JPS63193853U - - Google Patents
Info
- Publication number
- JPS63193853U JPS63193853U JP8432387U JP8432387U JPS63193853U JP S63193853 U JPS63193853 U JP S63193853U JP 8432387 U JP8432387 U JP 8432387U JP 8432387 U JP8432387 U JP 8432387U JP S63193853 U JPS63193853 U JP S63193853U
- Authority
- JP
- Japan
- Prior art keywords
- molded
- groove
- mold
- lead frame
- area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000465 moulding Methods 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims 1
- 238000000034 method Methods 0.000 description 3
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本実施例に係るリードフレームの平面
図、第２図は本実施例におけるモールド加工を示
す縦断面図、第３図は本実施例において半導体素
子を固設する工程を示す斜視図、第４図は本実施
例において半導体素子を固設する工程を示す縦断
面図、第５図は従来例のリードフレームの平面図
、第６図は従来例におけるモールド加工を示す縦
断面図、第７図は従来例にモールド加工を施した
後の状態を示す縦断面図である。
１……リードフレーム、２……ダイパツト、６
……境界線、７……モールド部、１０……溝、１
２……成形金型、１３……突条。
Fig. 1 is a plan view of a lead frame according to this embodiment, Fig. 2 is a longitudinal cross-sectional view showing mold processing in this embodiment, and Fig. 3 is a perspective view showing the process of fixing a semiconductor element in this embodiment. , FIG. 4 is a vertical cross-sectional view showing the process of fixing the semiconductor element in this embodiment, FIG. 5 is a plan view of a lead frame in the conventional example, and FIG. 6 is a vertical cross-sectional view showing the molding process in the conventional example. FIG. 7 is a longitudinal cross-sectional view showing the state of the conventional example after molding. 1...Lead frame, 2...Die part, 6
... Boundary line, 7 ... Mold part, 10 ... Groove, 1
2...Molding die, 13...Protrusion.
Claims (1)
て用いられるダイパツトを備え、該ダイパツト表
面に、モールド部が形成されるモールド領域と、
モールド部が形成されない非モールド領域を有す
るリードフレームにおいて、 前記ダイパツト表面のモールド領域と非モール
ド領域との境界線上に又は非モールド領域内に該
境界線に沿うように溝を条設し、別途モールド金
型に設けた突条と該溝とがモールド成形時に密着
し得るようにしたことを特徴とするリードフレー
ム。[Claims for Utility Model Registration] A mold region comprising a die pad on which a semiconductor element is fixed and used as a substrate of a semiconductor device, and a mold portion is formed on the surface of the die pad;
In a lead frame having a non-molded area in which no molded part is formed, a groove is provided along the boundary line between the molded area and the non-molded area on the surface of the die part or in the non-molded area, and a groove is separately molded. A lead frame characterized in that a protrusion provided on a mold and the groove can be brought into close contact during molding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8432387U JPH0526763Y2 (en) | 1987-05-29 | 1987-05-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8432387U JPH0526763Y2 (en) | 1987-05-29 | 1987-05-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63193853U true JPS63193853U (en) | 1988-12-14 |
| JPH0526763Y2 JPH0526763Y2 (en) | 1993-07-07 |
Family
ID=30938721
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8432387U Expired - Lifetime JPH0526763Y2 (en) | 1987-05-29 | 1987-05-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0526763Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019062214A (en) * | 2018-11-27 | 2019-04-18 | 日亜化学工業株式会社 | Light-emitting device, and method for manufacturing the same |
-
1987
- 1987-05-29 JP JP8432387U patent/JPH0526763Y2/ja not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019062214A (en) * | 2018-11-27 | 2019-04-18 | 日亜化学工業株式会社 | Light-emitting device, and method for manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0526763Y2 (en) | 1993-07-07 |
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