to claim 2, wherein the sealing member is made of a conductive synthetic resin material containing carbon, silver, copper, etc., and provides electrical continuity between both surfaces of the printed wiring board. manufacturing method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33719389A JPH02270389A (en) | 1989-03-15 | 1989-12-26 | Manufacture of printed wiring board provided with shielding layer |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1062688A JP2631548B2 (en) | 1989-03-15 | 1989-03-15 | Printed wiring board with shield layer |
| JP33719389A JPH02270389A (en) | 1989-03-15 | 1989-12-26 | Manufacture of printed wiring board provided with shielding layer |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1062688A Division JP2631548B2 (en) | 1989-03-15 | 1989-03-15 | Printed wiring board with shield layer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02270389A true JPH02270389A (en) | 1990-11-05 |
Family
ID=26403735
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33719389A Pending JPH02270389A (en) | 1989-03-15 | 1989-12-26 | Manufacture of printed wiring board provided with shielding layer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02270389A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106163103A (en) * | 2016-07-01 | 2016-11-23 | 业成光电（深圳）有限公司 | Circuit filling perforation bridging arrangement and method |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63283186A (en) * | 1987-05-15 | 1988-11-21 | Cmk Corp | Printed wiring board |
-
1989
- 1989-12-26 JP JP33719389A patent/JPH02270389A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63283186A (en) * | 1987-05-15 | 1988-11-21 | Cmk Corp | Printed wiring board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106163103A (en) * | 2016-07-01 | 2016-11-23 | 业成光电（深圳）有限公司 | Circuit filling perforation bridging arrangement and method |
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