JPS63193854U - - Google Patents
Info
- Publication number
- JPS63193854U JPS63193854U JP8432487U JP8432487U JPS63193854U JP S63193854 U JPS63193854 U JP S63193854U JP 8432487 U JP8432487 U JP 8432487U JP 8432487 U JP8432487 U JP 8432487U JP S63193854 U JPS63193854 U JP S63193854U
- Authority
- JP
- Japan
- Prior art keywords
- molded
- region
- lead frame
- area
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案に係るリードフレームの概略断
面図、第２図は同概略平面図、第３図は被膜の剥
離状態を示す断面図、第４図は従来例を示す断面
図である。
Ａ……リードフレーム、１……ダイパツト、２
……モールド部、５……樹脂被膜、６……境界線
、７……モールド領域、８……非モールド領域。
FIG. 1 is a schematic sectional view of a lead frame according to the present invention, FIG. 2 is a schematic plan view thereof, FIG. 3 is a sectional view showing a peeled state of the film, and FIG. 4 is a sectional view showing a conventional example. A...Lead frame, 1...Die part, 2
...Mold part, 5...Resin coating, 6...Boundary line, 7...Mold area, 8...Non-mold area.
Claims (1)
が形成されるモールド領域と、モールド部が形成
されない非モールド領域とを有すると共に、半導
体装置の基板として用いられるリードフレームに
おいて、 少なくともモールド領域と非モールド領域との
境界線から非モールド領域に亘つて、バリ剥離用
の被膜を形成したことを特徴とするリードフレー
ム。[Claims for Utility Model Registration] A lead frame that has a molded area on which a semiconductor element is fixed, a molded part is formed on the surface, and a non-molded area where no molded part is formed, and is used as a substrate of a semiconductor device. A lead frame characterized in that a film for removing burrs is formed at least from the boundary line between the molded region and the non-molded region to the non-molded region.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8432487U JPS63193854U (en) | 1987-05-29 | 1987-05-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8432487U JPS63193854U (en) | 1987-05-29 | 1987-05-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63193854U true JPS63193854U (en) | 1988-12-14 |
Family
ID=30938723
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8432487U Pending JPS63193854U (en) | 1987-05-29 | 1987-05-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63193854U (en) |
-
1987
- 1987-05-29 JP JP8432487U patent/JPS63193854U/ja active Pending
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