JPH04159796A - Manufacture of metallic base wiring board - Google Patents
Manufacture of metallic base wiring boardInfo
- Publication number
- JPH04159796A JPH04159796A JP28650990A JP28650990A JPH04159796A JP H04159796 A JPH04159796 A JP H04159796A JP 28650990 A JP28650990 A JP 28650990A JP 28650990 A JP28650990 A JP 28650990A JP H04159796 A JPH04159796 A JP H04159796A
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- metal plate
- circuit
- metal
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 239000004020 conductor Substances 0.000 claims abstract description 51
- 239000010410 layer Substances 0.000 claims abstract description 26
- 239000011229 interlayer Substances 0.000 claims abstract description 11
- 229910052751 metal Inorganic materials 0.000 claims description 64
- 239000002184 metal Substances 0.000 claims description 64
- 238000000034 method Methods 0.000 claims description 16
- 238000000206 photolithography Methods 0.000 claims description 4
- 238000007747 plating Methods 0.000 claims description 3
- 239000002861 polymer material Substances 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 238000005868 electrolysis reaction Methods 0.000 claims 1
- 238000009713 electroplating Methods 0.000 abstract description 4
- 239000011888 foil Substances 0.000 description 10
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- 238000007772 electroless plating Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical group [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000002841 Lewis acid Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910001870 ammonium persulfate Inorganic materials 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000012952 cationic photoinitiator Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005459 micromachining Methods 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】 [産業上の利用分野] 本発明は、金属ベース配線基板の製造方法に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to a method for manufacturing a metal-based wiring board.
[背景技術]
近年、フェノール樹脂に銅箔を張り合わせたプリント基
板の代わりに、金属板と銅箔等の金属箔を絶縁性接着剤
で張り合わせた金属ベース配線基板が用いられている。[Background Art] In recent years, metal-based wiring boards, in which a metal plate and a metal foil such as copper foil are bonded together with an insulating adhesive, have been used instead of printed circuit boards in which copper foil is bonded to phenolic resin.
これは、金属ベース配線基板が、放熱特性及び寸法精度
が良好で、機械的強度が大ぎいという特性を有しており
、電子部品の高密度実装要求にマツチしているためであ
る。This is because metal-based wiring boards have characteristics such as good heat dissipation characteristics, good dimensional accuracy, and high mechanical strength, and meet the requirements for high-density mounting of electronic components.
しかしながら、フェノール樹脂を用いたプリント配線基
板と比較すると、金属ベース配線基板は、絶縁層を金属
板と金属箔で挟む構造となるため、金属板と金属箔との
間に浮遊容量が寄生し、この浮遊容量に起因する信号の
不要な結合により回路動作が不安定になるという問題が
ある。これは、特に高周波回路の場合に大きな問題とな
り、金属ベース配線基板を高周波回路に応用する際の障
害となっていた。However, compared to printed wiring boards using phenolic resin, metal-based wiring boards have a structure in which an insulating layer is sandwiched between a metal plate and metal foil, so stray capacitance is parasitic between the metal plate and metal foil. There is a problem in that circuit operation becomes unstable due to unnecessary coupling of signals due to this stray capacitance. This is a big problem especially in the case of high-frequency circuits, and has been an obstacle when applying metal-based wiring boards to high-frequency circuits.
この問題を解決するためには、金属箔に形成されている
回路パターンのアース部を適当な位置で金属板に電気的
に接続ずればよい。その方法としては、下記の■、■、
■の方法が従来より用いられている。In order to solve this problem, the ground portion of the circuit pattern formed on the metal foil may be electrically connected to the metal plate at an appropriate position. To do this, please refer to the following ■,■,
Method (2) has been used conventionally.
■ 第一の方法は、金属板と回路パターンのアース部を
接続しようとする箇所で金属箔および絶縁層にあらかじ
めドリルなどで孔をあけ、この孔にハンダや導電ペース
トを満たし、ハンダないし導電ペーストを孔の周囲の回
路パターンのアース部と金属板に電気的に接続するもの
である。■ The first method is to pre-drill a hole in the metal foil and insulating layer at the point where you want to connect the ground part of the metal plate and the circuit pattern, fill this hole with solder or conductive paste, and use solder or conductive paste to is electrically connected to the ground part of the circuit pattern around the hole and the metal plate.
■ 第二の方法は、金属板と回路パターンのアース部を
接続しようとする箇所で金属ベース配線基板にドリルな
どで貫通孔をあけ、この貫通孔に金属ボルトを通し、金
属ポルI・にナツトを締め付けることにより回路パター
ンのアース部と金属板を電気的に接続するものである。■ The second method is to drill a through hole in the metal base wiring board at the point where you want to connect the metal plate and the ground part of the circuit pattern, pass a metal bolt through this through hole, and then tighten the nut to the metal pole I. By tightening, the ground part of the circuit pattern and the metal plate are electrically connected.
■ 第三の方法は、特公平2−8472号公報に開示さ
れたものである。これは、例えば金属板の上にスクリー
ン印刷によって導電性接着剤を印刷した後に軽く乾燥さ
せ、次に主としてエポキシ系樹脂からなる絶縁性接着剤
を塗布17た後、軽く乾燥させることによって仮硬化を
行い、その上に金属箔を重ね、熱プレスなどを用いて金
属箔と金属板を圧着させ、金属箔をエツチングして回路
パターンを形成し、前記導電性接着剤により回路パター
ンのアース部分と金属板を電気的接続する方法である。(2) The third method is disclosed in Japanese Patent Publication No. 2-8472. This is done by, for example, printing a conductive adhesive on a metal plate by screen printing, drying it slightly, then applying an insulating adhesive mainly made of epoxy resin 17, and then drying it lightly to temporarily cure it. The metal foil is placed on top of the metal foil, the metal foil and the metal plate are crimped using a heat press, etc., the metal foil is etched to form a circuit pattern, and the conductive adhesive is used to connect the ground part of the circuit pattern to the metal plate. This is a method of electrically connecting boards.
[発明が解決しようとする課題]
しかしながら、上記■及び■の方法でば、回路パターン
のアース部と金属板を電気的に接続させるための部分が
相当大きなスペースを占め、高密度実装用の金属ベース
配線基板を製作するのが困難であった。[Problems to be Solved by the Invention] However, in the methods ① and ② above, the part for electrically connecting the ground part of the circuit pattern and the metal plate occupies a considerable amount of space, and the metal plate for high-density mounting It was difficult to manufacture the base wiring board.
また、上記■の方法では、導電性接着剤や絶縁性接着剤
をスクリーン印刷等によって選択的に印刷しているので
、導電性接着剤等の印刷位置精度や寸法精度が悪かった
。このため、金属箔を微細加工して細かな回路パターン
を形成すると、導電性接着剤の部分が回路パターンのア
ース部分から位置ずれし、微細な回路パターンを形成す
ることが困難であった。Furthermore, in the method (2) above, since the conductive adhesive and the insulating adhesive are selectively printed by screen printing or the like, the printing position accuracy and dimensional accuracy of the conductive adhesive and the like are poor. For this reason, when a fine circuit pattern is formed by micromachining the metal foil, the conductive adhesive portion shifts from the ground portion of the circuit pattern, making it difficult to form a fine circuit pattern.
本発明は、取上の従来例の欠点に鑑みてなされたもので
あり、その目的とするところは、高周波回路においても
良好な動作を期待でき、さらに高密度実装が可能で、回
路パターンの微細加工が可能な金属ベース配線基板の製
造方法を提供することにある。The present invention was made in view of the drawbacks of the conventional examples mentioned above, and its purpose is to enable good operation even in high-frequency circuits, enable high-density packaging, and improve the fineness of circuit patterns. An object of the present invention is to provide a method for manufacturing a metal-based wiring board that can be processed.
[課題を解決するための手段]
本発明の金属ベース配線基板の製造方法は、金属板の一
方または両方の主面上に感光性高分子材料を塗布して絶
縁層を形成した後、フォトリングラフィ技術を用いて前
記絶縁層に層間接続用孔をあける工程と、電解メッキに
より前記層間接続用孔内部に導体部を形成して金属板表
面と電気的接続させる工程と、前記絶縁層及び導体部の
上面に回路導体を形成し、この回路導体と金属板とを前
記導体部を介して電気的接続させる工程とからなること
を特徴としている。[Means for Solving the Problems] The method for manufacturing a metal-based wiring board of the present invention includes coating a photosensitive polymer material on one or both main surfaces of a metal plate to form an insulating layer, and then applying a photoresist. A step of forming a hole for interlayer connection in the insulating layer using a graphic technique, a step of forming a conductor part inside the hole for interlayer connection by electrolytic plating to make an electrical connection with the surface of the metal plate, and a step of forming a conductor part in the insulating layer and the conductor The method is characterized by comprising a step of forming a circuit conductor on the upper surface of the part and electrically connecting the circuit conductor and the metal plate via the conductor part.
[作用]
本発明の方法によって金属ベース配線基板を製造すれば
、導体部を介して回路導体を金属板に電気的に接続させ
ることができるので、高周波回路においても浮遊容量に
よる回路の不安定化を防止することかできる。[Function] If a metal-based wiring board is manufactured by the method of the present invention, the circuit conductor can be electrically connected to the metal plate through the conductor portion, so even in high-frequency circuits, instability of the circuit due to stray capacitance can be avoided. Is it possible to prevent this?
しかも、フォトリングラフィによって絶縁層に層間接続
用孔を形成し、層間接続用孔内部に導体部を電解メッキ
しているので、非常に小さな導体部を寸法精度及び位置
精度よく設けることかできる。したがって、回路導体の
微細加工も可能になり、金属ベース配線基板による高密
度実装も可能になる。Moreover, since the interlayer connection holes are formed in the insulating layer by photolithography and the conductor portions are electrolytically plated inside the interlayer connection holes, very small conductor portions can be provided with good dimensional and positional accuracy. Therefore, fine processing of circuit conductors becomes possible, and high-density packaging using metal-based wiring boards becomes possible.
[実施例]
以下、本発明の一実施例を第1図(a)〜(+)に基づ
いて詳述する。[Example] Hereinafter, an example of the present invention will be described in detail based on FIGS. 1(a) to (+).
まず、厚さ1mmのアルミニウム板等の金属板1を用意
した。ついで、この金属板1の上面全面に、感光性有機
高分子材料として、紫外線を照射されるとルイス酸を発
生ずるカチオン型光開始剤(潜在性硬化剤)を含有した
エポキシ樹脂2を塗布し、金属板1の一ヒ面に絶縁層3
を形成した(第1図(a))。次に、金属板1の」二面
の導体部7を形成しようとする領域をマスク4で覆い、
マスク4を通して紫外線ランプ5によりエポキシ樹脂2
を露光させて露光領域を硬化させた(第1図(b))後
、現像した。エポキシ樹脂2の未露光領域は現像時に除
去されるので、フォトリングラフィ技術により絶縁層3
の所望位置に層間接続用孔6が開口される(第1図(C
))。絶縁層3に層間接続用孔6をあげた後、金属板]
の上面に電解メッキを施すと、絶縁層3から露出してい
る層間接続用孔6の内部において金属板1の表面に導体
部7が形成される(第1図(d))。この導体部7のメ
ッキ材料としては、銅が一番適しており、抵抗率が小さ
く高周波特性も優れている。この後、絶縁層3及び導体
部7の表面に無電解銅メッキを施し、ザブミクロン以下
の厚さの無電解メッキ層8を形成する(第1図(e))
。ついで、無電解メッキ層8の上にネガタイプの感光性
レジスト9を塗布しく第1図(f))、感光性レジスト
9の上にフォトマスク10を重ねて露光させ(第1図(
g)) 、さらに現像して無電解メッキ層8の上にレジ
ストパターン11を形成する(第1図(h))。なお、
レジストパターン]1の形成方法としては、スクリーン
印刷、ドライフィルム、フォトリソグラフィのうちいず
れでもよく、レジストパターン11に必要な解像度に応
じて選按することができる。さらに。First, a metal plate 1 such as an aluminum plate having a thickness of 1 mm was prepared. Next, an epoxy resin 2 containing a cationic photoinitiator (latent curing agent) that generates a Lewis acid when irradiated with ultraviolet rays is applied as a photosensitive organic polymer material to the entire upper surface of the metal plate 1. , an insulating layer 3 on one side of the metal plate 1
was formed (Fig. 1(a)). Next, the area where the conductor portion 7 on the two sides of the metal plate 1 is to be formed is covered with a mask 4,
Epoxy resin 2 by ultraviolet lamp 5 through mask 4
was exposed to light to cure the exposed area (FIG. 1(b)), and then developed. Since the unexposed areas of the epoxy resin 2 are removed during development, the insulating layer 3 is removed using photolithography technology.
An interlayer connection hole 6 is opened at a desired position (see FIG. 1(C)).
)). After forming the interlayer connection holes 6 in the insulating layer 3, the metal plate]
When electrolytic plating is applied to the upper surface of the metal plate 1, a conductor portion 7 is formed on the surface of the metal plate 1 inside the interlayer connection hole 6 exposed from the insulating layer 3 (FIG. 1(d)). Copper is the most suitable material for plating the conductor portion 7, as it has low resistivity and excellent high frequency characteristics. Thereafter, electroless copper plating is applied to the surfaces of the insulating layer 3 and the conductor portion 7 to form an electroless plating layer 8 having a thickness of submicron or less (Fig. 1(e)).
. Next, a negative type photosensitive resist 9 is coated on the electroless plating layer 8 (FIG. 1(f)), a photomask 10 is placed over the photosensitive resist 9, and exposed to light (FIG. 1(f)).
g)) Further development is performed to form a resist pattern 11 on the electroless plating layer 8 (FIG. 1(h)). In addition,
The method for forming the resist pattern 1 may be any one of screen printing, dry film, and photolithography, which can be selected depending on the resolution required for the resist pattern 11. moreover.
レジストパターン11の開口部を通して無電解メッキ層
8の」二に電解メッキを施し、回路導体12を形成する
(第]−図(i))。回路導体12が形成されたらレジ
ストパターン11を除去しく第1図(j)) 、さらに
、過硫酸アンモニウム等のエツチング液により薄い無電
解メッキ層8の露出部分をエツチング除去し、各回路導
体12間を分離させ(第1図(k))、目的とする金属
ベース配線基板13を得た。なお、第1図(1)は、金
属ベース配線基板13の回路導体12の上にICチップ
や抵抗、コンデンサ、インダクタ、トランジスタ等の電
子部品14.15を載せ、電子部品14.15の端子と
回路導体12をワイヤボンディングし、あるいは半田付
げした状態を示している。Electrolytic plating is applied to the second part of the electroless plating layer 8 through the opening of the resist pattern 11 to form the circuit conductor 12 (Fig. 1-(i)). After the circuit conductors 12 are formed, the resist pattern 11 is removed (FIG. 1(j)), and the exposed portions of the thin electroless plating layer 8 are etched away using an etching solution such as ammonium persulfate, thereby forming a gap between each circuit conductor 12. It was separated (FIG. 1(k)) to obtain the desired metal base wiring board 13. In addition, in FIG. 1 (1), electronic components 14.15 such as IC chips, resistors, capacitors, inductors, transistors, etc. are placed on the circuit conductor 12 of the metal base wiring board 13, and the terminals of the electronic components 14.15 and A state in which the circuit conductor 12 is wire-bonded or soldered is shown.
このようにして製造すれば、導体部7によって容易に金
属板1と回路導体12のアース部とを電気的に接続する
ことができるので、高周波回路においても浮遊容量によ
る回路の不安定性を防止することができる。しかも、導
体部7は、回路導体12の線幅に比べて小さくできるの
で、基板のスペース効率が向上し、高密度実装用の金属
ベース配線基板を製作することができる。また、導体部
を小さくできるので、導体部の配置位置の制限が小さく
なり、任意の箇所で回路導体を金属板に接続させること
かできる。さらに、導体部7を小さく、かつ精度良く設
けることかできるので、導体回路の微細加工も可能にな
り、量産性も良好になる。If manufactured in this way, the metal plate 1 and the ground part of the circuit conductor 12 can be easily electrically connected by the conductor part 7, thereby preventing circuit instability caused by stray capacitance even in high frequency circuits. be able to. Moreover, since the conductor portion 7 can be made smaller than the line width of the circuit conductor 12, the space efficiency of the board is improved, and a metal-based wiring board for high-density mounting can be manufactured. Furthermore, since the conductor portion can be made smaller, there are fewer restrictions on the placement position of the conductor portion, and the circuit conductor can be connected to the metal plate at any location. Furthermore, since the conductor portion 7 can be small and provided with high precision, fine processing of the conductor circuit is also possible, and mass productivity is also improved.
なお、第1図では、金属板の片面にのみ回路導体を設け
たが、金属板の両面に絶縁層及び回路導体を設け、両面
の回路導体を導体部によって金属板に電気的接続しても
よい。In Figure 1, the circuit conductor is provided only on one side of the metal plate, but it is also possible to provide an insulating layer and a circuit conductor on both sides of the metal plate and electrically connect the circuit conductors on both sides to the metal plate through the conductor part. good.
[発明の効果]
本発明の製造方法によって金属ベース配線基板を製造す
れば、高周波回路でも浮遊容量による回路の不安定化を
防止できる。[Effects of the Invention] If a metal-based wiring board is manufactured by the manufacturing method of the invention, instability of the circuit due to stray capacitance can be prevented even in high-frequency circuits.
しかも、金属板と回路導体を電気的に接続している導体
部を小さく、かつ寸法精度よく形成することができるの
で、回路導体の微細加工も容易になり、より高密度実装
が可能な金属ベース配線基板を製作できる。Moreover, the conductor part that electrically connects the metal plate and the circuit conductor can be formed small and with high dimensional accuracy, making it easier to microfabricate the circuit conductor and allowing for higher-density mounting on the metal base. Can produce wiring boards.
第1図(a)〜(1)は本発明の金属ベース配線基板の
製造方法を説明する断面図である。
1・・・金属板
3・・・絶縁層
6・・・層間接続用孔
7・・・導体部
12・・・回路導体
特許出願人 株式会社 村田製作所
代理人 弁理士 中 野 雅 房FIGS. 1(a) to 1(1) are cross-sectional views illustrating the method for manufacturing a metal-based wiring board of the present invention. 1...Metal plate 3...Insulating layer 6...Interlayer connection hole 7...Conductor portion 12...Circuit conductor Patent applicant Murata Manufacturing Co., Ltd. Agent Patent attorney Masafusa Nakano
Claims (1)
材料を塗布して絶縁層を形成した後、フォトリソグラフ
ィ技術を用いて前記絶縁層に層間接続用孔をあける工程
と、 電解メッキにより前記層間接続用孔内部に導体部を形成
して金属板表面と電気的接続させる工程と、 前記絶縁層及び導体部の上面に回路導体を形成し、この
回路導体と金属板とを前記導体部を介して電気的接続さ
せる工程とからなることを特徴とする金属ベース配線基
板の製造方法。(1) After coating a photosensitive polymer material on one or both main surfaces of a metal plate to form an insulating layer, forming holes for interlayer connection in the insulating layer using photolithography, and electrolysis. forming a conductor part inside the interlayer connection hole by plating and electrically connecting it to the surface of the metal plate; forming a circuit conductor on the upper surface of the insulating layer and the conductor part; and connecting the circuit conductor and the metal plate to the surface of the metal plate. 1. A method for manufacturing a metal-based wiring board, comprising the step of electrically connecting via a conductor portion.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP28650990A JPH04159796A (en) | 1990-10-23 | 1990-10-23 | Manufacture of metallic base wiring board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP28650990A JPH04159796A (en) | 1990-10-23 | 1990-10-23 | Manufacture of metallic base wiring board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04159796A true JPH04159796A (en) | 1992-06-02 |
Family
ID=17705334
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP28650990A Pending JPH04159796A (en) | 1990-10-23 | 1990-10-23 | Manufacture of metallic base wiring board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04159796A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06204658A (en) * | 1992-10-30 | 1994-07-22 | Nec Corp | Manufacture of printed wiring board |
JP2010529693A (en) * | 2007-06-11 | 2010-08-26 | ピーピージー インダストリーズ オハイオ, インコーポレイテッド | Method for forming a solid blind via through a dielectric coating on a high density interconnect (HDI) substrate material |
-
1990
- 1990-10-23 JP JP28650990A patent/JPH04159796A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06204658A (en) * | 1992-10-30 | 1994-07-22 | Nec Corp | Manufacture of printed wiring board |
JP2010529693A (en) * | 2007-06-11 | 2010-08-26 | ピーピージー インダストリーズ オハイオ, インコーポレイテッド | Method for forming a solid blind via through a dielectric coating on a high density interconnect (HDI) substrate material |
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