JPS5869954U - semiconductor equipment - Google Patents
semiconductor equipmentInfo
- Publication number
- JPS5869954U JPS5869954U JP1981164625U JP16462581U JPS5869954U JP S5869954 U JPS5869954 U JP S5869954U JP 1981164625 U JP1981164625 U JP 1981164625U JP 16462581 U JP16462581 U JP 16462581U JP S5869954 U JPS5869954 U JP S5869954U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor equipment
- semiconductor device
- container
- abstract
- lead wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本考案に係る従来の半導体装置用パッケージの
断面図を示す。第２図は本考案の一実施例を示す半導体
装置用パッケージの断面図、第３図は第２図の半導体装
置用パッケージの底面図を示す。
１・・・・・・ペレット、２・・・・・・アイランド、
３・・・・・・リード線、４・・・・・・パッケージ基
体。FIG. 1 shows a sectional view of a conventional package for a semiconductor device according to the present invention. FIG. 2 is a sectional view of a semiconductor device package showing an embodiment of the present invention, and FIG. 3 is a bottom view of the semiconductor device package of FIG. 2. 1...Pellet, 2...Island,
3...Lead wire, 4...Package base.
Claims (1)
先端部分が位置するように該容器内で成形されたリード
線を有してなる半導体装置。゛A semiconductor device having a lead wire formed within a container so that its tip portion is located on substantially the same plane as the bottom surface of the container for sealing the semiconductor device.゛
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981164625U JPS5869954U (en) | 1981-11-04 | 1981-11-04 | semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981164625U JPS5869954U (en) | 1981-11-04 | 1981-11-04 | semiconductor equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5869954U true JPS5869954U (en) | 1983-05-12 |
Family
ID=29956856
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1981164625U Pending JPS5869954U (en) | 1981-11-04 | 1981-11-04 | semiconductor equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5869954U (en) |
-
1981
- 1981-11-04 JP JP1981164625U patent/JPS5869954U/en active Pending
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