JPH03196690A - Printed wiring board with shield layer - Google Patents
Printed wiring board with shield layerInfo
- Publication number
- JPH03196690A JPH03196690A JP33719289A JP33719289A JPH03196690A JP H03196690 A JPH03196690 A JP H03196690A JP 33719289 A JP33719289 A JP 33719289A JP 33719289 A JP33719289 A JP 33719289A JP H03196690 A JPH03196690 A JP H03196690A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- layer
- wiring board
- shield layer
- electromagnetic wave
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007789 sealing Methods 0.000 claims abstract description 13
- 229920003002 synthetic resin Polymers 0.000 claims description 5
- 239000000057 synthetic resin Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- 229910052799 carbon Inorganic materials 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 238000000016 photochemical curing Methods 0.000 claims 1
- 229920001187 thermosetting polymer Polymers 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 8
- 239000010410 layer Substances 0.000 description 50
- 238000000034 method Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
Landscapes
- Structure Of Printed Boards (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明はシールド層を備えるプリント配線板に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to a printed wiring board including a shield layer.
従来、プリント配線板に絶縁層を介して電磁波シールド
層を設ける方法は特開昭６２’−２１３１９２号に記載
され公知であり、第３図に示す如く、絶縁板１の両面に
形成されたプリント配線回路２に絶縁層４を介して電磁
波シールド層５を設けるとともにソルダーレジスト層６
を設けることによりプリント配線板９が構成されている
。Conventionally, a method of providing an electromagnetic shielding layer on a printed wiring board via an insulating layer is described in Japanese Patent Laid-Open No. 62'-213192 and is known. An electromagnetic shielding layer 5 is provided on the wiring circuit 2 via an insulating layer 4, and a solder resist layer 6 is also provided.
The printed wiring board 9 is constructed by providing the following.
尚、当該プリント配線板９における電磁波シールド層５
はめっきスルーホール８による導通用スルーホール部７
部分、あるいは図示されていないが部品接続ランド等を
除いた部分に形成されている。In addition, the electromagnetic shielding layer 5 in the printed wiring board 9
Through-hole part 7 for conduction by plated through-hole 8
or, although not shown, is formed in a portion excluding component connection lands and the like.
しかるに、従来の電磁波シールドＮ５を設けたプリント
配線板９では、電磁波シールド層５が導通用スルーホー
ル部７で除かれているために、導通用スルーホール部７
から受動、能動ノイズである電磁波の影響を受けたり、
あるいは、導通用スルーホール部７を除くことにより電
磁波シールド層５が分断され有効な電磁波シールド層５
の面積が減少し十分な効果が得られなかった。However, in the printed wiring board 9 provided with the conventional electromagnetic shield N5, since the electromagnetic shield layer 5 is removed by the conductive through-hole portion 7, the conductive through-hole portion 7
be affected by electromagnetic waves, which are passive and active noise,
Alternatively, the electromagnetic shielding layer 5 can be divided by removing the conduction through-hole portion 7 to make the electromagnetic shielding layer 5 effective.
area was reduced and sufficient effects could not be obtained.
又、この種シールド層５を設けたプリント配線Ｆｉ９に
おけるシールド効果を有効に得る為には、前記プリント
配線回路２とシールドＮ５間に介層される絶縁層４の層
厚が適切に施される必要がある。In addition, in order to effectively obtain the shielding effect in the printed wiring Fi9 provided with this kind of shield layer 5, the thickness of the insulating layer 4 interposed between the printed wiring circuit 2 and the shield N5 is appropriately applied. There is a need.
すなわち、絶縁層４０層厚が薄いと電気特性上、耐電圧
特性および絶縁特性が低下しプリント配線回路２に電流
が流れてショートの原因となる等、プリント配線回路２
の作動特性が損なわれ、プリント配線板自体の製品の品
質低下をきたし、逆に層厚が厚いとプリント配線回路２
とシールド層５間に段差が生し、両者間に設けられるア
ース回路５ａとの接続に不良を生ずる等の欠点を有する
ものである。That is, if the thickness of the insulating layer 40 is thin, the electrical characteristics, withstand voltage characteristics and insulation characteristics will deteriorate, and current will flow through the printed wiring circuit 2, causing a short circuit.
The operating characteristics of the printed wiring circuit 2 will be impaired, leading to a decline in the quality of the printed wiring board itself.On the other hand, if the layer thickness is too thick, the printed wiring circuit 2
This has drawbacks such as a difference in level between the shield layer 5 and the shield layer 5, resulting in a poor connection to the ground circuit 5a provided between the two.
因って、本発明は従来のプリント配線板における欠点に
鑑みて開発されたもので、良好な電磁波シールド効果を
有するプリント配線板の提供を目的とするものである。Therefore, the present invention was developed in view of the shortcomings in conventional printed wiring boards, and an object of the present invention is to provide a printed wiring board having a good electromagnetic shielding effect.
本発明プリント配線板は、基板の片面または両面にプリ
ント配線回路を設けるとともに絶縁層を介してシールド
層を設けて成るプリント配線板において、前記プリント
配線回路における導通用スルーホール部に耐熱、耐候性
の封止部材を充填するとともに前記絶縁層の膜厚を２０
〜５０μｍにて形成することにより構成したことを特徴
とするものである。The printed wiring board of the present invention is a printed wiring board in which a printed wiring circuit is provided on one or both sides of the board and a shield layer is provided via an insulating layer, and the through-hole portion for conduction in the printed wiring circuit has heat resistance and weather resistance. of the sealing member and the thickness of the insulating layer was increased to 20 mm.
It is characterized in that it is formed by forming it with a thickness of 50 μm.
本発明プリント配線板は絶縁板の片面または両面にプリ
ント配線回路を設けるとともにこのプリン！・配線回路
上側に絶縁板を介してシールド層を設けて成るプリント
配線板において、
導通用スルーホール部に耐熱、耐候性の封止部材を充填
し、かつ絶縁層を介して電磁波スルーホールド層を形成
することにより、導通用スルーホール部上にも電磁波シ
ールド層を形成することができる。The printed wiring board of the present invention has a printed wiring circuit on one or both sides of an insulating board, and also has this printed wiring board!・In a printed wiring board with a shield layer provided above the wiring circuit via an insulating plate, the conduction through-holes are filled with a heat-resistant and weather-resistant sealing material, and an electromagnetic wave through-hold layer is provided via the insulating layer. By forming the electromagnetic shielding layer, it is possible to form an electromagnetic shielding layer also on the conductive through-hole portion.
また、導通用スルーホール部により電磁波シー・ルド層
が分断されることが無く、有効な電磁波シールド層の面
積を大きくすることができる。Further, the electromagnetic shielding layer is not divided by the conduction through-hole portion, and the effective area of the electromagnetic shielding layer can be increased.
さらに、前記絶縁層の層厚を２０〜５０ｔＩＩｍにて形
成することにより、前記プリント配線回路の適確な作動
と前記シールド層の適確なシールド作用を得ることがで
きるものである。Furthermore, by forming the insulating layer to have a thickness of 20 to 50 tIIm, it is possible to obtain an appropriate operation of the printed wiring circuit and an appropriate shielding effect of the shield layer.
以下本発明のプリント配線板の実施例を図面とともに説
明する。Embodiments of the printed wiring board of the present invention will be described below with reference to the drawings.
（第１実施例）
第１図は本発明のプリント配線板の第１実施例を示す部
分的な拡大断面図である。ｌは絶縁板でめっきスルーホ
ール８を介し、両面に所要のパターンから成るプリント
配線回路２を形成しである。(First Embodiment) FIG. 1 is a partially enlarged sectional view showing a first embodiment of the printed wiring board of the present invention. 1 is an insulating plate on which a printed wiring circuit 2 having a desired pattern is formed on both sides through plated through holes 8.
また、３ａは導通用スルーホール部７に充填した封止部
材で、かかる封止部材３ａとしてはエポキ・１奮１叱ｈ
ｋホ紬扉ル荊＾人４■ξｔＪｆｉあるいハアクリルエポ
キシ樹脂等の光硬化型の合成樹脂材料から成るものであ
る。これらの合成樹脂材料から成るベーストをスクリー
ン印刷等の手段によりプリント配線板９の各導通用スル
ーホール部７中に充填した後、これを硬化することによ
り形成する。Further, 3a is a sealing member filled in the conduction through-hole portion 7, and the sealing member 3a is made of epoxy resin.
It is made of a photocurable synthetic resin material such as acrylic epoxy resin. The base plate made of these synthetic resin materials is filled into each conductive through-hole portion 7 of the printed wiring board 9 by means such as screen printing, and then cured.
さらに、スクリーン印刷等により絶縁層４を形成し、こ
の絶縁Ｗ！ｉ４の上側に電磁波シールド層５を形成した
後、当該電磁波シールド層５の保護層を兼ねるソルダー
レジストＮ６を形成しである。Furthermore, an insulating layer 4 is formed by screen printing or the like, and this insulating W! After forming the electromagnetic shielding layer 5 on the upper side of i4, a solder resist N6 which also serves as a protective layer for the electromagnetic shielding layer 5 is formed.
又、特に、前記絶縁層４の層厚は２０〜５０μ層のＪｉ
ｆｆにて形成しである。In particular, the layer thickness of the insulating layer 4 is 20 to 50μ layer of Ji.
It is formed by ff.
尚、図中５ａは、プリント配線回路２とシールド層５の
アース回路を示すものである。Note that 5a in the figure indicates a grounding circuit for the printed wiring circuit 2 and the shield layer 5.
（第２実施例）
第２図は本発明のプリント配線板の第２実施例を示す部
分的な拡大断面図である。(Second Embodiment) FIG. 2 is a partially enlarged sectional view showing a second embodiment of the printed wiring board of the present invention.
しかして、当該実施例は前記第１実施例におけるプリン
ト配線板９の封止部材がカーボン、銀、銅等を含有する
導電性合成材料から成るもので構成したものである。即
ち、導電性を有する封止部材３ｂによりプリント配線板
９の両面間を電気的に導通ずることができるため、必ず
しも導通用スルーホール部７にめっきを施す必要はない
。Therefore, in this embodiment, the sealing member of the printed wiring board 9 in the first embodiment is made of a conductive synthetic material containing carbon, silver, copper, etc. That is, since electrical conduction can be established between both surfaces of the printed wiring board 9 by the conductive sealing member 3b, it is not necessarily necessary to plate the conductive through-hole portions 7.
尚、その他構成中第１実施例と同一の構成部分は同一番
号を付し、その説明については省略する。It should be noted that other components in the configuration that are the same as those in the first embodiment are given the same numbers, and their explanations will be omitted.
また、前記工程中、絶縁層４、電磁波シールド層５、ソ
ルダーレジスト層６の形成についての各工程は従来公知
の方法によるもので、その具体的な方法についての説明
は省略するとともに、かかる方法に限定されず他の公知
の種々の方法により形成できることはいうまでもない。In addition, in the above steps, each step of forming the insulating layer 4, the electromagnetic shielding layer 5, and the solder resist layer 6 is performed by a conventionally known method, and a detailed explanation of the method will be omitted. Needless to say, the structure is not limited and can be formed by various other known methods.
本発明プリント配線板によれば、導通用スルーホール部
に耐熱、耐候性の封止部材を充填し、かつ絶縁層を介し
て電磁波シールド層を形成することにより、導通用スル
ーホール部上にも電磁波シールド層を形成することがで
きるため、導通用スルーホール部においても受動、能動
ノイズである電磁波の影響を防止できる。According to the printed wiring board of the present invention, by filling the conductive through-hole portion with a heat-resistant and weather-resistant sealing member and forming an electromagnetic wave shielding layer through the insulating layer, the conductive through-hole portion can also be filled with a heat-resistant and weather-resistant sealing member. Since an electromagnetic wave shielding layer can be formed, it is possible to prevent the effects of electromagnetic waves, which are passive and active noises, even in the conduction through-hole portion.
また、導通用スルーホール部により電磁波シールド層が
分断されることが無く、有効なシールド層の面積を大き
くすることができるため、極めて良好な電磁波シールド
効果を有するプリント配線板を提供することができるも
のである。In addition, the electromagnetic shielding layer is not divided by the conduction through-hole portion, and the effective area of the shielding layer can be increased, making it possible to provide a printed wiring board with extremely good electromagnetic shielding effect. It is something.
さらにシールド層を備えるプリント配線板においてプリ
ント配線回路とシールド層間に形成する絶縁層の層厚を
２０〜５０μｍとすることによって、プリント配線回路
の適確な作動と、プリント配線回路とシールド層の段差
を最小源になし、両者間のアース回路の形成を不良なく
形成し得る。Furthermore, by setting the thickness of the insulating layer formed between the printed wiring circuit and the shield layer to 20 to 50 μm in the printed wiring board equipped with the shield layer, the proper operation of the printed wiring circuit and the level difference between the printed wiring circuit and the shield layer can be improved. This makes it possible to form a ground circuit between the two without any defects.
第１図は本発明プリント配線板の第１実施例を示す拡大
断面図、第２図は本発明プリント配線板の第２実施例を
示す拡大断面図、第３図は従来のプリント配線板の拡大
断面図である。
１・・・絶縁板
２・・・プリント配線回路
３ａ、３ｂ・・・封止部材
４・・・絶縁層
５・・・電磁波シールド層
５ａ・・・アース回路
６・・・ソルダーレジスト層
７・・・導通用スルーホール部
８・・・めっきスルーホール
９・・・プリント配線板FIG. 1 is an enlarged sectional view showing a first embodiment of the printed wiring board of the present invention, FIG. 2 is an enlarged sectional view of a second embodiment of the printed wiring board of the present invention, and FIG. 3 is an enlarged sectional view of a conventional printed wiring board. It is an enlarged sectional view. 1... Insulating plate 2... Printed wiring circuits 3a, 3b... Sealing member 4... Insulating layer 5... Electromagnetic wave shielding layer 5a... Earth circuit 6... Solder resist layer 7... ...Through hole part for continuity 8...Plated through hole 9...Printed wiring board
Claims (3)
るとともに絶縁層を介してシールド層を設けて成るプリ
ント配線板において、 前記プリント配線回路における導通用スルーホール部に
耐熱，耐候性の封止部材を充填するとともに前記絶縁層
の膜厚を２０〜５０μｍにて形成することにより構成し
たことを特徴とするシールド層を備えるプリント配線板
。(1) In a printed wiring board in which a printed wiring circuit is provided on one or both sides of the board and a shield layer is provided with an insulating layer interposed therebetween, a heat-resistant and weather-resistant sealing member is provided in the conductive through-hole portion of the printed wiring circuit. What is claimed is: 1. A printed wiring board comprising a shield layer, characterized in that the insulating layer is filled with a shield layer having a thickness of 20 to 50 μm.
型の合成樹脂材料から成ることを特徴とする請求項１記
載のプリント配線板。(2) The printed wiring board according to claim 1, wherein the sealing member is made of a thermosetting synthetic resin or a photocuring synthetic resin material.
電性合成樹脂材料から成りプリント配線板の両面間を導
通することを特徴とする請求項１記載のプリント配線板
。(3) The printed wiring board according to claim 1, wherein the sealing member is made of a conductive synthetic resin material containing carbon, silver, copper, etc., and conducts between both sides of the printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33719289A JPH03196690A (en) | 1989-12-26 | 1989-12-26 | Printed wiring board with shield layer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33719289A JPH03196690A (en) | 1989-12-26 | 1989-12-26 | Printed wiring board with shield layer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03196690A true JPH03196690A (en) | 1991-08-28 |
Family
ID=18306311
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33719289A Pending JPH03196690A (en) | 1989-12-26 | 1989-12-26 | Printed wiring board with shield layer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03196690A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106163103A (en) * | 2016-07-01 | 2016-11-23 | 业成光电（深圳）有限公司 | Circuit filling perforation bridging arrangement and method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61121491A (en) * | 1984-11-19 | 1986-06-09 | 松下電器産業株式会社 | Thick film circuit board |
| JPS63142889A (en) * | 1986-12-05 | 1988-06-15 | 日立エーアイシー株式会社 | Printed wiring board |
-
1989
- 1989-12-26 JP JP33719289A patent/JPH03196690A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61121491A (en) * | 1984-11-19 | 1986-06-09 | 松下電器産業株式会社 | Thick film circuit board |
| JPS63142889A (en) * | 1986-12-05 | 1988-06-15 | 日立エーアイシー株式会社 | Printed wiring board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106163103A (en) * | 2016-07-01 | 2016-11-23 | 业成光电（深圳）有限公司 | Circuit filling perforation bridging arrangement and method |
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