JP2017039298A

JP2017039298A - Resin molding

Info

Publication number: JP2017039298A
Application number: JP2015163872A
Authority: JP
Inventors: 翼渡辺; Tasuku Watanabe; 河野　務; Tsutomu Kono; 務河野; 忍田代; Shinobu Tashiro; 小澤　正之; Masayuki Ozawa; 正之小澤
Original assignee: Hitachi Automotive Systems Ltd
Current assignee: Hitachi Astemo Ltd
Priority date: 2015-08-21
Filing date: 2015-08-21
Publication date: 2017-02-23
Anticipated expiration: 2035-08-21
Also published as: JP6538479B2

Abstract

PROBLEM TO BE SOLVED: To suppress deformation of a conductor for connection due to a resin pressure at the time of molding.SOLUTION: A gate mark due to filling of a resin is formed on the side face of a resin portion, a plurality of conductors for connection are arranged side by side in a direction toward the gate mark, a deformation suppressing portion is provided on a portion where one end side of the conductor for connection is embedded in the resin portion in the conductor for connection facing the gate mark, the conductor for connection on which the deformation suppressing portion is formed includes a conductor for connection closest to the gate mark, and a cross-sectional area of the deformation suppressing portion is made larger than cross-sectional areas of other portions of the conductor for connection.SELECTED DRAWING: Figure 3

Description

本発明は、樹脂成形体に関する。 The present invention relates to a resin molded body.

コンピュータと周辺機器、電子機器などを接続し、電気的に連絡するために、接続器、いわゆる、コネクタが用いられる。コネクタには、数本から数十本の接続用導体を、インサート成形により形成する構造を有するものがある。このようなコネクタは、複数の突起が配列された一次成形品を形成し、接続用導体である端子金具に形成した取付孔を各突起に嵌合して端子金具を位置決めし、この状態で二次成形することによって形成される。 A connector, a so-called connector, is used to connect a computer and peripheral devices, electronic devices, and the like and make electrical communication therebetween. Some connectors have a structure in which several to several tens of connecting conductors are formed by insert molding. Such a connector forms a primary molded product in which a plurality of protrusions are arranged, and fits the mounting holes formed in the terminal fitting as a connecting conductor to each protrusion to position the terminal fitting. Formed by subsequent molding.

上記方法では、端子金具は、その配列方向への移動を規制することはできるが、型抜き方向への移動を規制することはできず、二次成形の際に、端子金具が型抜き方向に移動する可能性がある。そこで、一次成形用の金型に、根元側が拡大された傾斜面を有する金型ピンを配列して設け、端子金具を金型ピン間に配置して金型ピンの傾斜面に押し付けた状態で二次成形する方法が知られている。このようにすれば、一次成形の際、端子金具が型抜き方向に移動するのを規制することができ、この一次成形品を用いて二次成形を行えば、型抜き方向への移動を抑制したコネクタを得ることができる（例えば、特許文献１参照）。 In the above method, the terminal fitting can be restricted from moving in the arrangement direction, but cannot be restricted from moving in the die-cutting direction. There is a possibility to move. Therefore, in the mold for primary molding, mold pins having an inclined surface whose root side is enlarged are arranged and provided, and terminal fittings are arranged between the mold pins and pressed against the inclined surfaces of the mold pins. A method of secondary molding is known. In this way, it is possible to restrict the terminal fitting from moving in the die-cutting direction during the primary molding. If secondary molding is performed using this primary molded product, the movement in the die-cutting direction is suppressed. A connector can be obtained (see, for example, Patent Document 1).

特開２００９−６６８５８号公報JP 2009-66885 A

従来の樹脂成形体であるコネクタでは、成形時の樹脂圧力等の負荷により接続用導体である端子金具が変形する可能性がある。 In a connector that is a conventional resin molded body, there is a possibility that a terminal fitting that is a connecting conductor is deformed by a load such as a resin pressure during molding.

本発明の樹脂成形体は、互いに離間して並置された複数の接続用導体と、前記接続用導体それぞれの少なくとも一端部を露出した状態で複数の前記接続用導体を覆う樹脂部とを有し、複数の前記接続用導体と前記樹脂部とはモールド成形による一体構造であり、前記複数の接続用導体の配列方向の前記樹脂部の一側面には、樹脂充填によるゲート痕が形成されており、前記複数の接続用導体は、それぞれが前記ゲート痕に向かう方向に並置され、前記ゲート痕と対峙する前記接続用導体には、前記接続用導体の一端部側が前記樹脂部に埋設される箇所に変形抑制部が設けられ、前記変形抑制部が形成される前記接続用導体は、前記ゲート痕に最も近い接続用導体を含み、前記変形抑制部の断面積は、前記接続用導体の他の箇所の断面積よりも大きくされている。 The resin molded body of the present invention has a plurality of connecting conductors arranged side by side apart from each other, and a resin portion that covers the plurality of connecting conductors in a state where at least one end of each of the connecting conductors is exposed. The plurality of connection conductors and the resin portion are integrally formed by molding, and one side surface of the resin portion in the arrangement direction of the plurality of connection conductors has a gate mark formed by resin filling. The plurality of connection conductors are juxtaposed in a direction toward the gate mark, and the connection conductor facing the gate mark has a portion where one end side of the connection conductor is embedded in the resin portion. A deformation suppressing portion is provided, and the connection conductor on which the deformation suppressing portion is formed includes a connection conductor closest to the gate mark, and the cross-sectional area of the deformation suppressing portion is different from that of the connecting conductor. Than the cross-sectional area I have been listening.

本発明によれば、成形時の樹脂圧力等の負荷による接続用導体の変形が抑制された樹脂成形体とすることができる。 According to this invention, it can be set as the resin molding by which the deformation | transformation of the connection conductor by load, such as the resin pressure at the time of shaping | molding, was suppressed.

本発明の樹脂成形体の第１の実施形態を示す平面図。The top view which shows 1st Embodiment of the resin molding of this invention. 図２（Ａ）〜（Ｃ）は、図１に図示された樹脂成形体をモールド成形する方法を説明するための図であり、図２（Ａ）は、図２（Ｂ）のＩＩA―ＩＩA線断面図、図２（Ｂ）は、図２（Ａ）のＩＩB−ＩＩB線断面図、図２（Ｃ）は、図２（Ａ）のＩＩC−ＩＩC線断面図。2A to 2C are views for explaining a method of molding the resin molded body shown in FIG. 1, and FIG. 2A is a view taken along the line IIA-IIA in FIG. 2B. 2B is a sectional view taken along line IIB-IIB in FIG. 2A, and FIG. 2C is a sectional view taken along line IIC-IIC in FIG. 図３（Ａ）、（Ｂ）は、図２（Ａ）〜（Ｃ）において、樹脂の注入が始まった状態を示す図であり、図３（Ａ）は、図２（Ａ）に対応し、図３（Ｂ）は、図２（Ｃ）に対応する。3 (A) and 3 (B) are views showing a state in which resin injection has started in FIGS. 2 (A) to 2 (C), and FIG. 3 (A) corresponds to FIG. 2 (A). 3 (B) corresponds to FIG. 2 (C). 図４（Ａ）、（Ｂ）は、比較品の樹脂成形体のモールド成形の状態を示す図。FIGS. 4A and 4B are views showing a state of molding of a comparative resin molding. 本発明の樹脂成形体の第２の実施形態を示す。図５（Ａ）〜図５（Ｃ）は、樹脂成形体のモールド成形状態を示す断面図であり、図５（Ａ）は、図５（Ｂ）のＶA―ＶA線断面図、図５（Ｂ）は、図５（Ａ）のＶB−ＶB線断面図、図５（Ｃ）は、図５（Ａ）のＶC−ＶC線断面図。2nd Embodiment of the resin molding of this invention is shown. 5 (A) to 5 (C) are cross-sectional views showing the molded state of the resin molded body, and FIG. 5 (A) is a cross-sectional view taken along the line VA-VA in FIG. 5 (B). FIG. 5B is a cross-sectional view taken along the line VB-VB in FIG. 5A, and FIG. 5C is a cross-sectional view taken along the line VC-VC in FIG. 本発明の樹脂成形体の第３の実施形態を示す。図６（Ａ）〜図６（Ｃ）は、樹脂成形体のモールド成形状態を示す断面図であり、図６（Ａ）は、図６（Ｂ）のＶＩA―ＶＩA線断面図、図６（Ｂ）は、図６（Ａ）のＶＩB−ＶＩB線断面図、図６（Ｃ）は、図６（Ａ）のＶＩC−ＶＩC線断面図。3rd Embodiment of the resin molding of this invention is shown. 6A to 6C are cross-sectional views showing a molded state of the resin molded body, and FIG. 6A is a cross-sectional view taken along the line VIA-VIA in FIG. 6B is a sectional view taken along the line VIB-VIB in FIG. 6A, and FIG. 6C is a sectional view taken along the line VIC-VIC in FIG. 本発明の樹脂成形体の第４の実施形態であり、樹脂成形体のモールド成形状態を示す断面図。Sectional drawing which is 4th Embodiment of the resin molding of this invention, and shows the mold molding state of the resin molding. 図８（Ａ）〜（Ｃ）は、本発明の樹脂成形体の第５の実施形態を示し、図８（Ａ）は正面図、図８（Ｂ）は上面図、図８（Ｃ）は右側面図。8A to 8C show a fifth embodiment of the resin molded body of the present invention. FIG. 8A is a front view, FIG. 8B is a top view, and FIG. Right side view. 図９（Ａ）〜（Ｃ）は、図８（Ａ）〜（Ｃ）に図示された樹脂成形体のモールド成形状態を示す断面図であり、図９（Ａ）は正面図、図９（Ｂ）は、図９（Ａ）のＩＸB−ＩＸB線断面図、図９（Ｃ）は、図９（Ｂ）のＩＸC−ＩＸC線断面図。FIGS. 9A to 9C are cross-sectional views showing the molded state of the resin molded body shown in FIGS. 8A to 8C. FIG. 9A is a front view and FIG. FIG. 9B is a sectional view taken along line IXB-IXB in FIG. 9A, and FIG. 9C is a sectional view taken along line IXC-IXC in FIG. 図１０（Ａ）〜（Ｃ）は、図８（Ａ）〜（Ｃ）に図示された樹脂成形体の接続用導体を模擬した解析モデル図であり、図１０（Ａ）は、図１０（Ｂ）のＸA−ＸA線断面図、図１０（Ｂ）は、図１０（Ａ）のＸB−ＸB線断面図、図１０（Ｃ）は、図１０（Ａ）の右側面図。FIGS. 10A to 10C are analysis model diagrams simulating the connecting conductors of the resin molded bodies shown in FIGS. 8A to 8C. FIG. FIG. 10B is a cross-sectional view taken along line XB-XB in FIG. 10A, and FIG. 10C is a right side view of FIG. 10A. 図１１（Ａ）、（Ｂ）は、第１のゲート位置における接続用導体を模擬した解析モデル図であり、図１１（Ａ）は正面図、図１１（Ｂ）は、図１１（Ａ）の右側面図。11A and 11B are analysis model diagrams simulating the connection conductor at the first gate position, FIG. 11A being a front view, and FIG. 11B being FIG. 11A. FIG. 図１２（Ａ）、（Ｂ）は、第２のゲート位置における接続用導体を模擬した解析モデル図であり、図１２（Ａ）は正面図、図１２（Ｂ）は、図１２（Ａ）の右側面図。12A and 12B are analysis model diagrams simulating the connection conductor at the second gate position, FIG. 12A is a front view, and FIG. 12B is FIG. FIG. 比較品の樹脂成形体の接続用導体を模擬した解析モデル図であり、図１３（Ａ）は、図１３（Ｂ）のＸＩＩＩA−ＸＩＩＩA線断面図、図１３（Ｂ）は、図１３（Ａ）のＸＩＩＩB−ＸＩＩＩB線断面図、図１３（Ｃ）は、図１３（Ａ）の右側面図。FIG. 13A is an analysis model diagram simulating a connection conductor of a resin molded body of a comparative product. FIG. 13A is a cross-sectional view taken along line XIIIA-XIIIA in FIG. 13B, and FIG. ) XIIIB-XIIIB line sectional view, FIG. 13C is a right side view of FIG. 解析に用いた樹脂の物性を示す図であり、せん断速度−粘度−温度に関する特性図。It is a figure which shows the physical property of resin used for the analysis, and is a characteristic view regarding shear rate-viscosity-temperature. 解析に用いた樹脂の物性を示す図であり、温度−比容積−圧力に関する特性図。It is a figure which shows the physical property of resin used for the analysis, and is a characteristic view regarding temperature-specific volume-pressure. 第１のゲート位置における本発明の実施例と比較品とのゲート痕に最も近い接続用導体の変形量の比較を示す図。The figure which shows the comparison of the deformation amount of the connection conductor nearest to the gate trace of the Example of this invention in a 1st gate position, and a comparative product. 第２のゲート位置における本発明の実施例と比較品とのゲート痕に最も近い接続用導体の変形量の比較を示す図。The figure which shows the comparison of the deformation amount of the connection conductor nearest to the gate trace of the Example of this invention in a 2nd gate position, and a comparative product. 第１のゲート位置における本発明の実施例と比較品とのゲート痕に２番目に近い接続用導体の変形量の比較を示す図。The figure which shows the comparison of the deformation of the connection conductor nearest to the gate trace of the Example of this invention and a comparative product in a 1st gate position. 第２のゲート位置における本発明の実施例と比較品とのゲート痕に２番目に近い接続用導体の変形量の比較を示す図。The figure which shows the comparison of the deformation of the connection conductor nearest to the gate trace of the Example of this invention and a comparative product in a 2nd gate position.

−第１の実施形態―
以下、図１〜図３を参照して、本発明の第１の実施形態を説明する。
図１は、本発明の樹脂成形体の第１の実施形態を示す平面図である。図２（Ａ）〜（Ｃ）は、図１に図示された樹脂成形体をモールド成形する方法を説明するための図であり、図２（Ａ）は、図２（Ｂ）のＩＩA―ＩＩA線断面図、図２（Ｂ）は、図２（Ａ）のＩＩB−ＩＩB線断面図、図２（Ｃ）は、図２（Ａ）のＩＩC−ＩＩC線断面図である。
一般的にコネクタと言われる樹脂成形体１００は、複数の接続用導体２ａ〜２ｃと、各接続用導体２ａ〜２ｃの両端部を露出した状態で、接続用導体２ａ〜２ｃを覆う樹脂部１１とを有する。樹脂成形体１００は、接続用導体２ａ〜２ｃを数本〜数十本有しているが、以下の実施形態では、接続用導体２ａ〜２ｃを三本として説明する。また、接続用導体２ａ〜２ｃを、適宜、接続用導体２として説明する。 -First embodiment-
Hereinafter, a first embodiment of the present invention will be described with reference to FIGS.
FIG. 1 is a plan view showing a first embodiment of a resin molded body of the present invention. 2A to 2C are views for explaining a method of molding the resin molded body shown in FIG. 1, and FIG. 2A is a view taken along the line IIA-IIA in FIG. 2B. 2B is a cross-sectional view taken along the line IIB-IIB in FIG. 2A, and FIG. 2C is a cross-sectional view taken along the line IIC-IIC in FIG.
A resin molded body 100 generally referred to as a connector includes a plurality of connecting conductors 2a to 2c and resin portions 11 that cover the connecting conductors 2a to 2c in a state where both ends of each of the connecting conductors 2a to 2c are exposed. And have. The resin molded body 100 has several to several tens of connection conductors 2a to 2c. In the following embodiment, the connection conductors 2a to 2c are described as three. The connecting conductors 2a to 2c will be described as connecting conductors 2 as appropriate.

接続用導体２ａ〜２ｃは、ほぼ等間隔に、平面的に、換言すれば、二次元的に配列されている。図２（Ａ）に図示されるように、接続用導体２ａ〜２ｃの長手方向（Ｘ方向）の一端部は、タイバー３により連結されており、接続用導体２ａ〜２ｃの長手方向（Ｘ方向）の他端部には端子部５ａ〜５ｃが形成されている。接続用導体２ａ〜２ｃおよびタイバー３は、金属製部材をプレス加工して一体に成形される。以下では、タイバー３と接続用導体２ａ〜２ｃとが一体の部材をタイバー付接続用導体３０という。
なお、Ｘ方向、Ｙ方向、Ｚ方向は、それぞれ、各図に図示の通りである。 The connection conductors 2a to 2c are arranged in a plane, in other words, in a two-dimensional manner, at almost equal intervals. As shown in FIG. 2A, one end of the connecting conductors 2a to 2c in the longitudinal direction (X direction) is connected by a tie bar 3, and the connecting conductors 2a to 2c have a longitudinal direction (X direction). ) Are formed with terminal portions 5a to 5c. The connecting conductors 2a to 2c and the tie bar 3 are integrally formed by pressing a metal member. Hereinafter, a member in which the tie bar 3 and the connection conductors 2a to 2c are integrated is referred to as a connection conductor 30 with a tie bar.
The X direction, the Y direction, and the Z direction are as shown in each drawing.

樹脂成形体１００は、インサート射出成形等のモールド成形により形成される。接続用導体２ａ〜２ｃの配列方向（Ｙ方向）の樹脂部１１の一側面１１ａにはゲート痕８ａが形成されている。ゲート痕８ａが形成された樹脂部１１の一側面１１ａに最も近い接続用導体２ａには、タイバー３に連結された一端部側に変形抑制部１４が形成されている。変形抑制部１４は、接続用導体２の配列方向（Ｙ方向）に突出する突出部として形成されている。突出部は、ゲート痕８ａが形成された樹脂部１１の一側面１１ａ側に突出している。図１に図示されるように、変形抑制部１４の一部は、樹脂部１１のタイバー３側に位置する一端面１１ｂから露出している。後述する如く、変形抑制部１４の残部は、樹脂部１１に覆われている。換言すれば、変形抑制部１４の他の一部は、樹脂部１１内に埋没している。変形抑制部１４、すなわち、突出部の一部と残部とは、連続する一体部分として形成されている。各接続用導体２ａ〜２ｃは、変形抑制部１４とタイバー３との間で樹脂部１１の一端面１１ｂに平行な二点鎖線の位置で切断され、タイバー３が切り落とされる。タイバー３が除去されることによりコネクタが得られる。なお、以下では、樹脂部１１の一端面１１ｂ側を前方、反対側を後方とする。 The resin molded body 100 is formed by molding such as insert injection molding. A gate mark 8a is formed on one side surface 11a of the resin portion 11 in the arrangement direction (Y direction) of the connection conductors 2a to 2c. On the connection conductor 2a closest to the one side surface 11a of the resin portion 11 where the gate mark 8a is formed, a deformation suppressing portion 14 is formed on one end portion side connected to the tie bar 3. The deformation suppressing portion 14 is formed as a protruding portion that protrudes in the arrangement direction (Y direction) of the connecting conductors 2. The protruding portion protrudes toward the one side surface 11a of the resin portion 11 where the gate mark 8a is formed. As shown in FIG. 1, a part of the deformation suppressing portion 14 is exposed from one end face 11 b of the resin portion 11 located on the tie bar 3 side. As will be described later, the remaining portion of the deformation suppressing portion 14 is covered with the resin portion 11. In other words, the other part of the deformation suppressing portion 14 is buried in the resin portion 11. The deformation suppressing portion 14, that is, a part of the protruding portion and the remaining portion are formed as a continuous integral portion. Each of the connecting conductors 2a to 2c is cut between the deformation suppressing portion 14 and the tie bar 3 at a position of a two-dot chain line parallel to the one end surface 11b of the resin portion 11, and the tie bar 3 is cut off. A connector is obtained by removing the tie bar 3. In addition, below, let the one end surface 11b side of the resin part 11 be the front, and let the other side be back.

接続用導体２、すなわちタイバー付接続用導体３０は、例えば、銅、鉄、鉛などの金属により形成される。または、接続用導体２は、樹脂やセラミックス等に導電性微粒子が混入され全体が導電性を有する材料により形成することもできる。あるいは、接続用導体２は、絶縁性部材の表面に金、ニッケル、亜鉛などの導電性金属がめっきされた部材であってもよい。
樹脂部１１は、例えば、エポキシ樹脂やフェノール樹脂等の熱硬化性樹脂、ポリカーボネート、ポリエチレンテレフタレート等の熱可塑性樹脂により形成することができる。あるいは、樹脂部１１は、樹脂中にガラスやマイカなどの絶縁性微粒子が混入された材料により形成することもできる。 The connection conductor 2, that is, the connection conductor 30 with a tie bar is formed of a metal such as copper, iron, or lead. Alternatively, the connection conductor 2 can be formed of a material in which conductive fine particles are mixed in resin, ceramics, or the like and the whole has conductivity. Alternatively, the connection conductor 2 may be a member in which a conductive metal such as gold, nickel, or zinc is plated on the surface of the insulating member.
The resin part 11 can be formed of, for example, a thermosetting resin such as an epoxy resin or a phenol resin, or a thermoplastic resin such as polycarbonate or polyethylene terephthalate. Alternatively, the resin portion 11 can be formed of a material in which insulating fine particles such as glass and mica are mixed in the resin.

接続用導体２ａの変形抑制部１４は、接続用導体２の配列方向（Ｙ方向）に突出する突出部とされているために、変形抑制部１４の配列方向（Ｙ方向）の断面積は、変形抑制部１４以外の部分より大きくなっている。また、変形抑制部１４を有する接続用導体２ａは、変形抑制部１４を有していない接続用導体２ｂ、２ｃよりも変形がし難くなっている。 Since the deformation suppressing portion 14 of the connecting conductor 2a is a protruding portion that protrudes in the arrangement direction (Y direction) of the connecting conductor 2, the cross-sectional area of the deformation suppressing portion 14 in the arrangement direction (Y direction) is: It is larger than the portion other than the deformation suppressing portion 14. Further, the connecting conductor 2 a having the deformation suppressing portion 14 is less likely to be deformed than the connecting conductors 2 b and 2 c not having the deformation suppressing portion 14.

上金型６および下金型７は、矩形形状の周側壁を有する。上・金型６、７の長手方向（Ｘ方向）の長さは、接続用導体２の長手方向（Ｘ方向）の全長より短い。図２（Ｃ）に図示されるように、上金型６には上部壁が形成され、下金型７には下部壁が形成されている。図２（Ａ）、（Ｃ）に図示されるように、上金型６の上部壁と周側壁で囲まれる内部、および下金型７の下部壁と周側壁で囲まれる内部は空洞部９とされている。下金型７の一側壁１８には、ゲート用開口８が設けられている。上・下金型６、７の空洞部９に対応する領域は、接続用導体２ａ〜２ｃが樹脂部１１内に埋没する埋没部４ａ〜４ｂとなる。
図２（Ｃ）に図示されるように、接続用導体２ａ〜２ｃの埋没部４ａ〜４ｃおよびゲート用開口８は、平面的、換言すれば、二次元的に配置されている。従って、樹脂成形体１００は、接続用導体２ａ〜２ｃの埋没部４ａ〜４ｃおよびゲート用開口８が平面的に配置された構造となる。 The upper mold 6 and the lower mold 7 have rectangular peripheral side walls. The length of the upper molds 6 and 7 in the longitudinal direction (X direction) is shorter than the total length of the connecting conductor 2 in the longitudinal direction (X direction). As shown in FIG. 2C, the upper mold 6 has an upper wall and the lower mold 7 has a lower wall. As shown in FIGS. 2A and 2C, the interior surrounded by the upper wall and the peripheral side wall of the upper mold 6 and the interior surrounded by the lower wall and the peripheral side wall of the lower mold 7 are hollow portions 9. It is said that. A gate opening 8 is provided on one side wall 18 of the lower mold 7. Regions corresponding to the hollow portions 9 of the upper and lower molds 6 and 7 become buried portions 4 a to 4 b in which the connection conductors 2 a to 2 c are buried in the resin portion 11.
As shown in FIG. 2C, the buried portions 4a to 4c and the gate openings 8 of the connection conductors 2a to 2c are arranged in a plane, in other words, two-dimensionally. Therefore, the resin molded body 100 has a structure in which the buried portions 4a to 4c of the connection conductors 2a to 2c and the gate opening 8 are arranged in a plane.

モールド成形を行うには、タイバー付接続用導体３０を上金型６と下金型７との間に固定する。詳細には、接続用導体２ａ〜２ｃを下金型７の前後方側の側壁に形成された凹部内に収容する。このとき、変形抑制部１４を有する接続用導体２ａが、下金型７のゲート用開口８を有する一側壁１８に対面した状態とする。つまり、接続用導体２ａ〜２ｃの中で、変形抑制部１４を有する接続用導体２ａが接続用導体２の配列方向（Ｙ方向）において下金型７のゲート用開口８に最も近い位置にする。
この状態では、図２（Ａ）に図示されるように、変形抑制部１４の一部は、上・下金型６、７の前方側の側壁上に位置し、変形抑制部１４の残部は、上・下金型６、７の空洞部９に、所定長延在される。また、接続用導体２ａの変形抑制部１４は、下金型７のゲート用開口８を有する一側壁１８側に向いて突出している。 In order to perform molding, the connecting conductor 30 with tie bar is fixed between the upper mold 6 and the lower mold 7. Specifically, the connecting conductors 2 a to 2 c are accommodated in a recess formed on the front-rear side wall of the lower mold 7. At this time, the connection conductor 2 a having the deformation suppressing portion 14 is in a state of facing one side wall 18 having the gate opening 8 of the lower mold 7. That is, among the connecting conductors 2 a to 2 c, the connecting conductor 2 a having the deformation suppressing portion 14 is positioned closest to the gate opening 8 of the lower mold 7 in the arrangement direction (Y direction) of the connecting conductor 2. .
In this state, as shown in FIG. 2A, a part of the deformation suppressing portion 14 is located on the side wall on the front side of the upper and lower molds 6 and 7, and the remaining portion of the deformation suppressing portion 14 is The upper and lower molds 6 and 7 are extended to the cavity 9 by a predetermined length. Further, the deformation suppressing portion 14 of the connecting conductor 2 a protrudes toward the one side wall 18 having the gate opening 8 of the lower mold 7.

図３（Ａ）、（Ｂ）は、図２（Ａ）〜（Ｃ）において、樹脂の注入が始まった状態を示す図であり、図３（Ａ）は、図２（Ａ）に対応し、図３（Ｂ）は、図２（Ｃ）に対応する。
樹脂成形体１００は、不図示の射出成型機により、成形用樹脂１０をゲート用開口８から上・下金型６、７の空洞部９内に充填することにより形成される。上・下金型６、７のゲート用開口８から成形用樹脂１０を注入すると、成形用樹脂１０は、空洞部９内を流動して変形抑制部１４を有する接続用導体２ａの埋没部４ａに衝突する。接続用導体２ａの埋没部４ａに衝突した成形用樹脂１０は、図３（Ｂ）に図示されるように、接続用導体２ａの埋没部４ａを迂回するように空洞部９内を流動して、接続用導体２ｂ、２ｃの埋没部４ｂ、４ｃに衝突する。 3 (A) and 3 (B) are views showing a state in which resin injection has started in FIGS. 2 (A) to 2 (C), and FIG. 3 (A) corresponds to FIG. 2 (A). 3 (B) corresponds to FIG. 2 (C).
The resin molded body 100 is formed by filling the molding resin 10 into the hollow portions 9 of the upper and lower molds 6 and 7 from the gate opening 8 by an injection molding machine (not shown). When the molding resin 10 is injected from the gate openings 8 of the upper and lower molds 6 and 7, the molding resin 10 flows in the cavity 9 and the buried portion 4 a of the connecting conductor 2 a having the deformation suppressing portion 14. Collide with. As shown in FIG. 3B, the molding resin 10 that has collided with the buried portion 4a of the connecting conductor 2a flows in the hollow portion 9 so as to bypass the buried portion 4a of the connecting conductor 2a. , Colliding with the buried portions 4b and 4c of the connecting conductors 2b and 2c.

成形用樹脂１０が接続用導体２ａの埋没部４ａに衝突する状態では、成形用樹脂１０による成形速度および成形圧力は大きい。しかし、接続用導体２ａには、接続用導体２の配列方向（Ｙ方向）における断面積が大きくされた変形抑制部１４が形成されており、この変形抑制部１４が下金型７により支持されている。これにより、接続用導体２ａの埋没部４ａは剛性が大きくされている。この結果、接続用導体２ａの埋没部４ａは、成形樹脂の負荷による変形が抑制される。 In a state where the molding resin 10 collides with the buried portion 4a of the connecting conductor 2a, the molding speed and molding pressure by the molding resin 10 are large. However, the connection conductor 2 a is formed with a deformation suppression portion 14 having a large cross-sectional area in the arrangement direction (Y direction) of the connection conductor 2, and the deformation suppression portion 14 is supported by the lower mold 7. ing. As a result, the buried portion 4a of the connecting conductor 2a has increased rigidity. As a result, the buried portion 4a of the connecting conductor 2a is prevented from being deformed by the load of the molding resin.

成形用樹脂１０は、接続用導体２ａの埋没部４ａに衝突することにより、その成形速度および成形圧力が低減される。つまり、接続用導体２ｂ、２ｃの埋没部４ｂ、４ｃに衝突する際の成形用樹脂１０の成形速度および成形圧力は、接続用導体２ａの埋没部４ａに衝突する際の成形速度および成形圧力よりも低減している。このため、接続用導体２ｂ、２ｃの埋没部４ｂ、４ｃは、成形時の負荷による変形が抑制される。 When the molding resin 10 collides with the buried portion 4a of the connecting conductor 2a, its molding speed and molding pressure are reduced. That is, the molding speed and molding pressure of the molding resin 10 when colliding with the buried portions 4b and 4c of the connecting conductors 2b and 2c are higher than the molding speed and molding pressure when colliding with the buried portion 4a of the connecting conductor 2a. Has also been reduced. For this reason, the buried portions 4b and 4c of the connection conductors 2b and 2c are suppressed from being deformed by a load during molding.

図４（Ａ）、（Ｂ）は、比較品の樹脂成形体のモールド成形の状態を示す図である。
比較品の樹脂成形体では、接続用導体２は、すべて、変形抑制部１４を有していない、同一の構造の部材とされている。つまり、比較品の樹脂成形体における接続用導体２は、本発明の第１の実施形態における接続用導体２ｂ、２ｃと同一の構造を有する。
比較品では、上金型６における接続用導体２の配列方向（Ｙ方向）のほぼ中央部にゲート用開口８が形成されている。つまり、接続用導体２の配列方向（Ｙ方向）における中央の接続用導体２の埋没部４に対向する位置にゲート用開口８が設けられている。 FIGS. 4A and 4B are views showing a state of molding of a comparative resin molding.
In the comparative resin molded body, all the connecting conductors 2 are members having the same structure that do not have the deformation suppressing portion 14. That is, the connection conductor 2 in the comparative resin molded body has the same structure as the connection conductors 2b and 2c in the first embodiment of the present invention.
In the comparative product, a gate opening 8 is formed at a substantially central portion in the arrangement direction (Y direction) of the connection conductors 2 in the upper mold 6. That is, the gate opening 8 is provided at a position facing the buried portion 4 of the central connection conductor 2 in the arrangement direction (Y direction) of the connection conductors 2.

比較品において、ゲート用開口８から上・下金型６、７の空洞部９内に注入された成形用樹脂１０は、その一部が接続用導体２の配列方向（Ｙ方向）における中央の接続用導体２の埋没部４に衝突する。このとき、同時に、成形用樹脂１０の他の一部が、他の２つの接続用導体２の埋没部４にも衝突する。このため、すべての接続用導体２の埋没部４に衝突する成形用樹脂１０の成形速度および成形圧力は大きい。しかも、比較品の接続用導体２のいずれにも、変形抑制部１４は形成されていない。従って、比較品の樹脂成形体においては、各接続用導体２の埋没部４は変形されやすい。 In the comparative product, a part of the molding resin 10 injected into the hollow portions 9 of the upper and lower molds 6 and 7 from the gate opening 8 is the center in the arrangement direction (Y direction) of the connecting conductors 2. It collides with the buried portion 4 of the connecting conductor 2. At the same time, another part of the molding resin 10 collides with the buried portions 4 of the other two connection conductors 2. For this reason, the molding speed and molding pressure of the molding resin 10 that collides with the buried portions 4 of all the connecting conductors 2 are large. Moreover, the deformation suppressing portion 14 is not formed on any of the comparative connection conductors 2. Therefore, in the comparative resin molded body, the buried portion 4 of each connection conductor 2 is easily deformed.

上記第１の実施形態によれば下記の効果を奏する。
（１）樹脂成形体１００は、複数の接続用導体２ａ〜２ｃと、該接続用導体２ａ〜２ｃを覆う樹脂部１１を備えており、接続用導体２ａ〜２ｃの配列方向（Ｙ方向）において、ゲート痕８ａが形成された樹脂部１１の一側面１１ａに最も近い接続用導体２ａは、樹脂部１１から露出する部分と、樹脂部１１内に埋没する部分とを有する変形抑制部１４を備え、変形抑制部１４の接続用導体２ａ〜２ｃの配列方向（Ｙ方向）における断面積は、他の接続用導体２ｂ、２ｃの配列方向（Ｙ方向）における断面積よりも大きく形成されている。このため、樹脂部１１をモールド成形する際の成形用樹脂１０の負荷による接続用導体２ａの変形を抑制することができる。また、成形用樹脂１０が接続用導体２ａに衝突することにより接続用導体２ｂ、２ｃに対する成形用樹脂１０による負荷が低減するので、モールド成形の際の接続用導体２ｂ、２ｃの変形を抑制することができる。この結果、モールド成形の際の、すべての接続用導体２ａ〜２ｃの変形を抑制することができる。 According to the first embodiment, the following effects can be obtained.
(1) The resin molded body 100 includes a plurality of connecting conductors 2a to 2c and a resin portion 11 that covers the connecting conductors 2a to 2c, and in the arrangement direction (Y direction) of the connecting conductors 2a to 2c. The connecting conductor 2a closest to one side surface 11a of the resin part 11 where the gate mark 8a is formed includes a deformation suppressing part 14 having a part exposed from the resin part 11 and a part buried in the resin part 11. The cross-sectional area in the arrangement direction (Y direction) of the connection conductors 2a to 2c of the deformation suppressing portion 14 is formed larger than the cross-sectional area in the arrangement direction (Y direction) of the other connection conductors 2b and 2c. For this reason, deformation of the connecting conductor 2a due to the load of the molding resin 10 when molding the resin portion 11 can be suppressed. Further, since the molding resin 10 collides with the connection conductor 2a, the load on the connection conductors 2b and 2c due to the molding resin 10 is reduced, so that deformation of the connection conductors 2b and 2c during molding is suppressed. be able to. As a result, it is possible to suppress deformation of all the connecting conductors 2a to 2c during molding.

（２）接続用導体２ａの変形抑制部１４は、単に、接続用導体２ａ〜２ｃの配列方向（Ｙ方向）に突出する突出部を有する構造である。このため、構造が簡素となり、安価にすることができる。また、接続用導体２ａの変形抑制部１４、およびすべての接続用導体２ａ〜２ｃの両端部側を、上・下金型６、７により挟んで固定するだけで、モールド成形することができる。従って、上・下金型６、７の構造が簡素となり、また、成形作業を効率的に行うことができる。 (2) The deformation suppressing portion 14 of the connecting conductor 2a is simply a structure having a protruding portion that protrudes in the arrangement direction (Y direction) of the connecting conductors 2a to 2c. For this reason, the structure is simplified and the cost can be reduced. Moreover, it is possible to perform molding by simply sandwiching and fixing the deformation suppressing portion 14 of the connecting conductor 2a and both end portions of all the connecting conductors 2a to 2c between the upper and lower molds 6 and 7. Therefore, the structure of the upper and lower molds 6 and 7 is simplified, and the molding operation can be performed efficiently.

（３）接続用導体２ａ〜２ｃの配列方向（Ｙ方向）に突出する突出部として形成された変形抑制部１４を、ゲート痕８ａが形成された樹脂部１１の一側面１１ａに最も近い接続用導体２ａのみに設けた。このため、樹脂成形体１００の接続用導体２ａ〜２ｃの配列方向（Ｙ方向）のサイズを小さくすることができる。 (3) For connecting the deformation suppressing portion 14 formed as a protruding portion protruding in the arrangement direction (Y direction) of the connecting conductors 2a to 2c, closest to the one side surface 11a of the resin portion 11 on which the gate mark 8a is formed. It was provided only on the conductor 2a. For this reason, the size of the arrangement direction (Y direction) of the connection conductors 2a to 2c of the resin molded body 100 can be reduced.

（４）接続用導体２ａの変形抑制部１４を、ゲート痕８ａが形成された樹脂部１１の一側面１１ａ側に向けて突出した。この構造は、変形抑制部１４を、隣接の接続用導体２ｂ側に向けて突出する構造に比し、短絡が生じる可能性を低減することができる。 (4) The deformation suppressing portion 14 of the connecting conductor 2a protrudes toward the one side surface 11a of the resin portion 11 where the gate mark 8a is formed. This structure can reduce the possibility that a short circuit will occur as compared with a structure in which the deformation suppressing portion 14 protrudes toward the adjacent connecting conductor 2b.

−第２の実施形態−
図５は、本発明の樹脂成形体の第２の実施形態を示す。図５（Ａ）〜図５（Ｃ）は、樹脂成形体のモールド成形状態を示す断面図であり、図５（Ａ）は、図５（Ｂ）のＶA―ＶA線断面図、図５（Ｂ）は、図５（Ａ）のＶB−ＶB線断面図、図５（Ｃ）は、図５（Ａ）のＶC−ＶC線断面図である。
第２の実施形態の樹脂成形体では、変形抑制部１４Ａが、接続用導体２ａの厚さ方向（Ｚ方向）に突出する突出部として形成されている。
第１の実施形態と同様、接続用導体２ａ〜２ｃの配列方向（Ｙ方向）において、ゲート用開口８が形成された下金型７の一側壁１８に最も近い接続用導体２ａには、変形抑制部１４Ａが形成されている。変形抑制部１４Ａは、図５（Ｂ）に図示されるように、他の接続用導体２ｂ、２ｃよりも下金型７の下部壁側に突出する突出部を有する構造とされている。つまり、変形抑制部１４Ａは、接続用導体２ａの厚さ方向（Ｚ方向）に突出している。 -Second Embodiment-
FIG. 5 shows a second embodiment of the resin molded body of the present invention. 5 (A) to 5 (C) are cross-sectional views showing the molded state of the resin molded body, and FIG. 5 (A) is a cross-sectional view taken along the line VA-VA in FIG. 5 (B). 5B is a cross-sectional view taken along the line VB-VB in FIG. 5A, and FIG. 5C is a cross-sectional view taken along the line VC-VC in FIG.
In the resin molded body of the second embodiment, the deformation suppressing portion 14A is formed as a protruding portion that protrudes in the thickness direction (Z direction) of the connecting conductor 2a.
As in the first embodiment, in the arrangement direction (Y direction) of the connection conductors 2a to 2c, the connection conductor 2a closest to the one side wall 18 of the lower mold 7 in which the gate opening 8 is formed is deformed. A suppressing portion 14A is formed. As shown in FIG. 5B, the deformation suppressing portion 14 </ b> A has a structure having a protruding portion that protrudes toward the lower wall side of the lower mold 7 with respect to the other connecting conductors 2 b and 2 c. That is, the deformation suppressing portion 14A protrudes in the thickness direction (Z direction) of the connecting conductor 2a.

第２の実施形態における変形抑制部１４Ａは、接続用導体２ａの他の部分、および接続用導体２ｂ、２ｃよりも接続用導体２ａ〜２ｃの配列方向（Ｙ方向）における断面積が大きくなっている。
第２の実施形態の他の構造は、第１の実施形態と同様であり、対応する部材に同一の符号を付して説明を省略する。 The deformation suppressing portion 14A in the second embodiment has a larger cross-sectional area in the arrangement direction (Y direction) of the connection conductors 2a to 2c than the other portions of the connection conductor 2a and the connection conductors 2b and 2c. Yes.
Other structures of the second embodiment are the same as those of the first embodiment, and the corresponding members are denoted by the same reference numerals and description thereof is omitted.

第２の実施形態においても、第１の実施形態の効果（１）、（２）と同様な効果を奏する。
また、第２の実施形態では、変形抑制部１４Ａが、接続用導体２ａの厚さ方向（Ｚ方向）に突出しているので、第１の実施形態と同様、樹脂成形体１００の接続用導体２ａ〜２ｃの配列方向（Ｙ方向）のサイズを小さくし、かつ、隣接する接続用導体２ｂとの短絡の発生を抑制することができる。 Also in the second embodiment, the same effects as the effects (1) and (2) of the first embodiment are obtained.
Further, in the second embodiment, the deformation suppressing portion 14A protrudes in the thickness direction (Z direction) of the connecting conductor 2a. Therefore, as in the first embodiment, the connecting conductor 2a of the resin molded body 100 is used. The size in the arrangement direction (Y direction) of ˜2c can be reduced, and the occurrence of a short circuit with the adjacent connection conductor 2b can be suppressed.

−第３の実施形態−
図６は、本発明の樹脂成形体の第３の実施形態を示す。図６（Ａ）〜図６（Ｃ）は、樹脂成形体のモールド成形状態を示す断面図であり、図６（Ａ）は、図６（Ｂ）のＶＩA―ＶＩA線断面図、図６（Ｂ）は、図６（Ａ）のＶＩB−ＶＩB線断面図、図６（Ｃ）は、図６（Ａ）のＶＩC−ＶＩC線断面図である。
第３の実施形態の樹脂成形体では、変形抑制部１４Ｂが、接続用導体２ａ〜２ｃの配列方向（Ｙ方向）と接続用導体２ａの厚さ方向（Ｚ方向）との両方向に突出する突出部として形成されている。
第１の実施形態と同様、接続用導体２ａ〜２ｃの配列方向（Ｙ方向）において、ゲート用開口８が形成された下金型７の一側壁１８に最も近い接続用導体２ａには、変形抑制部１４Ｂが形成されている。図６（Ｂ）に図示されるように、変形抑制部１４Ｂは、他の接続用導体２ｂ、２ｃよりも接続用導体２ａ〜２ｃの配列方向（Ｙ方向）における長さ、換言すれば、幅が大きい。また、変形抑制部１４Ｂは、他の接続用導体２ｂ、２ｃよりも厚さ方向（Ｚ方向に）に突出している。 -Third embodiment-
FIG. 6 shows a third embodiment of the resin molded body of the present invention. 6A to 6C are cross-sectional views showing a molded state of the resin molded body, and FIG. 6A is a cross-sectional view taken along the line VIA-VIA in FIG. 6B is a cross-sectional view taken along the line VIB-VIB in FIG. 6A, and FIG. 6C is a cross-sectional view taken along the line VIC-VIC in FIG.
In the resin molded body of the third embodiment, the deformation suppressing portion 14B protrudes in both the arrangement direction (Y direction) of the connection conductors 2a to 2c and the thickness direction (Z direction) of the connection conductor 2a. It is formed as a part.
As in the first embodiment, in the arrangement direction (Y direction) of the connection conductors 2a to 2c, the connection conductor 2a closest to the one side wall 18 of the lower mold 7 in which the gate opening 8 is formed is deformed. The suppression part 14B is formed. As shown in FIG. 6B, the deformation suppressing portion 14B has a length in the arrangement direction (Y direction) of the connection conductors 2a to 2c rather than the other connection conductors 2b and 2c, in other words, a width. Is big. Moreover, the deformation | transformation suppression part 14B protrudes in the thickness direction (Z direction) rather than the other connection conductors 2b and 2c.

従って、第３の実施形態における変形抑制部１４Ｂは、接続用導体２ａの他の部分、および接続用導体２ｂ、２ｃよりも接続用導体２ａ〜２ｃの配列方向（Ｙ方向）における断面積が大きくなっている。
第３の実施形態の他の構造は、第１の実施形態と同様であり、対応する部材に同一の符号を付して説明を省略する。 Accordingly, the deformation suppressing portion 14B in the third embodiment has a larger cross-sectional area in the arrangement direction (Y direction) of the connection conductors 2a to 2c than the other portions of the connection conductor 2a and the connection conductors 2b and 2c. It has become.
Other structures of the third embodiment are the same as those of the first embodiment, and the corresponding members are denoted by the same reference numerals and description thereof is omitted.

第３の実施形態においても、第１の実施形態の効果（１）〜（４）と同様な効果を奏する。
第３の実施形態では、変形抑制部１４Ｂは、接続用導体２ａ〜２ｃの配列方向（Ｙ方向）と接続用導体２の厚さ方向（Ｚ方向）との両方向に突出する構造を有する。このため、変形抑制部１４Ｂの接続用導体２ａ〜２ｃの配列方向（Ｙ方向）における断面積をより大きくすることができる。これにより、樹脂部１１をモールド成形する際の成形用樹脂１０の負荷による接続用導体２ａの変形の抑制効果を一層高めることができる。 Also in the third embodiment, the same effects as the effects (1) to (4) of the first embodiment are obtained.
In 3rd Embodiment, the deformation | transformation suppression part 14B has a structure which protrudes in both directions of the arrangement direction (Y direction) of the connection conductors 2a-2c, and the thickness direction (Z direction) of the connection conductor 2. As shown in FIG. For this reason, the cross-sectional area in the arrangement direction (Y direction) of the connection conductors 2a to 2c of the deformation suppressing portion 14B can be further increased. Thereby, the suppression effect of the deformation | transformation of the connection conductor 2a by the load of the molding resin 10 at the time of molding the resin part 11 can be heightened further.

−第４の実施形態−
図７は、本発明の樹脂成形体の第４の実施形態であり、樹脂成形体のモールド成形状態を示す断面図である。
第４の実施形態の樹脂成形体では、接続用導体２ａ〜２ｃが、タイバー３に連結される前方側と、後方側の端子部５ａ〜５ｃとで、異なるピッチとされている。
第１の実施形態と同様、接続用導体２ａ〜２ｃの配列方向（Ｙ方向）において、ゲート用開口８が形成された下金型７の一側面に最も近い接続用導体２ａには、変形抑制部１４が形成されている。
変形抑制部１４が形成された接続用導体２ａは、埋没部４ａの中間でゲート用開口８が形成された下金型７の一側壁１８側にＬ字形状に屈曲され、さらに、Ｌ字形状に屈曲されて下金型７の後方側の側壁から外部に突出するように延在されている。接続用導体２ｃは、埋没部４ｃの中間でゲート用開口８が形成された下金型７の一側壁１８とは反対側の他側壁側にＬ字形状に屈曲され、さらに、Ｌ字形状に屈曲されて下金型７の後方側の側壁から外部に突出するように延在されている。 -Fourth Embodiment-
FIG. 7 is a cross-sectional view showing a molded state of the resin molded body according to the fourth embodiment of the resin molded body of the present invention.
In the resin molded body of the fourth embodiment, the connecting conductors 2a to 2c have different pitches on the front side connected to the tie bar 3 and on the rear side terminal portions 5a to 5c.
As in the first embodiment, in the arrangement direction (Y direction) of the connection conductors 2a to 2c, the connection conductor 2a closest to one side surface of the lower mold 7 in which the gate opening 8 is formed is suppressed in deformation. A portion 14 is formed.
The connecting conductor 2a in which the deformation suppressing portion 14 is formed is bent in an L shape on the side of the one side wall 18 of the lower mold 7 in which the gate opening 8 is formed in the middle of the buried portion 4a. And is extended so as to protrude from the rear side wall of the lower mold 7 to the outside. The connecting conductor 2c is bent in an L shape on the other side wall side opposite to the one side wall 18 of the lower mold 7 in which the gate opening 8 is formed in the middle of the buried portion 4c, and further in an L shape. It is bent and extends so as to protrude from the rear side wall of the lower mold 7 to the outside.

これにより、接続用導体２ａ〜２ｃの、タイバー３に連結される前方側のピッチは、後方側の端子部５ａ〜５ｃのピッチより小さくなっている。
図７に図示されるように、変形抑制部１４は、接続用導体２ａにおける、ピッチが狭い前方側に形成されている。接続用導体２ａ〜２ｃの変形はピッチが狭い場合に、短絡等の悪影響を発生する。このため、接続用導体２ａの変形抑制部１４をピッチが狭い側に設けることにより、接続用導体２ａ〜２ｃの変形抑制の効果を顕著に受けることができる。
第４の実施形態の他の構造は、第１の実施形態と同様であり、対応する部材に同一の符号を付して説明を省略する。 Thereby, the pitch of the front side connected to the tie bar 3 of the connecting conductors 2a to 2c is smaller than the pitch of the terminal portions 5a to 5c on the rear side.
As illustrated in FIG. 7, the deformation suppressing portion 14 is formed on the front side with a narrow pitch in the connecting conductor 2 a. The deformation of the connection conductors 2a to 2c causes an adverse effect such as a short circuit when the pitch is narrow. For this reason, by providing the deformation suppressing portion 14 of the connecting conductor 2a on the narrow pitch side, the effect of suppressing the deformation of the connecting conductors 2a to 2c can be remarkably received.
Other structures of the fourth embodiment are the same as those of the first embodiment, and the corresponding members are denoted by the same reference numerals and description thereof is omitted.

第４の実施形態においても、第１の実施形態の効果（１）〜（４）と同様な効果を奏する。
第４の実施形態の樹脂成形体は、接続端子部のピッチが異なる機器を接続する接続器、つまりコネクタとして適用することができる。 Also in the fourth embodiment, the same effects as the effects (1) to (4) of the first embodiment are obtained.
The resin molded body of the fourth embodiment can be applied as a connector that connects devices having different pitches of connection terminal portions, that is, a connector.

なお、第４の実施形態では、接続用導体２ａの変形抑制部１４を、実施形態１と同様、接続用導体２ａ〜２ｃの配列方向（Ｙ方向）に突出する構造として例示した。しかし、接続用導体２ａの変形抑制部１４を、第２の実施形態と同様、接続用導体２の厚さ方向（Ｚ方向）に突出したり、第３の実施形態と同様、接続用導体２ａ〜２ｃの配列方向（Ｙ方向）と接続用導体２の厚さ方向（Ｚ方向）との両方向に突出したりするようにしてもよい。 In the fourth embodiment, the deformation suppressing portion 14 of the connecting conductor 2a is exemplified as a structure protruding in the arrangement direction (Y direction) of the connecting conductors 2a to 2c, as in the first embodiment. However, the deformation suppressing portion 14 of the connection conductor 2a protrudes in the thickness direction (Z direction) of the connection conductor 2 as in the second embodiment, or the connection conductors 2a to 2b as in the third embodiment. Alternatively, it may protrude in both directions of the arrangement direction (Y direction) of 2c and the thickness direction (Z direction) of the connecting conductor 2.

−第５の実施形態−
図８（Ａ）〜（Ｃ）は、本発明の樹脂成形体の第５の実施形態を示し、図８（Ａ）は正面図、図８（Ｂ）は上面図、図８（Ｃ）は右側面図である。図９（Ａ）〜（Ｃ）は、図８に図示された樹脂成形体のモールド成形状態を示す断面図であり、図９（Ａ）は正面図、図９（Ｂ）は図９（Ａ）のＩＸB−ＩＸB線断面図、図９（Ｃ）は、図９（Ｂ）のＩＸC−ＩＸC線断面図である。
第５の実施形態として示す樹脂成形体１００では、図９（Ａ）に図示されるように、複数の接続用導体２ａ〜２ｃのそれぞれは、埋没部４ａ〜４ｃの長手方向（Ｘ方向）のほぼ中央部の屈曲部１５で厚さ方向（Ｚ方向）にＬ字形状に屈曲されている。つまり、接続用導体２ａ〜２ｃは、図９（Ａ）において、屈曲部１５の左側部分である水平部分２１と、屈曲部１５の下方部分である垂直部分２２とを有する。樹脂部１１は、埋没部４ａ〜４ｃの全体を覆って、接続用導体２ａ〜２ｃの形状に対応するほぼＬ字形状に形成されている。つまり、樹脂部１１は、接続用導体２ａ〜２ｃの水平部分２１を覆う水平部１２と、接続用導体２ａ〜２ｃの垂直部分２２を覆う垂直部１３とを有する。 -Fifth embodiment-
8A to 8C show a fifth embodiment of the resin molded body of the present invention. FIG. 8A is a front view, FIG. 8B is a top view, and FIG. It is a right view. 9A to 9C are cross-sectional views showing the molded state of the resin molded body shown in FIG. 8, where FIG. 9A is a front view and FIG. 9B is FIG. IXB-IXB sectional view taken along the line IXB-IXB, and FIG. 9C is a sectional view taken along line IXC-IXC in FIG. 9B.
In the resin molded body 100 shown as the fifth embodiment, as shown in FIG. 9A, each of the plurality of connection conductors 2a to 2c is in the longitudinal direction (X direction) of the buried portions 4a to 4c. It is bent in an L shape in the thickness direction (Z direction) at a bent portion 15 at a substantially central portion. That is, the connecting conductors 2 a to 2 c have a horizontal portion 21 that is a left portion of the bent portion 15 and a vertical portion 22 that is a lower portion of the bent portion 15 in FIG. The resin part 11 is formed in a substantially L shape corresponding to the shape of the connecting conductors 2a to 2c so as to cover the entire buried parts 4a to 4c. That is, the resin portion 11 includes a horizontal portion 12 that covers the horizontal portion 21 of the connecting conductors 2a to 2c and a vertical portion 13 that covers the vertical portion 22 of the connecting conductors 2a to 2c.

図８（Ａ）〜（Ｃ）に図示されるように、第１の実施形態と同様、樹脂部１１の接続用導体２ａ〜２ｃの配列方向（Ｙ方向）の一側面１１ａに最も近い接続用導体２ａには、変形抑制部１４が形成されている。
図９（Ａ）〜（Ｃ）に図示されるように、上金型６Ａには、樹脂部１１の水平部１２の上半部に対応する空洞部９ａが形成されている。下金型７Ａには、樹脂部１１の水平部１２の下半部および樹脂部１１の垂直部１３に対応する空洞部９ｂが形成されている。下金型７Ａの空洞部９ｂは、第１の実施形態における下金型７よりも、樹脂部１１の垂直部１３に対応する分だけ、深くなっている。 As shown in FIGS. 8A to 8C, as in the first embodiment, for connection closest to one side surface 11 a of the arrangement direction (Y direction) of the connection conductors 2 a to 2 c of the resin portion 11. A deformation suppressing portion 14 is formed on the conductor 2a.
As illustrated in FIGS. 9A to 9C, the upper mold 6 </ b> A is formed with a hollow portion 9 a corresponding to the upper half portion of the horizontal portion 12 of the resin portion 11. In the lower mold 7A, a hollow portion 9b corresponding to the lower half portion of the horizontal portion 12 of the resin portion 11 and the vertical portion 13 of the resin portion 11 is formed. The cavity 9b of the lower mold 7A is deeper than the lower mold 7 in the first embodiment by an amount corresponding to the vertical part 13 of the resin part 11.

第５の実施形態における接続用導体２ａ〜２ｃは、屈曲部１５で屈曲されたＬ字形状を有しているため、第１〜第４の実施形態における接続用導体２ａ〜２ｃより、その全長が長くなっている。モールド成形時の成形用樹脂１０の流動時の負荷による接続用導体２ａ〜２ｃの変形量は、接続用導体２ａ〜２ｃの全長が長いほど大きくなる。このため、第５の実施形態では、変形抑制部１４を備えていない従来品に対し、変形抑制の効果をより一層大きくすることができる。
第５の実施形態における他の構造は、第１の実施形態と同様であり、対応する部材の同一の符号を付して説明を省略する。 Since the connecting conductors 2a to 2c in the fifth embodiment have an L-shape bent by the bent portion 15, the total length of the connecting conductors 2a to 2c is larger than that of the connecting conductors 2a to 2c in the first to fourth embodiments. Is getting longer. The amount of deformation of the connection conductors 2a to 2c due to the load when the molding resin 10 flows during molding increases as the total length of the connection conductors 2a to 2c increases. For this reason, in 5th Embodiment, the effect of a deformation | transformation suppression can be made still larger with respect to the conventional product which is not equipped with the deformation | transformation suppression part 14. FIG.
Other structures in the fifth embodiment are the same as those in the first embodiment, and the same reference numerals are assigned to corresponding members, and descriptions thereof are omitted.

第５の実施形態においても、第１の実施形態と同様な効果を奏する。
第５の実施形態の樹脂成形体１００は、接続端子部が異なる方向を向いている機器を接続する接続器、つまりコネクタとして適用することができる。 The fifth embodiment also has the same effect as the first embodiment.
The resin molded body 100 according to the fifth embodiment can be applied as a connector that connects devices whose connecting terminal portions face different directions, that is, a connector.

なお、第５の実施形態では、接続用導体２ａの変形抑制部１４を、実施形態１と同様、接続用導体２ａ〜２ｃの配列方向（Ｙ方向）に突出する構造として例示した。しかし、接続用導体２ａの変形抑制部１４を、第２の実施形態と同様、接続用導体２の厚さ方向（Ｚ方向）に突出したり、第３の実施形態と同様、接続用導体２ａ〜２ｃの配列方向（Ｙ方向）と接続用導体２の厚さ方向（Ｚ方向）との両方向に突出したりするようにしてもよい。 In the fifth embodiment, the deformation suppressing portion 14 of the connecting conductor 2a is exemplified as a structure protruding in the arrangement direction (Y direction) of the connecting conductors 2a to 2c, as in the first embodiment. However, the deformation suppressing portion 14 of the connection conductor 2a protrudes in the thickness direction (Z direction) of the connection conductor 2 as in the second embodiment, or the connection conductors 2a to 2b as in the third embodiment. Alternatively, it may protrude in both directions of the arrangement direction (Y direction) of 2c and the thickness direction (Z direction) of the connecting conductor 2.

図１０〜図１９を用いて、本発明の樹脂成形体の評価結果を示す。
第５の実施形態として示す構造の樹脂成形体１００を実施例として評価した。
図１０（Ａ）〜（Ｃ）は、図８（Ａ）〜（Ｃ）に図示された樹脂成形体の接続用導体を模擬した解析モデル図であり、図１０（Ａ）は、図１０（Ｂ）のＸA−ＸA線断面図、図１０（Ｂ）は、図１０（Ａ）のＸB−ＸB線断面図、図１０（Ｃ）は、図１０（Ａ）の右側面図である。
接続用導体２ａ〜２ｃの幅、厚さはそれぞれ、０．６４ｍｍであり、間隙は０．６４ｍｍである。変形抑制部１４の突出し高さは、０．６４ｍｍである。接続用導体２の埋没部４は、水平部分２１および垂直部分２２の長さが共に１４．６８ｍｍである。他の長さは図示の通りである。
図１１（Ａ）、（Ｂ）は、第１のゲート位置における接続用導体を模擬した解析モデル図であり、図１１（Ａ）は正面図、図１１（Ｂ）は、図１１（Ａ）の右側面図である。
すなわち、樹脂部１１の一側面１１ａに形成されたゲート痕８ａは、接続用導体２の厚さ方向（Ｚ方向）において、平面的に配列された接続用導体２ａ〜２ｃと全く重ならないようにずれた位置に形成されている。なお、図１１（Ａ）、（Ｂ）に記載された寸法の単位は「ｍｍ」である。
図１２（Ａ）、（Ｂ）は、第２のゲート位置における接続用導体を模擬した解析モデル図であり、図１２（Ａ）は正面図、図１２（Ｂ）は、図１２（Ａ）の右側面図である。
すなわち、樹脂部１１の一側面１１ａに形成されたゲート痕８ａは、平面的に配列された接続用導体２ａ〜２ｃの面と、接続用導体２の厚さ方向（Ｚ方向）において、同一位置に形成されている。なお、図１２（Ａ）、（Ｂ）に記載された寸法の単位は「ｍｍ」である。 The evaluation result of the resin molding of this invention is shown using FIGS.
The resin molded body 100 having the structure shown as the fifth embodiment was evaluated as an example.
FIGS. 10A to 10C are analysis model diagrams simulating the connecting conductors of the resin molded bodies shown in FIGS. 8A to 8C. FIG. B) is a cross-sectional view taken along line XA-XA, FIG. 10B is a cross-sectional view taken along line XB-XB in FIG. 10A, and FIG. 10C is a right side view of FIG.
Each of the connecting conductors 2a to 2c has a width and thickness of 0.64 mm, and a gap of 0.64 mm. The protruding height of the deformation suppressing portion 14 is 0.64 mm. In the buried portion 4 of the connecting conductor 2, the lengths of the horizontal portion 21 and the vertical portion 22 are both 14.68 mm. Other lengths are as shown.
11A and 11B are analysis model diagrams simulating the connection conductor at the first gate position, FIG. 11A being a front view, and FIG. 11B being FIG. 11A. FIG.
That is, the gate mark 8a formed on the one side surface 11a of the resin portion 11 does not overlap at all with the connection conductors 2a to 2c arranged in a plane in the thickness direction (Z direction) of the connection conductor 2. It is formed at a shifted position. In addition, the unit of the dimension described in FIGS. 11A and 11B is “mm”.
12A and 12B are analysis model diagrams simulating the connection conductor at the second gate position, FIG. 12A is a front view, and FIG. 12B is FIG. FIG.
That is, the gate mark 8a formed on the one side surface 11a of the resin portion 11 is located at the same position in the thickness direction (Z direction) of the connecting conductors 2a to 2c arranged in a plane. Is formed. In addition, the unit of the dimension described in FIGS. 12A and 12B is “mm”.

図１３は、比較品の樹脂成形体の接続用導体を模擬した解析モデル図であり、図１３（Ａ）は、図１３（Ｂ）のＸＩＩＩA−ＸＩＩＩA線断面図、図１３（Ｂ）は、図１３（Ａ）のＸＩＩＩB−ＸＩＩＩB線断面図、図１３（Ｃ）は、図１３（Ａ）の右側面図である。なお、図１３（Ａ）、（Ｂ）に記載された寸法の単位は「ｍｍ」である。
比較品は、要するに、図１０（Ａ）〜（Ｃ）に図示された実施例とは、樹脂部１１の一側面１１ａに最も近い接続用導体２ａに変形抑制部１４が形成されていない点でのみ相違するものである。以下では、混同を回避するために、比較品における樹脂部１１の一側面１１ａに最も近い接続用導体２ａを、適宜、接続用導体２ｒとする。 FIG. 13 is an analysis model diagram simulating a connecting conductor of a comparative resin molded product, FIG. 13A is a cross-sectional view taken along line XIIIA-XIIIA in FIG. 13B, and FIG. FIG. 13A is a cross-sectional view taken along line XIIIB-XIIIB, and FIG. 13C is a right side view of FIG. In addition, the unit of the dimension described in FIGS. 13A and 13B is “mm”.
In short, the comparative product is different from the embodiment shown in FIGS. 10A to 10C in that the deformation suppressing portion 14 is not formed on the connecting conductor 2a closest to the one side surface 11a of the resin portion 11. Only the difference. Hereinafter, in order to avoid confusion, the connection conductor 2a closest to the one side surface 11a of the resin portion 11 in the comparative product is appropriately referred to as a connection conductor 2r.

図１４および図１５は、樹脂部１１を構成する樹脂の物性を示す図であり、図１４は、せん断速度−粘度−温度に関する特性図であり、図１５は、温度−比容積−圧力に関する特性図である。 14 and 15 are diagrams showing physical properties of the resin constituting the resin part 11, FIG. 14 is a characteristic diagram relating to shear rate-viscosity-temperature, and FIG. 15 is a characteristic relating to temperature-specific volume-pressure. FIG.

図には示していないが、接続用導体２は、ヤング率が８０．８ＧＰａであり、ポアソン比が０．３５であり、密度が８．５３ｇ／ｃｍ³ である。
また、成形用樹脂１０の初期温度を２７０℃とし、上・下金型６、７および接続用導体２の温度を８０℃とし、成形用樹脂１０の充填速度を９２０ｃｍ／ｓとした。 Although not shown in the figure, the connecting conductor 2 has a Young's modulus of 80.8 GPa, a Poisson's ratio of 0.35, and a density of 8.53 g / cm ³ .
The initial temperature of the molding resin 10 was 270 ° C., the temperatures of the upper and lower molds 6 and 7 and the connecting conductor 2 were 80 ° C., and the filling speed of the molding resin 10 was 920 cm / s.

以上の条件で、成形用樹脂１０が３０％充填された時点における接続用導体２ａまたは２ｂのＸＹＺ方向における最大変形量を算出し、実施例と比較品とを比較した。
その結果が図１６〜図１９に図示されている。 Under the above conditions, the maximum deformation amount in the XYZ directions of the connecting conductor 2a or 2b when 30% of the molding resin 10 was filled was calculated, and the example and the comparative product were compared.
The results are shown in FIGS.

図１６は、第１のゲート位置における本発明の実施例と比較品とのゲートに最も近い接続用導体２ａの変形量の比較を示す図である。
図１６に示される通り、実施例の接続用導体２ａの最大変形量は、比較品の接続用導体２ｒの最大変形量の６６％であった。
図１７は、第２のゲート位置における本発明の実施形態と比較品とのゲートに最も近い接続用導体の変形量の比較を示す図である。
図１７に示される通り、実施例の接続用導体２ａの最大変形量は、比較品の接続用導体２ｒの最大変形量の６６％であった。
図１６および図１７から、第１のゲート位置の場合でも、第２のゲート位置の場合でも、ゲートに最も近い接続用導体２ａに変形抑制部１４を設けると、接続用導体２ａの最大変形量が抑制される効果を確認することができた。 FIG. 16 is a diagram showing a comparison of the deformation amount of the connection conductor 2a closest to the gate of the embodiment of the present invention and the comparative product at the first gate position.
As shown in FIG. 16, the maximum deformation amount of the connection conductor 2a of the example was 66% of the maximum deformation amount of the comparison connection conductor 2r.
FIG. 17 is a diagram showing a comparison of the deformation amount of the connection conductor closest to the gate of the embodiment of the present invention and the comparative product at the second gate position.
As shown in FIG. 17, the maximum deformation amount of the connection conductor 2a of the example was 66% of the maximum deformation amount of the connection conductor 2r of the comparative product.
16 and 17, when the deformation suppressing portion 14 is provided in the connection conductor 2a closest to the gate in both the first gate position and the second gate position, the maximum deformation amount of the connection conductor 2a. It was possible to confirm the effect of suppressing.

図１８は、１のゲート位置における本発明の実施形態と比較品とのゲートに２番目に近い接続用導体２ｂの変形量の比較を示す図である。
図１８に示される通り、実施例の接続用導体２ｂの最大変形量は、比較品の接続用導体２ｂの最大変形量の１００％であった。つまり、両者に相違はなかった。
図１９は、第２のゲート位置における本発明の実施形態と比較品とのゲートに２番目に近い接続用導体の変形量の比較を示す図である。
図１９に示される通り、実施例の接続用導体２ｂの最大変形量は、比較品の接続用導体２ｂの最大変形量の９１％であった。
図１８および図１９から、ゲートに２番目に近い接続用導体２ｂの最大変形量は、第１のゲート位置の場合には、実施例と比較品とは差異が無く、第２のゲート位置の場合には、実施例は比較品に対して、接続用導体２ｂの最大変形量が抑制される効果を確認することができた。 FIG. 18 is a diagram showing a comparison of the deformation amount of the connection conductor 2b second closest to the gate of the embodiment of the present invention and the comparative product at one gate position.
As shown in FIG. 18, the maximum deformation amount of the connection conductor 2b of the example was 100% of the maximum deformation amount of the connection conductor 2b of the comparative product. That is, there was no difference between the two.
FIG. 19 is a diagram showing a comparison of the deformation amount of the connection conductor second closest to the gate of the embodiment of the present invention and the comparative product at the second gate position.
As shown in FIG. 19, the maximum deformation amount of the connection conductor 2b of the example was 91% of the maximum deformation amount of the connection conductor 2b of the comparative product.
From FIG. 18 and FIG. 19, the maximum deformation amount of the connecting conductor 2b that is second closest to the gate has no difference between the example and the comparative product in the case of the first gate position. In this case, the example could confirm the effect of suppressing the maximum deformation amount of the connecting conductor 2b with respect to the comparative product.

上記を総合すると、第２のゲート位置の場合には、実施例は、ゲートに最も近い接続用導体２ａおよびゲートに２番目に近い接続用導体２ｂのどちらの最大変形量も、比較品よりも抑制することができる。また、第１のゲート位置の場合には、実施例のゲートに最も近い接続用導体２ａの最大変形量を比較品よりも抑制することができるが、実施例のゲートに２番目に近い接続用導体２ｂの最大変形量は、比較品と相違が無い。つまり、第１のゲート位置の場合でも、実施例は、ゲートに２番目に近い接続用導体２ｂの最大変形量を抑制する程ではないにしても、ゲートに最も近い接続用導体２ａの最大変形量を抑制する効果はある。 Summing up the above, in the case of the second gate position, the embodiment shows that the maximum deformation amount of the connection conductor 2a closest to the gate and the connection conductor 2b closest to the gate is larger than that of the comparative product. Can be suppressed. Further, in the case of the first gate position, the maximum deformation amount of the connection conductor 2a closest to the gate of the embodiment can be suppressed as compared with the comparative product, but for the connection closest to the gate of the embodiment. The maximum deformation amount of the conductor 2b is not different from the comparative product. In other words, even in the case of the first gate position, the embodiment does not suppress the maximum deformation amount of the connection conductor 2b closest to the gate, but the maximum deformation of the connection conductor 2a closest to the gate. There is an effect of suppressing the amount.

なお、図１２（Ｂ）において、樹脂部１１の一側面１１ａに形成されたゲート痕８ａと接続用導体２ａ〜２ｃとは、接続用導体２の厚さ方向（Ｚ方向）において、同一位置に配置されている構造として例示した。しかし、ゲート痕８ａや接続用導体２ａ、２ｂ、２ｃは、接続用導体２の厚さ方向（Ｚ方向）における同一位置に配置されていなくてもよい。接続用導体２ａ、２ｂ、２ｃは、矢印Ｌで示すように、ゲート痕８ａ側から接続用導体２ａ〜２ｃの配列方向（Ｙ方向）に平行に投影した場合、各接続用導体２ａ、２ｂ、２ｃは、その一部がゲート痕８ａの、点線で示す射影領域Ｓ_L内に配置されていれば、モールド成形時の負荷による接続用導体２ａ〜２ｃの変形の抑制効果を十分に得ることができる。 In FIG. 12B, the gate mark 8a formed on one side surface 11a of the resin portion 11 and the connection conductors 2a to 2c are at the same position in the thickness direction (Z direction) of the connection conductor 2. The structure is illustrated as an example. However, the gate mark 8a and the connection conductors 2a, 2b, and 2c may not be arranged at the same position in the thickness direction (Z direction) of the connection conductor 2. When the connection conductors 2a, 2b, and 2c are projected in parallel to the arrangement direction (Y direction) of the connection conductors 2a to 2c from the gate mark 8a side as indicated by an arrow L, the connection conductors 2a, 2b, 2c is partly a gate mark 8a, be arranged within the projection area S _L shown by a dotted line, it is possible to obtain the effect of suppressing the deformation of the connection conductor 2a~2c by load during molding sufficient it can.

上記各実施形態において、接続用導体２の配列方向（Ｙ方向）において、ゲート痕８ａが形成された樹脂部１１の一側面１１ａに最も近い接続用導体２ａにのみ変形抑制部１４を設けた構造として例示した。しかし、接続用導体２の数が多数の場合や、接続用導体２のピッチが小さい場合等においては、ゲート痕８ａが形成された樹脂部１１の一側面１１ａに最も近い接続用導体２ａを含む、一側面１１ａ側寄りの複数の接続用導体２に変形抑制部１４を設けるようにしてもよい。但し、すべての接続用導体２に変形抑制部１４を設けると、樹脂成形体１００の接続用導体２の配列方向（Ｙ方向）のサイズが大きくなるので、一部の接続用導体２のみに変形抑制部１４を設けるようにすることが好ましい。 In each of the embodiments described above, in the arrangement direction (Y direction) of the connection conductors 2, a structure in which the deformation suppressing portion 14 is provided only on the connection conductor 2 a closest to the one side surface 11 a of the resin portion 11 where the gate mark 8 a is formed. As an example. However, when the number of connection conductors 2 is large, or when the pitch of the connection conductors 2 is small, the connection conductor 2a closest to the one side surface 11a of the resin portion 11 on which the gate mark 8a is formed is included. The deformation suppressing portions 14 may be provided on the plurality of connection conductors 2 near the one side surface 11a. However, if the deformation suppressing portions 14 are provided on all the connection conductors 2, the size of the connection conductors 2 of the resin molded body 100 in the arrangement direction (Y direction) increases, so that only a part of the connection conductors 2 are deformed. It is preferable to provide the suppression part 14.

上記各実施形態において、変形抑制部１４を、接続用導体２ａのタイバー３に連結される前方側にのみ設けた構造として例示した。しかし、変形抑制部１４を、接続用導体２の後方側である端子部５ａ側に設けるようにしてもよい。 In each said embodiment, the deformation | transformation suppression part 14 was illustrated as a structure provided only in the front side connected with the tie bar 3 of the connection conductor 2a. However, you may make it provide the deformation | transformation suppression part 14 in the terminal part 5a side which is the back side of the conductor 2 for a connection.

接続用導体２の形状は、直線やＬ字形状以外の形状、例えば、湾曲部や、傾斜部を有する形状、つづら折り状に折畳まれた形状とすることができる。また、接続用導体２は、全体が同一の幅ではなく、一端部側と他端部側の幅が異なるものであってもよい。 The shape of the connecting conductor 2 can be a shape other than a straight line or an L-shape, for example, a curved portion, a shape having an inclined portion, or a shape folded in a zigzag shape. Further, the connecting conductor 2 may not have the same width as a whole, but may have different widths on one end side and the other end side.

上記では、種々の実施の形態および変形例を説明したが、本発明はこれらの内容に限定されるものではない。以上要するに本発明の樹脂成形体は、互いに離間して並置された複数の接続用導体と、接続用導体それぞれの少なくとも一端部を露出した状態で複数の接続用導体を覆う樹脂部とを有し、複数の接続用導体と樹脂部とはモールド成形による一体構造であり、複数の接続用導体の配列方向の樹脂部の一側面には、樹脂充填によるゲート痕が形成されており、複数の接続用導体は、それぞれがゲート痕に向かう方向に並置され、ゲート痕と対峙する接続用導体には、当該接続用導体の一端部側が樹脂部に埋設される箇所に変形抑制部が設けられ、変形抑制部が形成される接続用導体は、ゲート痕に最も近い接続用導体を含み、変形抑制部の断面積は、前記接続用導体の他の箇所の断面積よりも大きくされている。
このような樹脂成形体によるモールド成形では、変形抑制部は金型で固定されている。金型のゲートから充填される樹脂は、ゲートと対峙する接続用導体に衝突し、接続用導体には曲げモーメントが働く。接続用導体の全長領域で曲げモーメントが発生し、この変形抑制部には大きな曲げモーメントが発生する。しかし、変形抑制部は金型で固定されており、発生する曲げモーメントによる変形量は許容値以下になる。変形抑制部が形成されない従来構造では、同様な曲げモーメントに対して大きく変形する。
本発明の技術的思想の範囲内で考えられるその他の態様も本発明の範囲内に含まれる。 Although various embodiments and modifications have been described above, the present invention is not limited to these contents. In short, the resin molded body of the present invention has a plurality of connecting conductors arranged side by side apart from each other, and a resin portion that covers the plurality of connecting conductors in a state where at least one end of each of the connecting conductors is exposed. The plurality of connecting conductors and the resin portion are integrally formed by molding, and one side surface of the resin portion in the arrangement direction of the plurality of connecting conductors is formed with a resin-filled gate mark, and the plurality of connecting conductors The conductors are juxtaposed in the direction toward the gate trace, and the connection conductor facing the gate trace is provided with a deformation suppressing portion at a position where one end of the connection conductor is embedded in the resin portion. The connection conductor in which the suppression portion is formed includes the connection conductor closest to the gate mark, and the cross-sectional area of the deformation suppression portion is larger than the cross-sectional area of other portions of the connection conductor.
In mold molding using such a resin molded body, the deformation suppressing portion is fixed by a mold. The resin filled from the mold gate collides with the connecting conductor facing the gate, and a bending moment acts on the connecting conductor. A bending moment is generated in the entire length region of the connecting conductor, and a large bending moment is generated in the deformation suppressing portion. However, the deformation suppressing portion is fixed by a mold, and the amount of deformation due to the generated bending moment is less than the allowable value. In the conventional structure in which the deformation suppressing portion is not formed, the deformation is greatly deformed with respect to the same bending moment.
Other embodiments conceivable within the scope of the technical idea of the present invention are also included in the scope of the present invention.

２、２ａ、２ｂ、２ｃ、２ｒ接続用導体
５ａ、５ｂ、５ｃ端子部（他端部）
８ａゲート痕
１１樹脂部
１１ａ一側面
１１ｂ一端面（一端部）
１４、１４Ａ、１４Ｂ変形抑制部
１５屈曲部
１００樹脂成形体
Ｓ_L 射影領域 2, 2a, 2b, 2c, 2r Connection conductor 5a, 5b, 5c Terminal (other end)
8a Gate mark 11 Resin portion 11a One side surface 11b One end surface (one end portion)
14, 14A, 14B Deformation suppressing portion 15 Bending portion 100 Resin molded body S _L projection area

Claims

A plurality of connecting conductors juxtaposed apart from each other;
A resin portion covering the plurality of connection conductors in a state where at least one end of each of the connection conductors is exposed;
The plurality of connecting conductors and the resin portion are integrally structured by molding,
On one side surface of the resin portion in the arrangement direction of the plurality of connection conductors, a gate mark due to resin filling is formed,
The plurality of connecting conductors are juxtaposed in a direction toward the gate mark,
The connection conductor facing the gate mark is provided with a deformation suppressing portion at a position where one end portion of the connecting conductor is embedded in the resin portion, and the connection conductor in which the deformation suppressing portion is formed is , Including a connecting conductor closest to the gate mark,
The cross-sectional area of the said deformation | transformation suppression part is a resin molded object made larger than the cross-sectional area of the other location of the said conductor for a connection.

In the resin molded product according to claim 1,
The deformation suppressing portion is a resin molded body having a protruding portion protruding in the arrangement direction of the connection conductors.

In the resin molded product according to claim 2,
The protruding portion is a resin molded body protruding toward the one side surface on which the gate mark is formed.

In the resin molding as described in any one of Claims 1 thru | or 3,
The said deformation | transformation suppression part is a resin molding which has a protrusion part which protrudes in the thickness direction of the said connection conductor.

In the resin molded product according to claim 1,
Each of the plurality of connection conductors has the other end exposed from the resin portion, and the pitch on the base side of the one end exposed from the resin portion of the plurality of connection conductors is the connection conductor. A resin molded body having a pitch smaller than the pitch on the base side of the other end portion exposed from the resin portion.

In the resin molding as described in any one of Claims 1 thru | or 5,
A plurality of the connection conductors, when projected in parallel to the arrangement direction of the plurality of connection conductors from the gate trace side, at least a part thereof is disposed in the projected area of the gate trace. .

In the resin molded product according to claim 1,
The plurality of connecting conductors are juxtaposed on one plane, and the gate trace is a resin molded body formed at a position where the plane crosses the one side surface.