JPH01115273U - - Google Patents
Info
- Publication number
- JPH01115273U JPH01115273U JP903988U JP903988U JPH01115273U JP H01115273 U JPH01115273 U JP H01115273U JP 903988 U JP903988 U JP 903988U JP 903988 U JP903988 U JP 903988U JP H01115273 U JPH01115273 U JP H01115273U
- Authority
- JP
- Japan
- Prior art keywords
- metal
- plating
- insulating layer
- layer
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 8
- 238000007747 plating Methods 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 4
- 239000003054 catalyst Substances 0.000 claims 1
- 239000007769 metal material Substances 0.000 claims 1
- 229910052755 nonmetal Inorganic materials 0.000 claims 1
- 238000007796 conventional method Methods 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Description
第１図ないし第３図は、この考案の好適な実施
例を示した図面であり、第１図は金属導電層の鍍
着を行つたメツキ回路基板の断面図である。第２
図は、絶縁層の被着を行つた金属基板の断面図で
ある。第３図は、メツキレジスト層の印刷を行つ
た絶縁層を有した金属基板の断面図である。第４
図は従来の技術を示した回路基板の断面図である
。第５図は従来の技術に於ける各素子の斜視図で
ある。
１……メツキ回路基板、２……金属基板、３…
…絶縁層、４……メツキレジスト層、５……金属
導電層。
1 to 3 are drawings showing a preferred embodiment of this invention, and FIG. 1 is a sectional view of a plated circuit board on which a metal conductive layer is plated. Second
The figure is a cross-sectional view of a metal substrate on which an insulating layer has been deposited. FIG. 3 is a cross-sectional view of a metal substrate having an insulating layer printed with a plating resist layer. Fourth
The figure is a sectional view of a circuit board showing a conventional technique. FIG. 5 is a perspective view of each element in the conventional technology. 1...Metallic circuit board, 2...Metal board, 3...
...insulating layer, 4...metallic resist layer, 5...metal conductive layer.
Claims (1)
いて、金属、非金属材料で形成した基板と、該基
板上に被着しかつ金属メツキ用触媒を含有する絶
縁層と、該絶縁層上に印刷されたメツキレジスト
層と、前記絶縁層の露出部に鍍着された金属導電
層とを有することを特徴とするメツキ回路基板。 A circuit board on which a conductive path is formed by plating includes a substrate made of a metal or non-metal material, an insulating layer deposited on the substrate and containing a catalyst for metal plating, and a layer formed on the insulating layer. A plating circuit board comprising a printed plating resist layer and a metal conductive layer plated on the exposed portion of the insulating layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP903988U JPH01115273U (en) | 1988-01-27 | 1988-01-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP903988U JPH01115273U (en) | 1988-01-27 | 1988-01-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01115273U true JPH01115273U (en) | 1989-08-03 |
Family
ID=31215441
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP903988U Pending JPH01115273U (en) | 1988-01-27 | 1988-01-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01115273U (en) |
-
1988
- 1988-01-27 JP JP903988U patent/JPH01115273U/ja active Pending
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