JPS6242276U - - Google Patents
Info
- Publication number
- JPS6242276U JPS6242276U JP13454385U JP13454385U JPS6242276U JP S6242276 U JPS6242276 U JP S6242276U JP 13454385 U JP13454385 U JP 13454385U JP 13454385 U JP13454385 U JP 13454385U JP S6242276 U JPS6242276 U JP S6242276U
- Authority
- JP
- Japan
- Prior art keywords
- ceramic plate
- circuit board
- pattern
- rectangular protrusions
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
第１図はこの考案の一実施例を示す斜視図、第
２図は第１図に示したものをプリント基板へ垂直
に立てて実装した状態を示す断面図、第３図は従
来の混成集積回路基板の一例を示す斜視図、第４
図は第３図に示したものをプリント基板へ垂直に
立てて実装した状態を示す断面図である。
図において１はセラミツク板、２は回路パター
ン、３はパターン電極、４はクリツプ付リード、
５は半田、６はプリント基板、７はスルーホール
、８は方形突片、９は端子パターン、１０は取付
孔、１１はランドパターンである。なお、各図中
同一符号は同一または相当部分を示す。
Figure 1 is a perspective view showing an embodiment of this invention, Figure 2 is a sectional view showing the device shown in Figure 1 mounted vertically on a printed circuit board, and Figure 3 is a conventional hybrid integrated circuit. A fourth perspective view showing an example of a circuit board.
This figure is a sectional view showing the state shown in FIG. 3 mounted vertically on a printed circuit board. In the figure, 1 is a ceramic board, 2 is a circuit pattern, 3 is a pattern electrode, 4 is a lead with a clip,
5 is solder, 6 is a printed circuit board, 7 is a through hole, 8 is a rectangular protrusion, 9 is a terminal pattern, 10 is a mounting hole, and 11 is a land pattern. Note that the same reference numerals in each figure indicate the same or corresponding parts.
Claims (1)
形突片を有するセラミツク板、このセラミツク板
の２つの板面に、前記方形突片部も含めてパター
ンが形成されていることを特徴とする混成集積回
路基板。 A ceramic plate having a plurality of rectangular protrusions arranged at predetermined intervals on one side, and a pattern is formed on two surfaces of the ceramic plate, including the rectangular protrusions. hybrid integrated circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13454385U JPS6242276U (en) | 1985-09-03 | 1985-09-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13454385U JPS6242276U (en) | 1985-09-03 | 1985-09-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6242276U true JPS6242276U (en) | 1987-03-13 |
Family
ID=31035879
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13454385U Pending JPS6242276U (en) | 1985-09-03 | 1985-09-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6242276U (en) |
-
1985
- 1985-09-03 JP JP13454385U patent/JPS6242276U/ja active Pending
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